Pub Date : 1988-05-11DOI: 10.1109/ITHERM.1988.28674
T. D. Pestorius, V. Gregory, A. Kraus
A comparison is made of two different microcircuit package configurations, a traditional ceramic and kovar steel package is compared to ultrathin polyimide/polyetherimide which is cast directly on a copper foil and laminated to an aluminum plate. The comparison is in the form of a thermal analysis. It shows that the aluminum plate with the thin dielectric is superior from a thermal management standpoint. It is expected that this combination will also provide cost and weight advantages over the more traditional materials as well.<>
{"title":"Thermal advantages of a new microcircuit configuration","authors":"T. D. Pestorius, V. Gregory, A. Kraus","doi":"10.1109/ITHERM.1988.28674","DOIUrl":"https://doi.org/10.1109/ITHERM.1988.28674","url":null,"abstract":"A comparison is made of two different microcircuit package configurations, a traditional ceramic and kovar steel package is compared to ultrathin polyimide/polyetherimide which is cast directly on a copper foil and laminated to an aluminum plate. The comparison is in the form of a thermal analysis. It shows that the aluminum plate with the thin dielectric is superior from a thermal management standpoint. It is expected that this combination will also provide cost and weight advantages over the more traditional materials as well.<<ETX>>","PeriodicalId":226424,"journal":{"name":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","volume":"81 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127454130","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1988-05-11DOI: 10.1109/ITHERM.1988.28680
B. Mirman
A mathematical model simulating a plated-through-hole (PTH) structure under a thermal load is proposed to predict its reliability. The PTH structure is treated as a system of hollow disks joined to a barrel. Under the load, the disks respond with bending and the barrel undergoes tension or compression. Simple formulas for estimation of some parameters correlating with failures are presented.<>
{"title":"Mathematical model of a plated-through-hole structure under a load induced by thermal mismatch","authors":"B. Mirman","doi":"10.1109/ITHERM.1988.28680","DOIUrl":"https://doi.org/10.1109/ITHERM.1988.28680","url":null,"abstract":"A mathematical model simulating a plated-through-hole (PTH) structure under a thermal load is proposed to predict its reliability. The PTH structure is treated as a system of hollow disks joined to a barrel. Under the load, the disks respond with bending and the barrel undergoes tension or compression. Simple formulas for estimation of some parameters correlating with failures are presented.<<ETX>>","PeriodicalId":226424,"journal":{"name":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125544806","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1988-05-11DOI: 10.1109/ITHERM.1988.28696
M. Arnal, D. Goering, J. Humphrey
Results of a numerical study concerning two-dimensional time-dependent laminar flow near a square bluff body are reported. The configuration investigated is that of flow around a square block in contact with a moving wall, with fluid approaching the block parallel to the wall and at the wall speed. This geometry provides a two-dimensional model for the flow near a magnetic head-arm assembly flying over a rotating disk. Numerical calculations were also made for the case of flow past a square block adjacent to a fixed wall. The Reynolds numbers investigated ranged from 100 to 1000. Comparisons between the two calculated cases show that a moving wall exerts a significant destabilizing effect on the recirculation region behind a block, leading to a lower Reynolds number for the onset of flow unsteadiness. The vortex shedding phenomenon has been characterized in terms of the Strouhal number, and plots of Strouhal number versus Reynolds number are presented for the moving wall and fixed wall cases. Plots of the Nusselt number variation with time and Reynolds number are also presented.<>
{"title":"Unsteady heat transfer near a bluff body in contact with a moving wall","authors":"M. Arnal, D. Goering, J. Humphrey","doi":"10.1109/ITHERM.1988.28696","DOIUrl":"https://doi.org/10.1109/ITHERM.1988.28696","url":null,"abstract":"Results of a numerical study concerning two-dimensional time-dependent laminar flow near a square bluff body are reported. The configuration investigated is that of flow around a square block in contact with a moving wall, with fluid approaching the block parallel to the wall and at the wall speed. This geometry provides a two-dimensional model for the flow near a magnetic head-arm assembly flying over a rotating disk. Numerical calculations were also made for the case of flow past a square block adjacent to a fixed wall. The Reynolds numbers investigated ranged from 100 to 1000. Comparisons between the two calculated cases show that a moving wall exerts a significant destabilizing effect on the recirculation region behind a block, leading to a lower Reynolds number for the onset of flow unsteadiness. The vortex shedding phenomenon has been characterized in terms of the Strouhal number, and plots of Strouhal number versus Reynolds number are presented for the moving wall and fixed wall cases. Plots of the Nusselt number variation with time and Reynolds number are also presented.<<ETX>>","PeriodicalId":226424,"journal":{"name":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125900391","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1988-05-11DOI: 10.1109/ITHERM.1988.28676
P. Bujard
Castable particulate-filled epoxy resins exhibiting excellent thermal conductivity have been prepared using hexagonal boron nitride (BN) as filter. The thermal conductivity of BN filled epoxies is influenced by the sample preparation procedures, due to agglomeration effects of the particles in the matrix. The temperature dependence of the thermal conductivity of resins is measured as a function of the volume content of filler. The thermal conductivity in percolative systems depends in a complex way on the filler concentration and on the temperature. The mechanisms leading to the observed behavior are discussed.<>
{"title":"Thermal conductivity of boron nitride filled epoxy resins: temperature dependence and influence of sample preparation","authors":"P. Bujard","doi":"10.1109/ITHERM.1988.28676","DOIUrl":"https://doi.org/10.1109/ITHERM.1988.28676","url":null,"abstract":"Castable particulate-filled epoxy resins exhibiting excellent thermal conductivity have been prepared using hexagonal boron nitride (BN) as filter. The thermal conductivity of BN filled epoxies is influenced by the sample preparation procedures, due to agglomeration effects of the particles in the matrix. The temperature dependence of the thermal conductivity of resins is measured as a function of the volume content of filler. The thermal conductivity in percolative systems depends in a complex way on the filler concentration and on the temperature. The mechanisms leading to the observed behavior are discussed.<<ETX>>","PeriodicalId":226424,"journal":{"name":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121660284","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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