Pub Date : 2016-09-22DOI: 10.1109/ISEMC.2016.7571655
Juan Becerra, A. Tatematsu, F. Vega, F. Rachidi
A stable method for the analysis of lossy transmission lines with nonlinear loads is presented. The simulation employs the time marching (TM) method for solving the convolution equations in the time domain. To cope with the late-time instability of the TM method, a novel approach based on the application of Z-transform analysis and cepstrum is presented. The efficiency of the proposed method is demonstrated by comparing its results with simulations obtained using (i) a full-wave FDTD approach, and (ii) CST Cable Studio.
{"title":"Stable simulation of nonlinearly loaded lossy transmission lines with time marching approach","authors":"Juan Becerra, A. Tatematsu, F. Vega, F. Rachidi","doi":"10.1109/ISEMC.2016.7571655","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571655","url":null,"abstract":"A stable method for the analysis of lossy transmission lines with nonlinear loads is presented. The simulation employs the time marching (TM) method for solving the convolution equations in the time domain. To cope with the late-time instability of the TM method, a novel approach based on the application of Z-transform analysis and cepstrum is presented. The efficiency of the proposed method is demonstrated by comparing its results with simulations obtained using (i) a full-wave FDTD approach, and (ii) CST Cable Studio.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114078914","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-22DOI: 10.1109/ISEMC.2016.7571608
Yujeong Shim, D. Oh
Timing closure on on-chip critical paths becomes more challenging as both data and clock jitter increase due to a large power supply noise. There have been intensive studies to model timing impact of power supply noise on the logic timing. Unlike the flip flops and combinational logics placed and routed randomly, the global networks including the clock buffers are usually custom design based so that they are placed regularly and densely. In the FPGAs, the multiple global networks up to 32 are routed in parallel as the chip size grows and number of transistors increase enormously. Since the clock buffers are placed very closely, a voltage drop of the power supply by the adjacent clock buffers switching makes the clock edge slow, when the clock edges of the victim and aggressors are aligned. This slowed down clock eats away setup the timing margin loss. The behavior of this noise impact is similar with signal to signal cross talk. In this paper, the supply noise impact due to the switching noise by the adjacent clock buffers is demonstrated by simulation and measurement. And it is described how to implement timing impact into STA (Static Timing Analysis) flow.
{"title":"Impact of dynamic power supply noise induced by clock networks on clock jitter and timing margin","authors":"Yujeong Shim, D. Oh","doi":"10.1109/ISEMC.2016.7571608","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571608","url":null,"abstract":"Timing closure on on-chip critical paths becomes more challenging as both data and clock jitter increase due to a large power supply noise. There have been intensive studies to model timing impact of power supply noise on the logic timing. Unlike the flip flops and combinational logics placed and routed randomly, the global networks including the clock buffers are usually custom design based so that they are placed regularly and densely. In the FPGAs, the multiple global networks up to 32 are routed in parallel as the chip size grows and number of transistors increase enormously. Since the clock buffers are placed very closely, a voltage drop of the power supply by the adjacent clock buffers switching makes the clock edge slow, when the clock edges of the victim and aggressors are aligned. This slowed down clock eats away setup the timing margin loss. The behavior of this noise impact is similar with signal to signal cross talk. In this paper, the supply noise impact due to the switching noise by the adjacent clock buffers is demonstrated by simulation and measurement. And it is described how to implement timing impact into STA (Static Timing Analysis) flow.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114352718","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-22DOI: 10.1109/ISEMC.2016.7571746
Patrick DeRoy, Scott Piper
A model was developed to represent a bulk current injection (BCI) probe used for EMC testing. This model physically represents the BCI probe which allows one to model the coupling to multiple wires simultaneously. This model has many useful applications in designing products that comply with BCI test standards and to gain insight on BCI testing principles. The effect of changing individual wire termination impedances and differential bulk current injection will both be presented using this model.
{"title":"Full-wave modeling of bulk current injection probe coupling to multi-conductor cable bundles","authors":"Patrick DeRoy, Scott Piper","doi":"10.1109/ISEMC.2016.7571746","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571746","url":null,"abstract":"A model was developed to represent a bulk current injection (BCI) probe used for EMC testing. This model physically represents the BCI probe which allows one to model the coupling to multiple wires simultaneously. This model has many useful applications in designing products that comply with BCI test standards and to gain insight on BCI testing principles. The effect of changing individual wire termination impedances and differential bulk current injection will both be presented using this model.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122613783","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-22DOI: 10.1109/ISEMC.2016.7571757
Niklas Briest, H. Garbe, D. Hamann, S. Potthast
Transverse electromagnetic (TEM) waveguides, especially gigahertz TEM (GTEM) cells, are predominantly used for emission and immunity tests. General requirements for such a GTEM cell are given by the IEC 61000-4-20. Annex C of the IEC 61000-4-20 specifies immunity tests based on high-altitude electromagnetic pulses (HEMP) with a double exponential waveform. This waveform's shape is sufficiently defined by rise time and pulse width. The quality of its transmission within a waveguide can be expressed by the variation of these parameters. However, other arbitrary signals cannot be reduced to just these characteristic parameters. In this paper a method is described that offers the possibility to characterize the transmission quality of a GTEM cell for arbitrary transient waveforms. It is based on the Pearson Correlation Coefficient (PCC) of a so-called reference signal and the signals being measured within the test volume of a GTEM cell. Both signals are measured simultaneously with identical field probes in order to be independent from the reproducibility of the signal generator. The signals are windowed and limited to include only the defining reflections and distortions. By means of this signal dedicated validation procedure, the transmission quality of a TEM waveguide can be validated for an arbitrary transient waveform.
{"title":"Extension of the IEC 61000-4-20 Annex C to the use of arbitrary transient signals","authors":"Niklas Briest, H. Garbe, D. Hamann, S. Potthast","doi":"10.1109/ISEMC.2016.7571757","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571757","url":null,"abstract":"Transverse electromagnetic (TEM) waveguides, especially gigahertz TEM (GTEM) cells, are predominantly used for emission and immunity tests. General requirements for such a GTEM cell are given by the IEC 61000-4-20. Annex C of the IEC 61000-4-20 specifies immunity tests based on high-altitude electromagnetic pulses (HEMP) with a double exponential waveform. This waveform's shape is sufficiently defined by rise time and pulse width. The quality of its transmission within a waveguide can be expressed by the variation of these parameters. However, other arbitrary signals cannot be reduced to just these characteristic parameters. In this paper a method is described that offers the possibility to characterize the transmission quality of a GTEM cell for arbitrary transient waveforms. It is based on the Pearson Correlation Coefficient (PCC) of a so-called reference signal and the signals being measured within the test volume of a GTEM cell. Both signals are measured simultaneously with identical field probes in order to be independent from the reproducibility of the signal generator. The signals are windowed and limited to include only the defining reflections and distortions. By means of this signal dedicated validation procedure, the transmission quality of a TEM waveguide can be validated for an arbitrary transient waveform.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130436603","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-22DOI: 10.1109/ISEMC.2016.7571688
Bichen Chen, M. Tsiklauri, Chunyu Wu, Shuai Jin, J. Fan, X. Ye, Bill Samaras
De-embedding procedures are sensitive to manufacturing variations in test fixtures, as well as inaccuracies associated with the calibration and measurement process. Such sensitivities can propagate through de-embedding procedures, resulting in amplified errors. In this paper, analytical and numerical techniques are used to perform sensitivity studies on both simulation and measurement data, with respect to de-embedding.
{"title":"Analytical and numerical sensitivity analyses of fixtures de-embedding","authors":"Bichen Chen, M. Tsiklauri, Chunyu Wu, Shuai Jin, J. Fan, X. Ye, Bill Samaras","doi":"10.1109/ISEMC.2016.7571688","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571688","url":null,"abstract":"De-embedding procedures are sensitive to manufacturing variations in test fixtures, as well as inaccuracies associated with the calibration and measurement process. Such sensitivities can propagate through de-embedding procedures, resulting in amplified errors. In this paper, analytical and numerical techniques are used to perform sensitivity studies on both simulation and measurement data, with respect to de-embedding.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"383 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133078799","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-09-22DOI: 10.1109/ISEMC.2016.7571720
M. Ehsan, Zhen Zhou, Yang Yi
Neuromorphic computing is an emerging technology that describes the biological neural systems and implementation of its electrical model in complementary metal-oxide-semiconductor (CMOS) VLSI system. Three dimensional (3D) integration can be applied in hardware implementation of neuromorphic computing that provides high device interconnection density using fast and energy efficient links with excellent distribution and communication among the neuron layers. In this work, we studied the necessities of neuromorphic computing based on 3D integration technology, design challenges, and a possible solution to overcome the effect of huge parallelism of well-connected synaptic system. Using the force directed optimization algorithm, an optimal interconnect array pattern is identified for a proposed structure that could mitigate significant amount of crosstalk. For the analysis of crosstalk, an electrical model of the optimal array structure is proposed and it has been validated by comparing its simulation results with those extracted from commercial tools. This work can be used as a basis study for successful implementation of next generation 3D neuromorphic computation for high performance application.
{"title":"Modeling and optimization of TSV for crosstalk mitigation in 3D neuromorphic system","authors":"M. Ehsan, Zhen Zhou, Yang Yi","doi":"10.1109/ISEMC.2016.7571720","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571720","url":null,"abstract":"Neuromorphic computing is an emerging technology that describes the biological neural systems and implementation of its electrical model in complementary metal-oxide-semiconductor (CMOS) VLSI system. Three dimensional (3D) integration can be applied in hardware implementation of neuromorphic computing that provides high device interconnection density using fast and energy efficient links with excellent distribution and communication among the neuron layers. In this work, we studied the necessities of neuromorphic computing based on 3D integration technology, design challenges, and a possible solution to overcome the effect of huge parallelism of well-connected synaptic system. Using the force directed optimization algorithm, an optimal interconnect array pattern is identified for a proposed structure that could mitigate significant amount of crosstalk. For the analysis of crosstalk, an electrical model of the optimal array structure is proposed and it has been validated by comparing its simulation results with those extracted from commercial tools. This work can be used as a basis study for successful implementation of next generation 3D neuromorphic computation for high performance application.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132076643","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-07-25DOI: 10.1109/ISEMC.2016.7571626
N. Maeda, S. Fukui, T. Sekine, Yasuhiro Takahashi
An indirect measurement method is proposed for the S-parameters of multiport circuit with half of its ports not directly measured. These ports are assumed to be `hard-to-access' ports. For these ports, some known loads are connected while direct measurements are performed through the remaining `easy-to access' ports to estimate the whole S-parameters. In our previous estimation method, number of measurements has to be increased to maintain the estimation accuracy when the number of ports increases. Here, we propose a novel method that applies known load sets each of which consists of mutually different loads, which is effective to eliminate the number of measurements. A numerical experiment example is shown for a circuit with “case-earth capacitors” that connect PCB ground to the body earth for noise immunity improvement in automobile application. Through the example, the validity and usability of this method is confirmed.
{"title":"An indirect measurement method for multiport S-parameters with reduced number of measurements","authors":"N. Maeda, S. Fukui, T. Sekine, Yasuhiro Takahashi","doi":"10.1109/ISEMC.2016.7571626","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571626","url":null,"abstract":"An indirect measurement method is proposed for the S-parameters of multiport circuit with half of its ports not directly measured. These ports are assumed to be `hard-to-access' ports. For these ports, some known loads are connected while direct measurements are performed through the remaining `easy-to access' ports to estimate the whole S-parameters. In our previous estimation method, number of measurements has to be increased to maintain the estimation accuracy when the number of ports increases. Here, we propose a novel method that applies known load sets each of which consists of mutually different loads, which is effective to eliminate the number of measurements. A numerical experiment example is shown for a circuit with “case-earth capacitors” that connect PCB ground to the body earth for noise immunity improvement in automobile application. Through the example, the validity and usability of this method is confirmed.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115469844","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-07-25DOI: 10.1109/ISEMC.2016.7571702
Shaowu Huang, X. Ye, Kai Xiao
In this paper, through introducing the short and open standards and excluding the match (termination) standard, a technique is proposed to simplify the measurement of symmetric device under test (DUT). Because the short and open standards are usually easier to obtain than the match (termination) standard in terms of cost and/or feasibility, this technique provides more cost-effective and more flexible solution for characterization of symmetric systems and interconnects.
{"title":"Novel characterization technique with short and open standards","authors":"Shaowu Huang, X. Ye, Kai Xiao","doi":"10.1109/ISEMC.2016.7571702","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571702","url":null,"abstract":"In this paper, through introducing the short and open standards and excluding the match (termination) standard, a technique is proposed to simplify the measurement of symmetric device under test (DUT). Because the short and open standards are usually easier to obtain than the match (termination) standard in terms of cost and/or feasibility, this technique provides more cost-effective and more flexible solution for characterization of symmetric systems and interconnects.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115677261","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-07-25DOI: 10.1109/ISEMC.2016.7571732
D. Moongilan
In order to control the components of a Smart Grid, a reliable telecommunication and information exchange system is necessary. Hence, the telecommunication network is an integral part of a Smart Grid electrical power transmission, distribution and control system. The telecommunication network needs to be reliable, secure, cost effective, and immune from power system transients and external electromagnetic noise sources. This paper investigates generally available telecommunication network options for Smart Grid applications, from an electromagnetic compatibility (EMC) perspective. The findings indicate that for short range communication requirements a 5G wireless using the 60 GHz ISM band is emerging as one of the technology options for reliable, secure and cost effective operation of a Smart Grid.
{"title":"5G wireless communications (60 GHz band) for smart grid — An EMC perspective","authors":"D. Moongilan","doi":"10.1109/ISEMC.2016.7571732","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571732","url":null,"abstract":"In order to control the components of a Smart Grid, a reliable telecommunication and information exchange system is necessary. Hence, the telecommunication network is an integral part of a Smart Grid electrical power transmission, distribution and control system. The telecommunication network needs to be reliable, secure, cost effective, and immune from power system transients and external electromagnetic noise sources. This paper investigates generally available telecommunication network options for Smart Grid applications, from an electromagnetic compatibility (EMC) perspective. The findings indicate that for short range communication requirements a 5G wireless using the 60 GHz ISM band is emerging as one of the technology options for reliable, secure and cost effective operation of a Smart Grid.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115684869","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2016-07-25DOI: 10.1109/ISEMC.2016.7571696
Olusegun Ogundapo, A. Duffy, C. Nche
Crosstalk is a fundamental limiting factor in communication systems. The paper determines crosstalk parameter that can be used for fast prediction of near end crosstalk (NEXT) in unshielded twisted pair cables. The paper evaluates NEXT using standard simple and advanced models with the empirical parameter provided by the American National Standards Institute (ANSI). The results obtained showed that the models under predict the NEXT using the ANSI parameter. The evaluation of the models with the average crosstalk parameters of each cable also indicates that they under predict the NEXT. An improved parameter is proposed and validated using NEXT measurements of three unshielded twisted pair cables from different manufacturers. The presented evaluation and modeling method is straight forward and can therefore, be applied to other cable types as needed. The tool can also be useful to cable engineers investigating crosstalk in the design of data communication systems.
{"title":"Parameter for near end crosstalk prediction in twisted pair cables","authors":"Olusegun Ogundapo, A. Duffy, C. Nche","doi":"10.1109/ISEMC.2016.7571696","DOIUrl":"https://doi.org/10.1109/ISEMC.2016.7571696","url":null,"abstract":"Crosstalk is a fundamental limiting factor in communication systems. The paper determines crosstalk parameter that can be used for fast prediction of near end crosstalk (NEXT) in unshielded twisted pair cables. The paper evaluates NEXT using standard simple and advanced models with the empirical parameter provided by the American National Standards Institute (ANSI). The results obtained showed that the models under predict the NEXT using the ANSI parameter. The evaluation of the models with the average crosstalk parameters of each cable also indicates that they under predict the NEXT. An improved parameter is proposed and validated using NEXT measurements of three unshielded twisted pair cables from different manufacturers. The presented evaluation and modeling method is straight forward and can therefore, be applied to other cable types as needed. The tool can also be useful to cable engineers investigating crosstalk in the design of data communication systems.","PeriodicalId":326016,"journal":{"name":"2016 IEEE International Symposium on Electromagnetic Compatibility (EMC)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-07-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117343781","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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