Pub Date : 2017-06-01DOI: 10.1109/OIC.2017.7965526
László Szilágyi, Guido Belfiore, R. Henker, F. Ellinger
A common-cathode VCSEL driver implemented in 28-nm digital CMOS, assembled with a commercial VCSEL is presented. Electro-optical measurements show 30-Gbit/s operation with 1.7-pJ/bit from 2.9-V supply. When operated at 15-Gbit/s the power can be reduced while maintaining the modulation amplitude. Power/datarate tunability is demonstrated.
{"title":"30 Gbit/s 1.7 pJ/bit common-cathode tunable 850-nm-VCSEL driver in 28 nm digital CMOS","authors":"László Szilágyi, Guido Belfiore, R. Henker, F. Ellinger","doi":"10.1109/OIC.2017.7965526","DOIUrl":"https://doi.org/10.1109/OIC.2017.7965526","url":null,"abstract":"A common-cathode VCSEL driver implemented in 28-nm digital CMOS, assembled with a commercial VCSEL is presented. Electro-optical measurements show 30-Gbit/s operation with 1.7-pJ/bit from 2.9-V supply. When operated at 15-Gbit/s the power can be reduced while maintaining the modulation amplitude. Power/datarate tunability is demonstrated.","PeriodicalId":250255,"journal":{"name":"2017 IEEE Optical Interconnects Conference (OI)","volume":"135 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124222151","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-06-01DOI: 10.1109/OIC.2017.7965509
F. Coppinger, David Langsam, Adam Page, M. Verdiell
As signal speed increases, flyover technology (with either optical fiber or twinax copper cable being used as the flyover material) is becoming a critical tool that simplifies the design of high speed boards. The technology significantly reduces the complexity of layout, avoids the high loss of the board high speed traces, and simplifies the requirements on the board material[1].
{"title":"The benefit of mid-board optic and other flyover technology","authors":"F. Coppinger, David Langsam, Adam Page, M. Verdiell","doi":"10.1109/OIC.2017.7965509","DOIUrl":"https://doi.org/10.1109/OIC.2017.7965509","url":null,"abstract":"As signal speed increases, flyover technology (with either optical fiber or twinax copper cable being used as the flyover material) is becoming a critical tool that simplifies the design of high speed boards. The technology significantly reduces the complexity of layout, avoids the high loss of the board high speed traces, and simplifies the requirements on the board material[1].","PeriodicalId":250255,"journal":{"name":"2017 IEEE Optical Interconnects Conference (OI)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129877295","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-06-01DOI: 10.1109/OIC.2017.7965527
A. Larsson, J. Gustavsson, E. Haglund, E. Haglund, T. Lengyel, E. Simpanen, M. Jahed
The short-reach optical interconnects used in datacenters and high-performance computing systems are dominated by VCSEL and multimode fiber (MMF) links1. The VCSEL-MMF technology is the most cost and power efficient and offers the smallest footprint. VCSELs operating at 25–28 Gbit/s are in production2 while research has extended the VCSEL modulation bandwidth to 30 GHz3 (Fig.1) and enabled OOK-NRZ data transmission up to 57 Gbit/s at 25°C4 and 50 Gbit/s at 85°C5, without equalization or forward-error-correction (FEC). A VCSEL energy dissipation below 100 fJ/bit has been demonstrated at 25–50 Gbit/s3 (Fig.1). The need for higher interconnect capacity raises the question whether the speed and dynamics of VCSELs can be further improved or whether physical limits preventing this have been reached. Higher speed VCSELs would enable higher lane rates and therefore reduced number of lanes and increased bandwidth density for a given aggregate interconnect capacity.
{"title":"VCSEL modulation capacity: Continued improvements or physical limits?","authors":"A. Larsson, J. Gustavsson, E. Haglund, E. Haglund, T. Lengyel, E. Simpanen, M. Jahed","doi":"10.1109/OIC.2017.7965527","DOIUrl":"https://doi.org/10.1109/OIC.2017.7965527","url":null,"abstract":"The short-reach optical interconnects used in datacenters and high-performance computing systems are dominated by VCSEL and multimode fiber (MMF) links1. The VCSEL-MMF technology is the most cost and power efficient and offers the smallest footprint. VCSELs operating at 25–28 Gbit/s are in production2 while research has extended the VCSEL modulation bandwidth to 30 GHz3 (Fig.1) and enabled OOK-NRZ data transmission up to 57 Gbit/s at 25°C4 and 50 Gbit/s at 85°C5, without equalization or forward-error-correction (FEC). A VCSEL energy dissipation below 100 fJ/bit has been demonstrated at 25–50 Gbit/s3 (Fig.1). The need for higher interconnect capacity raises the question whether the speed and dynamics of VCSELs can be further improved or whether physical limits preventing this have been reached. Higher speed VCSELs would enable higher lane rates and therefore reduced number of lanes and increased bandwidth density for a given aggregate interconnect capacity.","PeriodicalId":250255,"journal":{"name":"2017 IEEE Optical Interconnects Conference (OI)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127689804","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-06-01DOI: 10.1109/OIC.2017.7965523
Fan Yang, Wenjia Zhang, Zuyuan He
A 48-Gb/s software defined optical transceiver based on the multi-tone PAM/CAP signalling is proposed and experimentally demonstrated over 10-km SSMF. BER below 7% FEC threshold is achieved with equalization, which is better than direct PAM4 transmission. OCIS codes: (060.4510) Optical communications; (200.4650) Optical interconnects.
{"title":"A 48-Gb/s software defined optical transceiver using multi-tone PAM/CAP modulation","authors":"Fan Yang, Wenjia Zhang, Zuyuan He","doi":"10.1109/OIC.2017.7965523","DOIUrl":"https://doi.org/10.1109/OIC.2017.7965523","url":null,"abstract":"A 48-Gb/s software defined optical transceiver based on the multi-tone PAM/CAP signalling is proposed and experimentally demonstrated over 10-km SSMF. BER below 7% FEC threshold is achieved with equalization, which is better than direct PAM4 transmission. OCIS codes: (060.4510) Optical communications; (200.4650) Optical interconnects.","PeriodicalId":250255,"journal":{"name":"2017 IEEE Optical Interconnects Conference (OI)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131551436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-06-01DOI: 10.1109/OIC.2017.7965510
D. Miller
Energy in short interconnects inside machines dominates scaling of information processing and communication. Low-energy integrated optoelectronics can eliminate much energy in links themselves and, with space-multiplexing in 2D arrays, could eliminate link circuit energies, allowing 10–100fJ/bit for all links from 1cm to 10m.
{"title":"Attojoule optoelectronics-saving more energy with optics","authors":"D. Miller","doi":"10.1109/OIC.2017.7965510","DOIUrl":"https://doi.org/10.1109/OIC.2017.7965510","url":null,"abstract":"Energy in short interconnects inside machines dominates scaling of information processing and communication. Low-energy integrated optoelectronics can eliminate much energy in links themselves and, with space-multiplexing in 2D arrays, could eliminate link circuit energies, allowing 10–100fJ/bit for all links from 1cm to 10m.","PeriodicalId":250255,"journal":{"name":"2017 IEEE Optical Interconnects Conference (OI)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121578005","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-06-01DOI: 10.1109/OIC.2017.7965512
Marvin Henniges, S. Meister, H. Rhee, C. Theiss, H. Robers, M. Grehn, D. Stolarek, L. Zimmermann, U. Woggon
A zone plate, etched into the backend of a silicon-on-insulator chip, was designed to improve the optical coupling efficiency between grating couplers and non-perpendicular light sources with an elliptical beam profile. Measurements of a highly divergent light source showed efficiency improvements up to 8.7dB.
{"title":"Integrated fresnel zone plate in the SOI backend for improved laser to chip coupling efficiency","authors":"Marvin Henniges, S. Meister, H. Rhee, C. Theiss, H. Robers, M. Grehn, D. Stolarek, L. Zimmermann, U. Woggon","doi":"10.1109/OIC.2017.7965512","DOIUrl":"https://doi.org/10.1109/OIC.2017.7965512","url":null,"abstract":"A zone plate, etched into the backend of a silicon-on-insulator chip, was designed to improve the optical coupling efficiency between grating couplers and non-perpendicular light sources with an elliptical beam profile. Measurements of a highly divergent light source showed efficiency improvements up to 8.7dB.","PeriodicalId":250255,"journal":{"name":"2017 IEEE Optical Interconnects Conference (OI)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129610239","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-06-01DOI: 10.1109/OIC.2017.7965506
Nicholas A. Boynton, A. Pomerene, A. Starbuck, A. Lentine, C. DeRose
We present a quantitative analysis of the correlation of resonant wavelength variation with process variables, and find that 50% of the resonant wavelength variation for microrings is due to systematic process conditions. We also discuss the improvement of device uniformity by mitigating these systematic variations.
{"title":"Characterization of systematic process variation in a silicon photonic platform","authors":"Nicholas A. Boynton, A. Pomerene, A. Starbuck, A. Lentine, C. DeRose","doi":"10.1109/OIC.2017.7965506","DOIUrl":"https://doi.org/10.1109/OIC.2017.7965506","url":null,"abstract":"We present a quantitative analysis of the correlation of resonant wavelength variation with process variables, and find that 50% of the resonant wavelength variation for microrings is due to systematic process conditions. We also discuss the improvement of device uniformity by mitigating these systematic variations.","PeriodicalId":250255,"journal":{"name":"2017 IEEE Optical Interconnects Conference (OI)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125630073","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-06-01DOI: 10.1109/OIC.2017.7965513
A. Tait, T. Ferreira de Lima, M. Chang, M. Nahmias, B. Shastri, P. Prucnal
Photonic weight banks employing multivariate statistical techniques could extend performance limits of multiantenna radio systems. We characterize the aggregate bandwidth penalty imposed by a silicon microring weight bank and assess application regimes for multivariate RF photonics.
{"title":"Application regime and distortion metric for multivariate RF photonics","authors":"A. Tait, T. Ferreira de Lima, M. Chang, M. Nahmias, B. Shastri, P. Prucnal","doi":"10.1109/OIC.2017.7965513","DOIUrl":"https://doi.org/10.1109/OIC.2017.7965513","url":null,"abstract":"Photonic weight banks employing multivariate statistical techniques could extend performance limits of multiantenna radio systems. We characterize the aggregate bandwidth penalty imposed by a silicon microring weight bank and assess application regimes for multivariate RF photonics.","PeriodicalId":250255,"journal":{"name":"2017 IEEE Optical Interconnects Conference (OI)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131448240","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-06-01DOI: 10.1109/OIC.2017.7965502
N. Abrams, M. Bahadori, C. Phare, M. Lipson, K. Bergman
The intermodulation crosstalk of graphene modulators integrated on silicon nitride is experimentally characterized for the first time on 1 Gb/s signals. We show that 25 GHz channel spacings are supported with < 0.1 dB penalty for DWDM applications.
{"title":"Intermodulation crosstalk of graphene-enabled electro-optic microring modulators for DWDM interconnects","authors":"N. Abrams, M. Bahadori, C. Phare, M. Lipson, K. Bergman","doi":"10.1109/OIC.2017.7965502","DOIUrl":"https://doi.org/10.1109/OIC.2017.7965502","url":null,"abstract":"The intermodulation crosstalk of graphene modulators integrated on silicon nitride is experimentally characterized for the first time on 1 Gb/s signals. We show that 25 GHz channel spacings are supported with < 0.1 dB penalty for DWDM applications.","PeriodicalId":250255,"journal":{"name":"2017 IEEE Optical Interconnects Conference (OI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129288328","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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