Pub Date : 2017-05-01DOI: 10.1109/ISPCE.2017.7935011
M. Mehlman, D. Rolfe, S. Panzer, L. Berla, M. Costley, E. Lau
Various readily available powdered materials were examined in order to determine their usefulness for removal of common electrical potting materials via microabrasive media blasting. Each blasting media was tested against five different potting materials, and was additionally characterized in terms of mechanical and triboelectric properties. Additional work has been cited that lends credence to the empirical observations found herein. In summary, of the materials tested, only baker's sugar appears to be a suitable candidate for removal of the tested potting materials on sensitive electrical printed circuit board assemblies.
{"title":"Evaluation of blasting media suitability for removal of common electronics potting compounds","authors":"M. Mehlman, D. Rolfe, S. Panzer, L. Berla, M. Costley, E. Lau","doi":"10.1109/ISPCE.2017.7935011","DOIUrl":"https://doi.org/10.1109/ISPCE.2017.7935011","url":null,"abstract":"Various readily available powdered materials were examined in order to determine their usefulness for removal of common electrical potting materials via microabrasive media blasting. Each blasting media was tested against five different potting materials, and was additionally characterized in terms of mechanical and triboelectric properties. Additional work has been cited that lends credence to the empirical observations found herein. In summary, of the materials tested, only baker's sugar appears to be a suitable candidate for removal of the tested potting materials on sensitive electrical printed circuit board assemblies.","PeriodicalId":211888,"journal":{"name":"2017 IEEE Symposium on Product Compliance Engineering (ISPCE)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116003386","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：