Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233845
P. S. Nasirabadi, J. Hattel
Thermal management is a serious concern in electronic industry. It is important to understand the effects of ambient conditions on cooling of electronics. In this work, the effect of ambient conditions on the thermophysical properties of humid air is estimated in five cities (Copenhagen, Mashhad, Singapore, Las Vegas and Jakarta). Thereafter, the Nu number is calculated for cooling of an isothermal surface in horizontal and vertical orientations. Comparing the results, shows that Pr number is very slightly affected by ambient conditions; however, Gr is following the temperature changes. Among the investigated cities Singapore and Jakarta, the cities with the higher temperature and moisture concentration had the lowest heat transfer coefficients.
{"title":"A numerical investigation of the effect of ambient conditions on natural convection cooling of electronics","authors":"P. S. Nasirabadi, J. Hattel","doi":"10.1109/THERMINIC.2017.8233845","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233845","url":null,"abstract":"Thermal management is a serious concern in electronic industry. It is important to understand the effects of ambient conditions on cooling of electronics. In this work, the effect of ambient conditions on the thermophysical properties of humid air is estimated in five cities (Copenhagen, Mashhad, Singapore, Las Vegas and Jakarta). Thereafter, the Nu number is calculated for cooling of an isothermal surface in horizontal and vertical orientations. Comparing the results, shows that Pr number is very slightly affected by ambient conditions; however, Gr is following the temperature changes. Among the investigated cities Singapore and Jakarta, the cities with the higher temperature and moisture concentration had the lowest heat transfer coefficients.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123868716","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233810
L. Codecasa, R. Bornoff, James Dyson, V. d’Alessandro, A. Magnani, N. Rinaldi
The inter-connection of MOR-based boundary condition independent compact thermal models of heat diffusion problems and detailed models of heat transfer problems is here shown not to be straightforward and to introduce numerical difficulties. In order to overcome this drawback, a novel definition of MOR-based boundary condition independent compact thermal models is provided, which makes their inter-connection, as straightforward as the inter-connection of Delphi-like compact thermal models. The resulting MOR-based boundary condition independent compact thermal models can be inter-connected to any detailed model of heat transfer problems and/or to any other MOR-based boundary condition independent compact thermal models, without limitations. The approach is verified analysing a Package on Package application.
{"title":"Connecting MOR-based boundary condition independent compact thermal models","authors":"L. Codecasa, R. Bornoff, James Dyson, V. d’Alessandro, A. Magnani, N. Rinaldi","doi":"10.1109/THERMINIC.2017.8233810","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233810","url":null,"abstract":"The inter-connection of MOR-based boundary condition independent compact thermal models of heat diffusion problems and detailed models of heat transfer problems is here shown not to be straightforward and to introduce numerical difficulties. In order to overcome this drawback, a novel definition of MOR-based boundary condition independent compact thermal models is provided, which makes their inter-connection, as straightforward as the inter-connection of Delphi-like compact thermal models. The resulting MOR-based boundary condition independent compact thermal models can be inter-connected to any detailed model of heat transfer problems and/or to any other MOR-based boundary condition independent compact thermal models, without limitations. The approach is verified analysing a Package on Package application.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125807457","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233848
D. Wargulski, M. A. Ras, D. May, B. Wunderle
Thermal simulations are a powerful tool for the development and design of new electronics to predict their thermal behaviour during operation. To obtain accurate thermal simulations the knowledge of thermal properties of all the materials integrated in electronic devices is essential. Most materials show a decrease of thermal conductivity and thermal diffusivity with increasing temperatures, which results in a continual worsening of heat dissipation in devices during operation. In this paper, we present the further development of our Ångström's method based measurement system TIMAwave™ to determine thermal diffusivities of solid materials at temperatures between 30 and 200 °C. To prove the functionality of our concept we demonstrate temperature-dependent thermal diffusivity measurements of silver, aluminium and steel, metallic samples with widely different thermal properties as well as measurements of pure and doped silicon, the most common material in electronics.
{"title":"“TIMAwave” an innovative test platform for thermal diffusivity measurements of solid materials at high temperature","authors":"D. Wargulski, M. A. Ras, D. May, B. Wunderle","doi":"10.1109/THERMINIC.2017.8233848","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233848","url":null,"abstract":"Thermal simulations are a powerful tool for the development and design of new electronics to predict their thermal behaviour during operation. To obtain accurate thermal simulations the knowledge of thermal properties of all the materials integrated in electronic devices is essential. Most materials show a decrease of thermal conductivity and thermal diffusivity with increasing temperatures, which results in a continual worsening of heat dissipation in devices during operation. In this paper, we present the further development of our Ångström's method based measurement system TIMAwave™ to determine thermal diffusivities of solid materials at temperatures between 30 and 200 °C. To prove the functionality of our concept we demonstrate temperature-dependent thermal diffusivity measurements of silver, aluminium and steel, metallic samples with widely different thermal properties as well as measurements of pure and doped silicon, the most common material in electronics.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122494624","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233816
J. Hegedüs, G. Hantos, A. Poppe
Light output performance of power LEDs is sensitive to the junction temperature and also changes with the elapsed lifetime of the device. A smart control to achieve constant light output of LED based products would be advantageous in many applications such as streetlighting, resulting e.g. in considerable power savings when forward current is reduced when ambient temperatures are lower. Also, continuous compensation of lumen depreciation during product lifetime would improve visual comfort. Both could be made while the aging phenomena of the device are slowing down. This paper introduces a new theory for LED lumen maintenance calculation and a case study with real life data is carried out to demonstrate the feasibility of the proposed method.
{"title":"Lifetime isoflux control of LED based light sources","authors":"J. Hegedüs, G. Hantos, A. Poppe","doi":"10.1109/THERMINIC.2017.8233816","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233816","url":null,"abstract":"Light output performance of power LEDs is sensitive to the junction temperature and also changes with the elapsed lifetime of the device. A smart control to achieve constant light output of LED based products would be advantageous in many applications such as streetlighting, resulting e.g. in considerable power savings when forward current is reduced when ambient temperatures are lower. Also, continuous compensation of lumen depreciation during product lifetime would improve visual comfort. Both could be made while the aging phenomena of the device are slowing down. This paper introduces a new theory for LED lumen maintenance calculation and a case study with real life data is carried out to demonstrate the feasibility of the proposed method.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114206203","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233820
H. Kristiansen, K. Redford, S. Helland, Erik Kalland, Nina H. H⊘glund, M. A. Ras, C. Grosse, B. Hay, L. Ramiandrisoa, G. Davée, S. Gomés, S. Pettersen
A novel and low silver content isotropic conductive adhesive (ICA) has been developed and characterised. The conductive particles are based on a silver coated polymer sphere. The thermal properties of the ICAs have been investigated by two different characterisation techniques based on a steady state method and a contactless transient method. Results show that the thermal conductivity is strongly correlated with both volume fraction and silver coating thickness of conductive particles. A thermal conductivity (κ) of more than 2.8 W/mK has been obtained for an adhesive containing less than 4% volume of silver. However, a significant difference between the results obtained using the steady state and transient methods has been observed above the percolation threshold. One possible reason for this is the different volumetric constraints during the sample preparation.
{"title":"Thermal conduction in novel isotropic conductive adhesive","authors":"H. Kristiansen, K. Redford, S. Helland, Erik Kalland, Nina H. H⊘glund, M. A. Ras, C. Grosse, B. Hay, L. Ramiandrisoa, G. Davée, S. Gomés, S. Pettersen","doi":"10.1109/THERMINIC.2017.8233820","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233820","url":null,"abstract":"A novel and low silver content isotropic conductive adhesive (ICA) has been developed and characterised. The conductive particles are based on a silver coated polymer sphere. The thermal properties of the ICAs have been investigated by two different characterisation techniques based on a steady state method and a contactless transient method. Results show that the thermal conductivity is strongly correlated with both volume fraction and silver coating thickness of conductive particles. A thermal conductivity (κ) of more than 2.8 W/mK has been obtained for an adhesive containing less than 4% volume of silver. However, a significant difference between the results obtained using the steady state and transient methods has been observed above the percolation threshold. One possible reason for this is the different volumetric constraints during the sample preparation.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123813236","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233794
G. Jablonski, P. Janus, P. Pietrzak, T. Torzewicz, A. Sobczak, M. Janicki, A. Napieralski, A. Sierakowski, A. Brzezińska, P. Prokaryn
Heat transfer phenomena in electronic nanostructures are supposed not to obey the classic Fourier heat transfer theory. Thus, in order to verify this hypothesis experimentally, a set of MEMS nanostructures was designed and manufactured. These structures contain a number of cavities filled with different materials, including various dielectrics, such as silicon dioxide and the silicon nitride, or air as well as thin film platinum resistors located over and under the cavities. These resistors might serve either as heat sources or temperature sensors. This paper presents in detail the fabrication process of these devices and the preliminary results of their characterisation.
{"title":"Manufacturing and characterisation of MEMS test nanostructures","authors":"G. Jablonski, P. Janus, P. Pietrzak, T. Torzewicz, A. Sobczak, M. Janicki, A. Napieralski, A. Sierakowski, A. Brzezińska, P. Prokaryn","doi":"10.1109/THERMINIC.2017.8233794","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233794","url":null,"abstract":"Heat transfer phenomena in electronic nanostructures are supposed not to obey the classic Fourier heat transfer theory. Thus, in order to verify this hypothesis experimentally, a set of MEMS nanostructures was designed and manufactured. These structures contain a number of cavities filled with different materials, including various dielectrics, such as silicon dioxide and the silicon nitride, or air as well as thin film platinum resistors located over and under the cavities. These resistors might serve either as heat sources or temperature sensors. This paper presents in detail the fabrication process of these devices and the preliminary results of their characterisation.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129911013","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233847
P. Rajaguru, C. Bailey, H. Lu, A. M. Aliyu, A. Castellazzi, V. Pathirana, N. Udugampola, T. Trajkovic, F. Udrea, P. Mitcheson, A. Elliott
This paper details a co-design and modelling methodology to optimise the flip-chip assembly parameters so that the overall package and system meets performance and reliability specifications for LED lighting applications. A co-design methodology is employed between device level modelling and package level modelling in order enhance the flow of information. As part of this methodology, coupled electrical, thermal and mechniacal predictions are made in order to mitigate underfill dielectric breakdown failure and solder interconnect fatigue failure. Five commercial underfills were selected for investigating the trade-off in materials properties that mitigate underfill electrical breakdown and solder joint fatigue.
{"title":"Co-design/simulation of flip-chip assembly for high voltage IGBT packages","authors":"P. Rajaguru, C. Bailey, H. Lu, A. M. Aliyu, A. Castellazzi, V. Pathirana, N. Udugampola, T. Trajkovic, F. Udrea, P. Mitcheson, A. Elliott","doi":"10.1109/THERMINIC.2017.8233847","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233847","url":null,"abstract":"This paper details a co-design and modelling methodology to optimise the flip-chip assembly parameters so that the overall package and system meets performance and reliability specifications for LED lighting applications. A co-design methodology is employed between device level modelling and package level modelling in order enhance the flow of information. As part of this methodology, coupled electrical, thermal and mechniacal predictions are made in order to mitigate underfill dielectric breakdown failure and solder interconnect fatigue failure. Five commercial underfills were selected for investigating the trade-off in materials properties that mitigate underfill electrical breakdown and solder joint fatigue.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114944232","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233801
Siddharth Saparia, S. Tandon, E. Liu, T. Zahner, S. Besold, Wolfgang Kalb, G. Elger
Reliability and lifetime of LED modules depend critical from drive current and junction temperature. Transient thermal analysis (TTA) is widely used to measure the transient thermal impedance Zth and the thermal resistance Rth of LEDs to access the junction temperature. To predict the junction temperature of an LED in an application during product design and development calibratedfinite element (FE) models are required. In this paper, the correlation between simulated transient temperature data and the experimentally by TTA measured forward voltage (Vf(t)) is analysed in detail. Using a test chip, it is demonstrated that post-processing the average temperature of the junction of the FE model is the appropriate approach to correlate the simulated transient temperature data to the V/t) measurements. A FE-model for a family of white high-power LED, i.e. different number of LED dies on ceramic sub-mounts of different sizes, is developed using ANSYS and calibrated to the Zth(t) curve measured by TTA. The calibration is done in the time-domain, i.e. using the Zth(t) curve and its logarithmic time derivation b(z). The FE model is fitted to the experimental data. Due to the phosphor conversion, the heat load must be divided on the epitaxial layer (EPI) and the phosphor. The heat load distribution influences the Zth(t) curve significantly from the μs-to the ms-time range and must be considered as important parameter when fitting the simulation model. The calibration of the FE model is done using the average and the maximum temperature value of the EPI from the FE simulation. A significant difference of 20% between the thermal resistances of the thermal interface layers is obtained. The thermal performance of the thermal interfaces is significantly overestimated when using the maximum temperature for post-processing.
{"title":"Calibration of transient FE simulation: Improvement of post-processing and simulation automation","authors":"Siddharth Saparia, S. Tandon, E. Liu, T. Zahner, S. Besold, Wolfgang Kalb, G. Elger","doi":"10.1109/THERMINIC.2017.8233801","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233801","url":null,"abstract":"Reliability and lifetime of LED modules depend critical from drive current and junction temperature. Transient thermal analysis (TTA) is widely used to measure the transient thermal impedance Zth and the thermal resistance Rth of LEDs to access the junction temperature. To predict the junction temperature of an LED in an application during product design and development calibratedfinite element (FE) models are required. In this paper, the correlation between simulated transient temperature data and the experimentally by TTA measured forward voltage (Vf(t)) is analysed in detail. Using a test chip, it is demonstrated that post-processing the average temperature of the junction of the FE model is the appropriate approach to correlate the simulated transient temperature data to the V/t) measurements. A FE-model for a family of white high-power LED, i.e. different number of LED dies on ceramic sub-mounts of different sizes, is developed using ANSYS and calibrated to the Zth(t) curve measured by TTA. The calibration is done in the time-domain, i.e. using the Zth(t) curve and its logarithmic time derivation b(z). The FE model is fitted to the experimental data. Due to the phosphor conversion, the heat load must be divided on the epitaxial layer (EPI) and the phosphor. The heat load distribution influences the Zth(t) curve significantly from the μs-to the ms-time range and must be considered as important parameter when fitting the simulation model. The calibration of the FE model is done using the average and the maximum temperature value of the EPI from the FE simulation. A significant difference of 20% between the thermal resistances of the thermal interface layers is obtained. The thermal performance of the thermal interfaces is significantly overestimated when using the maximum temperature for post-processing.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123961769","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233835
Dae Seong Woo, Kyoung-Joon Kim
Failures may often occur in the packaged power terminals (PPTs) of the heater modules during harsh wafer baking process. The dominant failure factor is a high temperature. Hence, the performances of the PPTs should be explored under multiphysics environment to develop robust heater modules. In this study, FEA electrical-thermal-structural models of the PPTs are developed and experimentally validated. Various parametric influences on the thermal and structural performance of PPTs are investigated employing FEA electrical-thermal-structural models. The study has shown that the substrate thickness was a dominant parameter affecting the PPT performance.
{"title":"Electrical-thermal-structural performance of packaged power terminals for wafer baking","authors":"Dae Seong Woo, Kyoung-Joon Kim","doi":"10.1109/THERMINIC.2017.8233835","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233835","url":null,"abstract":"Failures may often occur in the packaged power terminals (PPTs) of the heater modules during harsh wafer baking process. The dominant failure factor is a high temperature. Hence, the performances of the PPTs should be explored under multiphysics environment to develop robust heater modules. In this study, FEA electrical-thermal-structural models of the PPTs are developed and experimentally validated. Various parametric influences on the thermal and structural performance of PPTs are investigated employing FEA electrical-thermal-structural models. The study has shown that the substrate thickness was a dominant parameter affecting the PPT performance.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129601397","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233813
L. Codecasa, V. d’Alessandro, A. Magnani, N. Rinaldi
A novel approach for extracting dynamic compact thermal models from nonlinear heat diffusion equations, which take into account the temperature dependence of thermal properties, is presented. In such Model Order Reduction method, the nonlinear heat diffusion equation is projected onto the space spanned by a few terms in the Volterra's series expansion of the solution. Such projection is performed by a novel structure-preserving hyper-reduction algorithm. The resulting method is very efficient, and can lead to very accurate compact thermal models, with unprecedented levels of simplicity. Moreover such models can be extracted for practically any regular temperature dependence of heat capacity, thermal conductivity and heat exchange coefficients. The method has been validated through the analysis of a complex ultra thin stacked chip module.
{"title":"Novel approach for the extraction of nonlinear compact thermal models","authors":"L. Codecasa, V. d’Alessandro, A. Magnani, N. Rinaldi","doi":"10.1109/THERMINIC.2017.8233813","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233813","url":null,"abstract":"A novel approach for extracting dynamic compact thermal models from nonlinear heat diffusion equations, which take into account the temperature dependence of thermal properties, is presented. In such Model Order Reduction method, the nonlinear heat diffusion equation is projected onto the space spanned by a few terms in the Volterra's series expansion of the solution. Such projection is performed by a novel structure-preserving hyper-reduction algorithm. The resulting method is very efficient, and can lead to very accurate compact thermal models, with unprecedented levels of simplicity. Moreover such models can be extracted for practically any regular temperature dependence of heat capacity, thermal conductivity and heat exchange coefficients. The method has been validated through the analysis of a complex ultra thin stacked chip module.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122404805","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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