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Indian Journal of Materials Science最新文献

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Stress and Strain Analysis of Functionally Graded Rectangular Plate with Exponentially Varying Properties 指数变化功能梯度矩形板的应力应变分析
Pub Date : 2013-08-18 DOI: 10.1155/2013/206239
A. Hadi, A. Rastgoo, A. Daneshmehr, F. Ehsani
The bending of rectangular plate made of functionally graded material (FGM) is investigated by using three-dimensional elasticity theory. The governing equations obtained here are solved with static analysis considering the types of plates, which properties varying exponentially along direction. The value of Poisson’s ratio has been taken as a constant. The influence of different functionally graded variation on the stress and displacement fields was studied through a numerical example. The exact solution shows that the graded material properties have significant effects on the mechanical behavior of the plate.
用三维弹性理论研究了功能梯度材料矩形板的弯曲问题。考虑板的性质沿方向呈指数变化,用静力分析方法求解了控制方程。泊松比的值取为常数。通过数值算例研究了不同功能梯度变化对应力场和位移场的影响。精确解表明,梯度材料性能对板的力学行为有显著影响。
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引用次数: 16
Effect of Heating Mode and Copper Content on the Densification of W-Cu Alloys 加热方式和铜含量对W-Cu合金致密化的影响
Pub Date : 2013-08-12 DOI: 10.1155/2013/603791
A. Mondal, A. Upadhyaya, D. Agrawal
This study investigates the effect of heating mode on the sintering of tungsten-copper alloys containing up to 30 wt.% Cu. The sinterability of the W-Cu system consolidated in a 2.45 GHz multimode microwave furnace has been critically compared with that processed in a radiatively heated (conventional) furnace. The as-pressed W-Cu alloys can be readily sintered in microwave furnace with substantial (sixfold) reduction in the processing time. As compared to conventional sintering, microwave processing results in greater densification, more homogenous distribution of the binder phase, and smaller tungsten grain size. The densification in compacts increases with increasing Cu content. For all compositions, the electrical conductivity and hardness of microwave sintered W-Cu alloys are higher than those of their conventionally sintered counterparts. This study investigates the effect of heating mode on the sintering of tungsten-copper alloys containing up to 30 wt.% Cu. The W-Cu alloys were sintered in a 2.45 GHz microwave furnace with substantial (sixfold) reduction in the processing time. As compared to conventional sintering, microwave processing results in greater densification, more homogenous distribution of the binder phase, and smaller tungsten grain size. This results in higher electrical conductivity and hardness of the microwave sintered W-Cu alloys.
本文研究了加热方式对含铜量高达30wt .%的钨铜合金烧结的影响。对在2.45 GHz多模微波炉中固化的W-Cu体系的烧结性能与在辐射加热(传统)炉中处理的烧结性能进行了严格的比较。压制后的W-Cu合金可以很容易地在微波炉中烧结,加工时间大大缩短(六倍)。与传统烧结相比,微波烧结致密化程度更高,结合剂相分布更均匀,钨晶粒尺寸更小。随着Cu含量的增加,压坯的致密性增强。微波烧结W-Cu合金的电导率和硬度均高于常规烧结W-Cu合金。本文研究了加热方式对含铜量高达30wt .%的钨铜合金烧结的影响。钨铜合金在2.45 GHz微波炉中烧结,加工时间大幅缩短(6倍)。与传统烧结相比,微波烧结致密化程度更高,结合剂相分布更均匀,钨晶粒尺寸更小。这使得微波烧结W-Cu合金具有较高的导电性和硬度。
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引用次数: 18
期刊
Indian Journal of Materials Science
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