Pub Date : 2009-04-14DOI: 10.1109/IMWS.2009.4814902
J. Rayas-Sánchez
A practical, computationally efficient technique to EM-based design of single-layer SIW interconnects with microstrip transitions is presented in this work. The design technique efficiently exploits a simplified EM model of the SIW interconnect (surrogate model). The initial design of the SIW structure is obtained by using available empirical equations. A low-resolution EM model with solid walls (grooves) is proposed as an efficient SIW surrogate model for direct EM optimization using a few frequency points. The complete EM optimization of the surrogate model consumes much less time (≪ 20%) than just one simulation of the original EM model (with vias) using a high-resolution grid. The proposed practical technique is illustrated by designing a 10-50 GHz SIW interconnect with microstrip transitions on a standard FR4-based substrate.
{"title":"An Improved EM-Based Design Procedure for Single-Layer Substrate Integrated Waveguide Interconnects with Microstrip Transitions","authors":"J. Rayas-Sánchez","doi":"10.1109/IMWS.2009.4814902","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814902","url":null,"abstract":"A practical, computationally efficient technique to EM-based design of single-layer SIW interconnects with microstrip transitions is presented in this work. The design technique efficiently exploits a simplified EM model of the SIW interconnect (surrogate model). The initial design of the SIW structure is obtained by using available empirical equations. A low-resolution EM model with solid walls (grooves) is proposed as an efficient SIW surrogate model for direct EM optimization using a few frequency points. The complete EM optimization of the surrogate model consumes much less time (≪ 20%) than just one simulation of the original EM model (with vias) using a high-resolution grid. The proposed practical technique is illustrated by designing a 10-50 GHz SIW interconnect with microstrip transitions on a standard FR4-based substrate.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128137683","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-04-14DOI: 10.1109/IMWS.2009.4814906
Isaias Zagoya-Mellado, A. Corona‐Chavez, I. Llamas-Garro
In this paper extremely compact metamaterial closed loop resonators are demonstrated and implemented in a 3 pole Chebyshev filter and a 4 pole quasi elliptic filter at 800MHz for mobile communications. Simulated and experimental results are shown.
{"title":"Miniaturized Metamaterial Filters Using Ring Resonators","authors":"Isaias Zagoya-Mellado, A. Corona‐Chavez, I. Llamas-Garro","doi":"10.1109/IMWS.2009.4814906","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814906","url":null,"abstract":"In this paper extremely compact metamaterial closed loop resonators are demonstrated and implemented in a 3 pole Chebyshev filter and a 4 pole quasi elliptic filter at 800MHz for mobile communications. Simulated and experimental results are shown.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"242 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131869262","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-04-14DOI: 10.1109/IMWS.2009.4814898
E. A. Sanjuan, S. Cahill
This paper describes a low-cost plastic QFN package capable of addressing increasing frequency needs. This package has low-loss, high-bandwidth and is based around MicroCoax interconnect technology. Since this package structure is broadband, it will easily allow for a variety of chipsets to be assembled using the same process sequence and I/O configuration, thereby eliminating costly overhead. With less than 0.5 dB insertion-loss and ≫ 15dB return-loss per RF interconnect at 50GHz, this 5×5 mm QFN package will allow existing bare-die only applications to enter the world of high-speed PCB assembly. Process technology, I/O performance, active device performance, PCB board material selection and test protocol are discussed.
本文描述了一种低成本的塑料QFN封装，能够满足日益增加的频率需求。该封装具有低损耗、高带宽和基于MicroCoax互连技术。由于这种封装结构是宽带的，它将很容易允许使用相同的过程序列和I/O配置组装各种芯片组，从而消除昂贵的开销。在50GHz下，每个RF互连的插入损耗小于0.5 dB，回波损耗大于15dB，这种5×5 mm QFN封装将允许现有的纯裸芯片应用进入高速PCB组装的世界。讨论了工艺技术、I/O性能、有源器件性能、PCB板材料选择和测试方案。
{"title":"QFN-based Millimeter Wave Packaging to 80GHz","authors":"E. A. Sanjuan, S. Cahill","doi":"10.1109/IMWS.2009.4814898","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814898","url":null,"abstract":"This paper describes a low-cost plastic QFN package capable of addressing increasing frequency needs. This package has low-loss, high-bandwidth and is based around MicroCoax interconnect technology. Since this package structure is broadband, it will easily allow for a variety of chipsets to be assembled using the same process sequence and I/O configuration, thereby eliminating costly overhead. With less than 0.5 dB insertion-loss and ≫ 15dB return-loss per RF interconnect at 50GHz, this 5×5 mm QFN package will allow existing bare-die only applications to enter the world of high-speed PCB assembly. Process technology, I/O performance, active device performance, PCB board material selection and test protocol are discussed.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133205270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-04-14DOI: 10.1109/IMWS.2009.4814905
G. Sisó, M. Gil, F. Aznar, J. Bonache, F. Martín
In this paper the most relevant applications derived from dispersion and impedance engineering in resonant type metamaterial transmission lines are highlighted. Essentially, this includes enhanced bandwidth components and dual-band components. Due to the small electrical size of the considered metamaterial resonators, size reduction is also obtained. We will provide some recent results obtained by the authors, and we will also point out future developments.
{"title":"Size Reduction and Dispersion/Impedance Engineering with Resonant Type Metamaterial Transmission Lines: Current Status and Future Applications","authors":"G. Sisó, M. Gil, F. Aznar, J. Bonache, F. Martín","doi":"10.1109/IMWS.2009.4814905","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814905","url":null,"abstract":"In this paper the most relevant applications derived from dispersion and impedance engineering in resonant type metamaterial transmission lines are highlighted. Essentially, this includes enhanced bandwidth components and dual-band components. Due to the small electrical size of the considered metamaterial resonators, size reduction is also obtained. We will provide some recent results obtained by the authors, and we will also point out future developments.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131378154","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-04-14DOI: 10.1109/IMWS.2009.4814919
J. R. Camacho-Perez, P. Moreno-Villalobos
This paper demonstrates the equivalence of spherical near-field to far-field transformations for antennas above a perfect electric conducting (PEC) ground with that of a free-space problem when the ground is replaced by the image of the measured field on the upper hemisphere. The image of the electric field is derived exactly by invoking the equivalence principle and image theory.
{"title":"Spherical Near-Field to Far-Field Transformations for the Half-Space Problem with a PEC Boundary","authors":"J. R. Camacho-Perez, P. Moreno-Villalobos","doi":"10.1109/IMWS.2009.4814919","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814919","url":null,"abstract":"This paper demonstrates the equivalence of spherical near-field to far-field transformations for antennas above a perfect electric conducting (PEC) ground with that of a free-space problem when the ground is replaced by the image of the measured field on the upper hemisphere. The image of the electric field is derived exactly by invoking the equivalence principle and image theory.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116047751","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-04-14DOI: 10.1109/IMWS.2009.4814903
T. Johansen, V. Krozer, C. Kazmierski, C. Jany, Chenhui Jiang
An improved electromagnetic simulation (EM) based approach has been developed for optimization of the electrical to optical (E/O) transmission properties of integrated electro-absorption modulated lasers (EMLs) aiming at 100 Gbit/s Ethernet applications. Our approach allows for an accurate analysis of the EML performance in a hybrid microstrip assembly. The established EM-based approach provides a design methodology for the future hybrid integration of the EML with its driving electronics.
{"title":"Analysis of Hybrid-Integrated High-Speed Electro-Absorption Modulated Lasers Based on EM/Circuit Co-simulation","authors":"T. Johansen, V. Krozer, C. Kazmierski, C. Jany, Chenhui Jiang","doi":"10.1109/IMWS.2009.4814903","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814903","url":null,"abstract":"An improved electromagnetic simulation (EM) based approach has been developed for optimization of the electrical to optical (E/O) transmission properties of integrated electro-absorption modulated lasers (EMLs) aiming at 100 Gbit/s Ethernet applications. Our approach allows for an accurate analysis of the EML performance in a hybrid microstrip assembly. The established EM-based approach provides a design methodology for the future hybrid integration of the EML with its driving electronics.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131988842","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-04-14DOI: 10.1109/IMWS.2009.4814914
Kazunori Watanabe, T. Sekine, Yasuhiro Takahashi
A 1D finite-difference time-domain (FDTD) method for nonuniform transmission line analysis by using wavelet expansion is presented. The approach are based on scaling functions only or on a combination of scaling functions and wavelets leading to a variable mesh griding. The proposed schemes compared to the conventional Yee's FDTD scheme shows a good capability to approximate the exact solution with negligible error for sampling rates approaching the Nyquist limit. A linear tapered transmission line that is one of models of interconnect is analyzed in order to illustrate the application of this method and to demonstrate the advantages over Yee's FDTD scheme with respect to memory requirements and execution time. And to show the stableness, eye diagram analysis for lossy uniform transmission line is shown.
{"title":"A FDTD method for Nonuniform Transmission Line Analysis Using Yee's-lattice and Wavelet Expansion","authors":"Kazunori Watanabe, T. Sekine, Yasuhiro Takahashi","doi":"10.1109/IMWS.2009.4814914","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814914","url":null,"abstract":"A 1D finite-difference time-domain (FDTD) method for nonuniform transmission line analysis by using wavelet expansion is presented. The approach are based on scaling functions only or on a combination of scaling functions and wavelets leading to a variable mesh griding. The proposed schemes compared to the conventional Yee's FDTD scheme shows a good capability to approximate the exact solution with negligible error for sampling rates approaching the Nyquist limit. A linear tapered transmission line that is one of models of interconnect is analyzed in order to illustrate the application of this method and to demonstrate the advantages over Yee's FDTD scheme with respect to memory requirements and execution time. And to show the stableness, eye diagram analysis for lossy uniform transmission line is shown.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121949832","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-04-14DOI: 10.1109/IMWS.2009.4814920
J. Huerta-Chua, R. Murphy‐Arteaga
The effects of the self inductance associated with interconnection lines in integrated circuits have become extremely important when judging the performance of RF circuits, and thus, its modeling and characterization is an ongoing effort worldwide. This paper aims to contribute to this effort, proposing a modified model that is both simple and physically based, to calculate the self inductance of the metal lines used in modern IC designs. Most of the published models and techniques were analyzed and compared to experimental data, and one of these was modified to take into account the rectangular geometry of interconnect lines, showing a much better agreement with experiment. Interconnect lines designed for this purpose were fabricated using a standard CMOS process (AMIS 0.35¿m), and measured in the frequency range from 40MHz to 50GHz.
{"title":"A Modified Model for the Self Inductance of Metal Lines on Si","authors":"J. Huerta-Chua, R. Murphy‐Arteaga","doi":"10.1109/IMWS.2009.4814920","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814920","url":null,"abstract":"The effects of the self inductance associated with interconnection lines in integrated circuits have become extremely important when judging the performance of RF circuits, and thus, its modeling and characterization is an ongoing effort worldwide. This paper aims to contribute to this effort, proposing a modified model that is both simple and physically based, to calculate the self inductance of the metal lines used in modern IC designs. Most of the published models and techniques were analyzed and compared to experimental data, and one of these was modified to take into account the rectangular geometry of interconnect lines, showing a much better agreement with experiment. Interconnect lines designed for this purpose were fabricated using a standard CMOS process (AMIS 0.35¿m), and measured in the frequency range from 40MHz to 50GHz.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127826576","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-04-14DOI: 10.1109/IMWS.2009.4814922
A. Mineyama, T. Suzuki, Hiroyuki Ito, S. Amakawa, N. Ishihara, K. Masu
A 9.5 mW 20 Gb/s 40×70 ¿m2 inductorless 1:4 DEMUX in 90 nm CMOS process is presented. In order to reduce power and area, the DEMUX uses a multi-phase clock architecture that requires a smaller number of latches operating at a slower clock rate than in the conventional tree architecture. To provide low-voltage scalability, the latches operate with a near-tail-to-rail logic swing. It is realized without significant speed penalty by adopting current-sourceless CML-type latches with unconventional settings. It offers a larger noise margin and elimination of logic level converters too. The well-balanced scalable design could possibly broaden the applications of high-speed SerDes in the coming ultralow-voltage many-core era.
{"title":"A 20 Gb/s 1:4 DEMUX with Near-Rail-to-Rail Logic Swing in 90 nm CMOS process","authors":"A. Mineyama, T. Suzuki, Hiroyuki Ito, S. Amakawa, N. Ishihara, K. Masu","doi":"10.1109/IMWS.2009.4814922","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814922","url":null,"abstract":"A 9.5 mW 20 Gb/s 40×70 ¿m2 inductorless 1:4 DEMUX in 90 nm CMOS process is presented. In order to reduce power and area, the DEMUX uses a multi-phase clock architecture that requires a smaller number of latches operating at a slower clock rate than in the conventional tree architecture. To provide low-voltage scalability, the latches operate with a near-tail-to-rail logic swing. It is realized without significant speed penalty by adopting current-sourceless CML-type latches with unconventional settings. It offers a larger noise margin and elimination of logic level converters too. The well-balanced scalable design could possibly broaden the applications of high-speed SerDes in the coming ultralow-voltage many-core era.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121249242","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-04-14DOI: 10.1109/IMWS.2009.4814912
A. Kashi, Niladri Roy, Ege Engin, V. Devabhaktuni
A new adaptive multi-dimensional RF/microwave modeling algorithm based on rational interpolants is proposed. For the first time, the algorithm integrates rational functions, genetic concepts, and frequency mapping into a unified CAD tool, which facilitates accurate and fast EM based RF/microwave modeling. Given an RF/microwave modeling problem, highly non-linear and relatively less non-linear model inputs are distinguishable. The algorithm consists of two phases. Starting with a minimal number of EM data and with lowest-order rational functions, Phase 1 systematically produces a sub-model with highly non-linear inputs alone. In Phase 2, an initial overall model is first constructed based on the above sub-model. A hybrid mapping then fine-tunes the initial model to capture the RF/microwave tendencies w.r.t. the less non-linear inputs. The algorithm is illustrated through a practical example.
{"title":"A New Multi-Dimensional RF and Microwave Modeling Algorithm Based on Rational Interpolants and Hybrid Mapping","authors":"A. Kashi, Niladri Roy, Ege Engin, V. Devabhaktuni","doi":"10.1109/IMWS.2009.4814912","DOIUrl":"https://doi.org/10.1109/IMWS.2009.4814912","url":null,"abstract":"A new adaptive multi-dimensional RF/microwave modeling algorithm based on rational interpolants is proposed. For the first time, the algorithm integrates rational functions, genetic concepts, and frequency mapping into a unified CAD tool, which facilitates accurate and fast EM based RF/microwave modeling. Given an RF/microwave modeling problem, highly non-linear and relatively less non-linear model inputs are distinguishable. The algorithm consists of two phases. Starting with a minimal number of EM data and with lowest-order rational functions, Phase 1 systematically produces a sub-model with highly non-linear inputs alone. In Phase 2, an initial overall model is first constructed based on the above sub-model. A hybrid mapping then fine-tunes the initial model to capture the RF/microwave tendencies w.r.t. the less non-linear inputs. The algorithm is illustrated through a practical example.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132776026","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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