Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233812
B. Rogié, L. Codecasa, E. Monier-Vinard, V. Bissuel, N. Laraqi, O. Daniel, D. D’Amore, A. Magnani, V. d’Alessandro, N. Rinaldi
Delphi-like Boundary Condition Independent (BCI) Compact Thermal Models (CTMs) are the standard for modelling single die packages. However their extraction, particularly in the transient case, will be time consuming due to complex numerical simulations for a large number of external conditions. Lately, new approaches to extract a BCI Dynamical CTM (DCTM), based on Model Order Reduction (MOR) have been developed. Despite the numerous advantages of this recent method, the lack of numerical tools to integrate reduced-order models (ROM) makes it difficult to use at board level. In this study, a novel process flow for extracting Delphi-inspired BCI DCTMs is investigated. Thus a detailed three-dimensional model is replaced by a BCI-ROM model using FANTASTIC matrix reduction code to generate the data used in the creation of a Delphi-style BCI DCTM. That hybrid reduction method has been applied to an industrial single-chip package, named QFN16. Its derived CTM and DCTM have been compared in term of accuracy and creation time for both approaches: in-house Delphi-inspired and MOR based. The results show that for a similar accuracy, the integration of MOR technique allows minimizing the time-consuming numerical simulations and so to reduce the thermal network creation time by 80%.
{"title":"Delphi-like dynamical compact thermal models using model order reduction","authors":"B. Rogié, L. Codecasa, E. Monier-Vinard, V. Bissuel, N. Laraqi, O. Daniel, D. D’Amore, A. Magnani, V. d’Alessandro, N. Rinaldi","doi":"10.1109/THERMINIC.2017.8233812","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233812","url":null,"abstract":"Delphi-like Boundary Condition Independent (BCI) Compact Thermal Models (CTMs) are the standard for modelling single die packages. However their extraction, particularly in the transient case, will be time consuming due to complex numerical simulations for a large number of external conditions. Lately, new approaches to extract a BCI Dynamical CTM (DCTM), based on Model Order Reduction (MOR) have been developed. Despite the numerous advantages of this recent method, the lack of numerical tools to integrate reduced-order models (ROM) makes it difficult to use at board level. In this study, a novel process flow for extracting Delphi-inspired BCI DCTMs is investigated. Thus a detailed three-dimensional model is replaced by a BCI-ROM model using FANTASTIC matrix reduction code to generate the data used in the creation of a Delphi-style BCI DCTM. That hybrid reduction method has been applied to an industrial single-chip package, named QFN16. Its derived CTM and DCTM have been compared in term of accuracy and creation time for both approaches: in-house Delphi-inspired and MOR based. The results show that for a similar accuracy, the integration of MOR technique allows minimizing the time-consuming numerical simulations and so to reduce the thermal network creation time by 80%.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"218 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123297674","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233787
Çağn Balıkçı, İlker Tan
Spray cooling for electronics cooling applications offers superior performance due to the atomization and two-phase flow abilities. Need for spray cooling in thermal applications is on the rise due to increasing heat fluxes and demanding reliability specifications. Unfortunately, it is a very laborious task to predict Critical Heat Fluxes (CHF) for spray cooling by means of Computational Fluid Dynamics (CFD). Therefore, thermal engineers generally prefer using empirical correlations to determine capabilities of spray cooling for electronics. In this study, one of the empirical correlations was tested by performing several experiments by varying the fluid type, the angle of spray nozzle and the flow rate.
{"title":"Experimental spray cooling studies with FC-72 and FC-84 to comprehend the validity of volumetric flux model (VFM)","authors":"Çağn Balıkçı, İlker Tan","doi":"10.1109/THERMINIC.2017.8233787","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233787","url":null,"abstract":"Spray cooling for electronics cooling applications offers superior performance due to the atomization and two-phase flow abilities. Need for spray cooling in thermal applications is on the rise due to increasing heat fluxes and demanding reliability specifications. Unfortunately, it is a very laborious task to predict Critical Heat Fluxes (CHF) for spray cooling by means of Computational Fluid Dynamics (CFD). Therefore, thermal engineers generally prefer using empirical correlations to determine capabilities of spray cooling for electronics. In this study, one of the empirical correlations was tested by performing several experiments by varying the fluid type, the angle of spray nozzle and the flow rate.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"96 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114843164","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233822
R. Schacht, S. Rzepka
This contribution derives an efficient approach to model a coupled electro-thermal design problem for transient system simulation, using an analogue simulator, like SPICE. It introduces the electrical and thermal modelling procedures and the coupling of both models. The electrical model is based on the fundamental equations of semiconductor physics. Using the respective physical parameters the model can easily be adapted to an existing component. The thermal model is based on a modified Foster model, extracted from transient FEM simulation results using thermal unit step responses. During the coupled transient simulation the electrical behaviour of each electrical component will be influenced on its self-heating and the coupled heating of active components in vicinity. The approach can also be applied to other coupled problems in MEMS, where a thermal coupling is important. The method will be demonstrated on the example of a D2PAK application, assembled on a PCB, using four MOSFET transistors.
{"title":"Efficient modelling approach for transient coupled electro-thermal simulation on the example of a D2PAK application","authors":"R. Schacht, S. Rzepka","doi":"10.1109/THERMINIC.2017.8233822","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233822","url":null,"abstract":"This contribution derives an efficient approach to model a coupled electro-thermal design problem for transient system simulation, using an analogue simulator, like SPICE. It introduces the electrical and thermal modelling procedures and the coupling of both models. The electrical model is based on the fundamental equations of semiconductor physics. Using the respective physical parameters the model can easily be adapted to an existing component. The thermal model is based on a modified Foster model, extracted from transient FEM simulation results using thermal unit step responses. During the coupled transient simulation the electrical behaviour of each electrical component will be influenced on its self-heating and the coupled heating of active components in vicinity. The approach can also be applied to other coupled problems in MEMS, where a thermal coupling is important. The method will be demonstrated on the example of a D2PAK application, assembled on a PCB, using four MOSFET transistors.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117001972","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233830
J. Colonna, R. Prieto, P. Coudrain, Y. Hallez, D. Campos, O. Le-Briz, R. Franiatte, C. Brunet-Manquat, C. Chancel, V. Rat
Thermal dissipation is a major concern in microelectronics, especially for compact packages and 3D circuits where the dense stacking of thin silicon layers leads to a significant increase of heat densities. Direct hybrid bonding is considered as one of the most promising technologies for future 3D-ICs. Its face-to-face structure allows significant inter-connexion capabilities but it also implies increased thermal densities that will be reflected in both tiers due to the lack of insulating barriers. A specific test vehicle for 3D hybrid bonding including heaters and temperature sensors on each tiers has been fabricated and characterized. Several packaging configurations including different silicon thicknesses, substrate thermal design or the integration of a patterned graphite heat spreader have been tested. The best results were obtained with the integration of the graphite heat spreader which led to a reduction in thermal resistance by 11%. These experimental results have been retro-simulated to establish a thermal model. This model was then used to analyse the heat path and explore the thermal impact of the different packaging parameters.
{"title":"Carbon-based patterned heat spreaders for thermal mitigation of wire bonded packages","authors":"J. Colonna, R. Prieto, P. Coudrain, Y. Hallez, D. Campos, O. Le-Briz, R. Franiatte, C. Brunet-Manquat, C. Chancel, V. Rat","doi":"10.1109/THERMINIC.2017.8233830","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233830","url":null,"abstract":"Thermal dissipation is a major concern in microelectronics, especially for compact packages and 3D circuits where the dense stacking of thin silicon layers leads to a significant increase of heat densities. Direct hybrid bonding is considered as one of the most promising technologies for future 3D-ICs. Its face-to-face structure allows significant inter-connexion capabilities but it also implies increased thermal densities that will be reflected in both tiers due to the lack of insulating barriers. A specific test vehicle for 3D hybrid bonding including heaters and temperature sensors on each tiers has been fabricated and characterized. Several packaging configurations including different silicon thicknesses, substrate thermal design or the integration of a patterned graphite heat spreader have been tested. The best results were obtained with the integration of the graphite heat spreader which led to a reduction in thermal resistance by 11%. These experimental results have been retro-simulated to establish a thermal model. This model was then used to analyse the heat path and explore the thermal impact of the different packaging parameters.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129069568","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233788
P. Zając, A. Napieralski
The research and design of liquid-cooled integrated circuits (IC) relies heavily on accurate simulation. Ideally, finite-element-method (FEM) based tools should be used for this purpose. However, in most cases a fully coupled thermo-fluidic simulation of complex ICs is very time consuming. Therefore, in this paper we propose a novel method for thermal simulation of ICs cooled by integrated microchannels which significantly reduces the simulation time. The new approach is based on treating the solidliquid boundary as a convective boundary. It is shown that the proposed model offers very good accuracy in steady-state, with errors below 3°C in every chip point. In transient domain the results are less satisfactory, but still the error can be considered acceptable. Moreover, the simulation times have been reduced by about two orders of magnitude with respect to FEM simulation.
{"title":"Novel method for fast FEM simulation of chips with integrated microchannel cooling","authors":"P. Zając, A. Napieralski","doi":"10.1109/THERMINIC.2017.8233788","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233788","url":null,"abstract":"The research and design of liquid-cooled integrated circuits (IC) relies heavily on accurate simulation. Ideally, finite-element-method (FEM) based tools should be used for this purpose. However, in most cases a fully coupled thermo-fluidic simulation of complex ICs is very time consuming. Therefore, in this paper we propose a novel method for thermal simulation of ICs cooled by integrated microchannels which significantly reduces the simulation time. The new approach is based on treating the solidliquid boundary as a convective boundary. It is shown that the proposed model offers very good accuracy in steady-state, with errors below 3°C in every chip point. In transient domain the results are less satisfactory, but still the error can be considered acceptable. Moreover, the simulation times have been reduced by about two orders of magnitude with respect to FEM simulation.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128227638","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233800
M. A. Ras, T. von Essen, Julien Fortel, P. Panchal, L. Divay, A. Borta-Boyon, D. May, C. Darmawan, M. K. Samani, B. Wunderle, A. Ziaei
In the joint project SMARTHERM the applicability of vertically-aligned carbon nanotubes (VA CNT) is main subject of interest. Target is the implementation of a VACNT layer as functional thermal interface material into an RF package to prove this promising technology's feasibility. This paper presents the approach the SMARTHERM consortium has taken so far. Beginning with a general motivation why to engage in this topic, the approach and the chosen demonstrator design are introduced. One focus lies on the description of the demonstrator and its components alongside with a comprehensive view into the assembling as main challenge. The choice of measurement techniques is discussed and the measures of success are defined. Finally, the results are presented, discussed and concluded and an outlook is provided how the findings influence further approaches in the project.
{"title":"Design and realization of characterization demonstrator to investigate thermal performance of vertically-aligned carbon nanotubes TIM for avionics and aerospace applications","authors":"M. A. Ras, T. von Essen, Julien Fortel, P. Panchal, L. Divay, A. Borta-Boyon, D. May, C. Darmawan, M. K. Samani, B. Wunderle, A. Ziaei","doi":"10.1109/THERMINIC.2017.8233800","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233800","url":null,"abstract":"In the joint project SMARTHERM the applicability of vertically-aligned carbon nanotubes (VA CNT) is main subject of interest. Target is the implementation of a VACNT layer as functional thermal interface material into an RF package to prove this promising technology's feasibility. This paper presents the approach the SMARTHERM consortium has taken so far. Beginning with a general motivation why to engage in this topic, the approach and the chosen demonstrator design are introduced. One focus lies on the description of the demonstrator and its components alongside with a comprehensive view into the assembling as main challenge. The choice of measurement techniques is discussed and the measures of success are defined. Finally, the results are presented, discussed and concluded and an outlook is provided how the findings influence further approaches in the project.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125663956","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233796
G. Onushkin, Karel Joop Bosschaart, Joan Yu, Henk Jan van Aalderen, J. Joly, G. Martin, A. Poppe
Rapid growth of Solid-State Lighting market has been supported by progress in Light Emitting Diode (LED) technology. Strong competition requires that lighting product development cycle should be shorter and more effective. Optimal design of a LED luminaire in major degree depends on thermal-electro-optical properties of LEDs in use. These properties are required to be accurately characterized and well predicted for various operating conditions of the LEDs within luminaire in close interaction with other parts of the system. Delphi4LED project [1] aims at developing standardised method to create multi-domain (thermal, electrical, and optical) compact models from the measurement data. Boundary-independent, accurate and well junction temperature-controlled iso-thermal electro-optical characterization procedure for LED samples is required to obtain highly reliable and representative data sets as an input for the compact model. Often, thermal and optical characterization experiments are performed separately at dedicated equipment. In this paper, we report the results of our evaluation and experimental verification of various sources for uncertainties and inaccuracies originated from separation of thermal and optical measurement procedures.
{"title":"Assessment of isothermal electro-optical-thermal measurement procedures for LEDs","authors":"G. Onushkin, Karel Joop Bosschaart, Joan Yu, Henk Jan van Aalderen, J. Joly, G. Martin, A. Poppe","doi":"10.1109/THERMINIC.2017.8233796","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233796","url":null,"abstract":"Rapid growth of Solid-State Lighting market has been supported by progress in Light Emitting Diode (LED) technology. Strong competition requires that lighting product development cycle should be shorter and more effective. Optimal design of a LED luminaire in major degree depends on thermal-electro-optical properties of LEDs in use. These properties are required to be accurately characterized and well predicted for various operating conditions of the LEDs within luminaire in close interaction with other parts of the system. Delphi4LED project [1] aims at developing standardised method to create multi-domain (thermal, electrical, and optical) compact models from the measurement data. Boundary-independent, accurate and well junction temperature-controlled iso-thermal electro-optical characterization procedure for LED samples is required to obtain highly reliable and representative data sets as an input for the compact model. Often, thermal and optical characterization experiments are performed separately at dedicated equipment. In this paper, we report the results of our evaluation and experimental verification of various sources for uncertainties and inaccuracies originated from separation of thermal and optical measurement procedures.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132166063","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233791
S. Lungten, R. Bornoff, James Dyson, J. Maubach, W. Schilders, M. Warner
Thermal management is one of the key issues arising in designing light-emitting diode (LED) based luminaire products. Dynamic compact thermal models (DCTMs) are required to predict the thermal behaviour of LED packages fast and accurately in system level simulations. The European Delphi4LED consortium aims to develop multi-domain (electrical-thermal-optical) compact models. One of its targets is to develop a methodology to extract DCTMs that can handle multiple heat sources of LEDs. We present the implementation of Krylov subspace based model order reduction techniques to extract the DCTMs of LED packages selected in the Delphi4LED simulation benchmarks. The results presented in this paper show that the extraction of DCTMs using iterative rational Krylov is highly accurate for these benchmark problems.
{"title":"Dynamic compact thermal model extraction for LED packages using model order reduction techniques","authors":"S. Lungten, R. Bornoff, James Dyson, J. Maubach, W. Schilders, M. Warner","doi":"10.1109/THERMINIC.2017.8233791","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233791","url":null,"abstract":"Thermal management is one of the key issues arising in designing light-emitting diode (LED) based luminaire products. Dynamic compact thermal models (DCTMs) are required to predict the thermal behaviour of LED packages fast and accurately in system level simulations. The European Delphi4LED consortium aims to develop multi-domain (electrical-thermal-optical) compact models. One of its targets is to develop a methodology to extract DCTMs that can handle multiple heat sources of LEDs. We present the implementation of Krylov subspace based model order reduction techniques to extract the DCTMs of LED packages selected in the Delphi4LED simulation benchmarks. The results presented in this paper show that the extraction of DCTMs using iterative rational Krylov is highly accurate for these benchmark problems.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126877384","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233793
M. Zubert, T. Raszkowski, A. Samson, M. Janicki, P. Zając
This paper presents the scope of applicability of Dual-Phase-Lag heat transfer model in electronic devices as-well-as in integrated circuits. Moreover, the investigation of necessity of use the Dual-Phase-Lag approach, instead of the classical Fourier-Kirchhoff model, to heat transfer modelling is included. In order to obtain the mentioned scope of applicability both analyzed thermal model has been used for the transistor elementary cells including the FinFET technology as-well-as power devices e.g. unipolar (MOSFET, VDMOS), bipolar and insulated gate bipolar transistors (IGBT)-SiC merged power diode. The received simulation results have been thoroughly-compared and analyzed in detail.
{"title":"The scope of applicability of DPL model to the heat transfer in electronic devices and integrated circuits","authors":"M. Zubert, T. Raszkowski, A. Samson, M. Janicki, P. Zając","doi":"10.1109/THERMINIC.2017.8233793","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233793","url":null,"abstract":"This paper presents the scope of applicability of Dual-Phase-Lag heat transfer model in electronic devices as-well-as in integrated circuits. Moreover, the investigation of necessity of use the Dual-Phase-Lag approach, instead of the classical Fourier-Kirchhoff model, to heat transfer modelling is included. In order to obtain the mentioned scope of applicability both analyzed thermal model has been used for the transistor elementary cells including the FinFET technology as-well-as power devices e.g. unipolar (MOSFET, VDMOS), bipolar and insulated gate bipolar transistors (IGBT)-SiC merged power diode. The received simulation results have been thoroughly-compared and analyzed in detail.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130155791","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2017-09-01DOI: 10.1109/THERMINIC.2017.8233825
C. van Veen, W. Luiten
The shape of a compressed solder bump under mechanical load stemming from the weight of an IC or IC package has an important influence on the contact angles and the stresses that results from thermal cycling. In this work an expression is derived that provides a more accurate description of this shape. The shape of the small solder bump is dominated by surface tension and the shape of the unloaded solder bump is given by a truncated sphere. In the new approach, a correction function in the form of a series expansion is applied to incorporate the flattening due to the loading of the bump. The terms of the series are evaluated through the expression for force equilibrium found in earlier work. The results are compared with the results for an elliptical model and with a “hypothetical” ideal solution and the new approach is demonstrated for two representative cases.
{"title":"A new analytical approach to the geometry of a compressed liquid bump","authors":"C. van Veen, W. Luiten","doi":"10.1109/THERMINIC.2017.8233825","DOIUrl":"https://doi.org/10.1109/THERMINIC.2017.8233825","url":null,"abstract":"The shape of a compressed solder bump under mechanical load stemming from the weight of an IC or IC package has an important influence on the contact angles and the stresses that results from thermal cycling. In this work an expression is derived that provides a more accurate description of this shape. The shape of the small solder bump is dominated by surface tension and the shape of the unloaded solder bump is given by a truncated sphere. In the new approach, a correction function in the form of a series expansion is applied to incorporate the flattening due to the loading of the bump. The terms of the series are evaluated through the expression for force equilibrium found in earlier work. The results are compared with the results for an elliptical model and with a “hypothetical” ideal solution and the new approach is demonstrated for two representative cases.","PeriodicalId":317847,"journal":{"name":"2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130378020","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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