Pub Date : 2018-09-27DOI: 10.1504/IJAT.2018.10016145
Jianguo Cao, Yueming Liu, Nie Meng, Qinjian Zhang
Grinding force and stress in the ultrasonic assisted grinding (UAG) influence on the material removal behaviour. In this study, the simulation investigation of the material removal process, by ultrasonic assisted scratching (UAS) of silicon carbide using a single abrasive grain in UAG was conducted, to reveal the grinding force and stress variation behaviour. Conventional scratching (CS) without ultrasonic vibration was also carried out on the same condition for comparison. The results showed that: 1) the cutting forces in UAS undergo a periodic sinusoidal change, whereas those in CS are basically stabilised to a certain level after the tool cuts into the workpiece completely; 2) the stress distribution fields on the cross and top surfaces along the cutting direction become wider in UAS than in CS; 3) the kinetic energy of the grain consumed in UAS is bigger than that in CS, leading to the impact of the grain on the workpiece.
{"title":"Simulation investigation into mechanics behaviour in material removal process of ultrasonic assisted grinding of silicon carbide ceramics","authors":"Jianguo Cao, Yueming Liu, Nie Meng, Qinjian Zhang","doi":"10.1504/IJAT.2018.10016145","DOIUrl":"https://doi.org/10.1504/IJAT.2018.10016145","url":null,"abstract":"Grinding force and stress in the ultrasonic assisted grinding (UAG) influence on the material removal behaviour. In this study, the simulation investigation of the material removal process, by ultrasonic assisted scratching (UAS) of silicon carbide using a single abrasive grain in UAG was conducted, to reveal the grinding force and stress variation behaviour. Conventional scratching (CS) without ultrasonic vibration was also carried out on the same condition for comparison. The results showed that: 1) the cutting forces in UAS undergo a periodic sinusoidal change, whereas those in CS are basically stabilised to a certain level after the tool cuts into the workpiece completely; 2) the stress distribution fields on the cross and top surfaces along the cutting direction become wider in UAS than in CS; 3) the kinetic energy of the grain consumed in UAS is bigger than that in CS, leading to the impact of the grain on the workpiece.","PeriodicalId":39039,"journal":{"name":"International Journal of Abrasive Technology","volume":"8 1","pages":"310"},"PeriodicalIF":0.0,"publicationDate":"2018-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46013841","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-27DOI: 10.1504/IJAT.2018.10016143
Q. Ren, Xin Wei
Carrying out silicon wafer self-rotating grinding using a cup-type diamond grinding wheel is a typical ultra-precision machining technique of silicon wafers. Studying the mechanism of the self-rotating grinding is the basis of the processing. The research takes the microcontact between the micro-element in the grinding wheel and the silicon wafer extracted during the steady ductile-regime grinding as the object and builds a mechanical model. On this basis, the research investigates the microscopic mechanism of the self-rotating grinding using the force decomposition method. The force decomposition in the normal direction using the Hertz theory in contact mechanics and the cavity model obtained the distributions of the load and stress on the silicon wafer in the elastic and plastic contact, as well as the corresponding stress distribution on the micro-element in the grinding wheel. The force decomposition in the tangential direction based on the microscopic friction theory yields the sliding friction. The superposition of normal and tangential forces reveals the overall distribution of microcontact stress. The analysis results are validated by comparing with corresponding experimental and simulation results.
{"title":"Microcontact mechanism in silicon wafer self-rotating grinding based on force decomposition","authors":"Q. Ren, Xin Wei","doi":"10.1504/IJAT.2018.10016143","DOIUrl":"https://doi.org/10.1504/IJAT.2018.10016143","url":null,"abstract":"Carrying out silicon wafer self-rotating grinding using a cup-type diamond grinding wheel is a typical ultra-precision machining technique of silicon wafers. Studying the mechanism of the self-rotating grinding is the basis of the processing. The research takes the microcontact between the micro-element in the grinding wheel and the silicon wafer extracted during the steady ductile-regime grinding as the object and builds a mechanical model. On this basis, the research investigates the microscopic mechanism of the self-rotating grinding using the force decomposition method. The force decomposition in the normal direction using the Hertz theory in contact mechanics and the cavity model obtained the distributions of the load and stress on the silicon wafer in the elastic and plastic contact, as well as the corresponding stress distribution on the micro-element in the grinding wheel. The force decomposition in the tangential direction based on the microscopic friction theory yields the sliding friction. The superposition of normal and tangential forces reveals the overall distribution of microcontact stress. The analysis results are validated by comparing with corresponding experimental and simulation results.","PeriodicalId":39039,"journal":{"name":"International Journal of Abrasive Technology","volume":"8 1","pages":"278"},"PeriodicalIF":0.0,"publicationDate":"2018-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46312823","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-27DOI: 10.1504/IJAT.2018.10016144
Tao Zhang, Feng Qin, Qian Wanghuan, Lijun Zhang, F. Sun
The performances of CVD microcrystalline diamond powders by the seeding and self-nucleation method, including the particle size composition, crystal morphology, and diamond purity, are evaluated by the China industry standard of conventional diamond powders (JB/T 7990-2012). The detection results show over 80% particles grown on the seeds exhibit a cubo-octahedral with smooth surfaces and no obvious growth defects, while they can hardly meet the corresponding commercial requirements of particle size composition due to the existence of 10%-23% spontaneous particles (0.5~1.2 μm). For the powders deposited by self-nucleation method, the particle size composition agrees well with the model defined by the industry standard, and 70.5% crystals exhibit the cubo-octahedral or icosahedron morphology, as well as their surface quality are little worse than those grown on the seeds due to unwanted secondary nucleation. Besides, the two types of CVD powders have a high purity detected by micro-Raman spectroscopy.
{"title":"Characterisation of microcrystalline diamonds deposited by HFCVD","authors":"Tao Zhang, Feng Qin, Qian Wanghuan, Lijun Zhang, F. Sun","doi":"10.1504/IJAT.2018.10016144","DOIUrl":"https://doi.org/10.1504/IJAT.2018.10016144","url":null,"abstract":"The performances of CVD microcrystalline diamond powders by the seeding and self-nucleation method, including the particle size composition, crystal morphology, and diamond purity, are evaluated by the China industry standard of conventional diamond powders (JB/T 7990-2012). The detection results show over 80% particles grown on the seeds exhibit a cubo-octahedral with smooth surfaces and no obvious growth defects, while they can hardly meet the corresponding commercial requirements of particle size composition due to the existence of 10%-23% spontaneous particles (0.5~1.2 μm). For the powders deposited by self-nucleation method, the particle size composition agrees well with the model defined by the industry standard, and 70.5% crystals exhibit the cubo-octahedral or icosahedron morphology, as well as their surface quality are little worse than those grown on the seeds due to unwanted secondary nucleation. Besides, the two types of CVD powders have a high purity detected by micro-Raman spectroscopy.","PeriodicalId":39039,"journal":{"name":"International Journal of Abrasive Technology","volume":"8 1","pages":"292"},"PeriodicalIF":0.0,"publicationDate":"2018-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49414818","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-27DOI: 10.1504/IJAT.2019.10016147
Wei Liu, Z. Deng, Zhouqiang Xiao
The bearing steel such as 100Cr6 offers many desirable characteristics for industrial use in terms of its excellent qualities of high hardness, high wear resistance and high contact fatigue strength. For the usage in the bearing, cylindrical grinding should be adopted to machine 100Cr6. In order to ensure processing quality and processing efficiency, it is necessary to carry out high speed grinding. Therefore, the orthogonal experiments of high speed cylindrical plunge grinding (HSCPG) were carried out on the annealed 100Cr6 with a ceramic bonded cubic boron nitride (cBN) grinding wheel, to study the effects of grinding wheel speed, workpiece speed and grinding depth on the grinding force, grinding temperature, surface roughness, surface morphology, surface hardening and deteriorative layer. The study demonstrates that a larger material removal rate and a better surface integrity can be achieved simultaneously by a large grinding wheel speed, a moderate workpiece speed and grinding depth.
{"title":"Experimental study on the characteristics of high speed cylindrical plunge grinding for annealed bearing steel 100Cr6","authors":"Wei Liu, Z. Deng, Zhouqiang Xiao","doi":"10.1504/IJAT.2019.10016147","DOIUrl":"https://doi.org/10.1504/IJAT.2019.10016147","url":null,"abstract":"The bearing steel such as 100Cr6 offers many desirable characteristics for industrial use in terms of its excellent qualities of high hardness, high wear resistance and high contact fatigue strength. For the usage in the bearing, cylindrical grinding should be adopted to machine 100Cr6. In order to ensure processing quality and processing efficiency, it is necessary to carry out high speed grinding. Therefore, the orthogonal experiments of high speed cylindrical plunge grinding (HSCPG) were carried out on the annealed 100Cr6 with a ceramic bonded cubic boron nitride (cBN) grinding wheel, to study the effects of grinding wheel speed, workpiece speed and grinding depth on the grinding force, grinding temperature, surface roughness, surface morphology, surface hardening and deteriorative layer. The study demonstrates that a larger material removal rate and a better surface integrity can be achieved simultaneously by a large grinding wheel speed, a moderate workpiece speed and grinding depth.","PeriodicalId":39039,"journal":{"name":"International Journal of Abrasive Technology","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2018-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"45869745","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-09-27DOI: 10.1504/IJAT.2018.10016142
Y. Gong, Yao Sun, Xiaoteng Ma
The demand for microelectrodes has greatly increased when the micromachining techniques have become a hot issue in modern industry. The non-contact of EDM process makes it have the unique superiority in fabricating microelectrodes. Therefore, this paper proposed a low speed wire electrical discharge turning (LS-WEDT) method to fabricate microelectrodes. Firstly, the influence of speed parameters including the rotated speed (Vn), feeding speed (Vs) and wire speed (Vw) involved in LS-WEDT are discussed. More importantly, the microelectrode made of CuW70 material with diameter of 58 μm is firstly and successfully fabricated by LS-WEDT. Furthermore, the scanning electron microscope observations disclosed that the microelectrode has good surface quality and high machining precision without ridges and bending. Besides, many small micro-voids with the diameter less than 1 μm can be observed on the microelectrode surface. Finally, the energy dispersive spectrograph analysis suggested the presence of foreign elements including zinc and oxygen on the microelectrode surface machined by LS-WEDT.
{"title":"An experimental study for evaluating speed parameters on surface roughness of LS-WEDT and its application in fabricating microelectrodes","authors":"Y. Gong, Yao Sun, Xiaoteng Ma","doi":"10.1504/IJAT.2018.10016142","DOIUrl":"https://doi.org/10.1504/IJAT.2018.10016142","url":null,"abstract":"The demand for microelectrodes has greatly increased when the micromachining techniques have become a hot issue in modern industry. The non-contact of EDM process makes it have the unique superiority in fabricating microelectrodes. Therefore, this paper proposed a low speed wire electrical discharge turning (LS-WEDT) method to fabricate microelectrodes. Firstly, the influence of speed parameters including the rotated speed (Vn), feeding speed (Vs) and wire speed (Vw) involved in LS-WEDT are discussed. More importantly, the microelectrode made of CuW70 material with diameter of 58 μm is firstly and successfully fabricated by LS-WEDT. Furthermore, the scanning electron microscope observations disclosed that the microelectrode has good surface quality and high machining precision without ridges and bending. Besides, many small micro-voids with the diameter less than 1 μm can be observed on the microelectrode surface. Finally, the energy dispersive spectrograph analysis suggested the presence of foreign elements including zinc and oxygen on the microelectrode surface machined by LS-WEDT.","PeriodicalId":39039,"journal":{"name":"International Journal of Abrasive Technology","volume":"8 1","pages":"261"},"PeriodicalIF":0.0,"publicationDate":"2018-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42362142","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-22DOI: 10.1504/IJAT.2018.10015268
Sirsendu Mahata, J. Roy, A. Samanta, B. Mandal, Santanu Das
The process of grinding is normally associated with generation of considerable amount of heat. To reduce thermal damages, grinding zone is often flooded with liquid coolant, most of which is wasted and may cause severe environmental pollution. In the present work, grindability of hardened AISI 4340 steel is assessed at various infeeds, using an eco-friendly vegetable oil applied by small quantity lubrication (SQL) technique, so as to reduce the quantity of coolant. At the same infeed, grinding is also performed by applying a uniform layer of semi-solid lubricant (grease) on the work surface. Comparison is made between the two methods in terms of force, surface roughness, specific grinding energy and observed chip forms. Results prove that SQL technique using vegetable oil is better than grease as a lubricant in terms of force requirement, while surface quality shows improvement with grease layer lapped on the work surface than with SQL technique.
{"title":"Effect of small quantity lubrication on grindability of hardened AISI 4340 steel","authors":"Sirsendu Mahata, J. Roy, A. Samanta, B. Mandal, Santanu Das","doi":"10.1504/IJAT.2018.10015268","DOIUrl":"https://doi.org/10.1504/IJAT.2018.10015268","url":null,"abstract":"The process of grinding is normally associated with generation of considerable amount of heat. To reduce thermal damages, grinding zone is often flooded with liquid coolant, most of which is wasted and may cause severe environmental pollution. In the present work, grindability of hardened AISI 4340 steel is assessed at various infeeds, using an eco-friendly vegetable oil applied by small quantity lubrication (SQL) technique, so as to reduce the quantity of coolant. At the same infeed, grinding is also performed by applying a uniform layer of semi-solid lubricant (grease) on the work surface. Comparison is made between the two methods in terms of force, surface roughness, specific grinding energy and observed chip forms. Results prove that SQL technique using vegetable oil is better than grease as a lubricant in terms of force requirement, while surface quality shows improvement with grease layer lapped on the work surface than with SQL technique.","PeriodicalId":39039,"journal":{"name":"International Journal of Abrasive Technology","volume":"8 1","pages":"171"},"PeriodicalIF":0.0,"publicationDate":"2018-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"41952848","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-22DOI: 10.1504/IJAT.2018.10015292
Liang Huazhuo, Jiabin Lu, Q. Yan, Taowen Song
Aiming at production of single-crystal SiC for chemical mechanical polishing, Fenton reaction, and catalytic efficiency of FeSO4, Fe2(SO4)3, FeO, Fe3O4, and Fe2O3 were studied. The mechanical properties are obtained by nanoindentation experiments. Different catalysts can promote Fenton reaction, and all reaction layers formed with the same chemical composition, atomic structure, and hardness at 1.5 GPa. When Fe3O4 was used as catalyst in Fenton reaction, the effect was optimal because its hardness and modulus remained low. After 2 min, the thickness of reaction layer had reached 200 nm, which can fully meet requirements of CMP. Fenton reaction depends on ability of catalyst to ionise Fe2+. The higher concentration of Fe2+, the higher concentration of OH, and the faster reaction rate of SiC surface material.
{"title":"Chemical catalysts of Fenton reaction for single-crystal SiC based on nanoindentation","authors":"Liang Huazhuo, Jiabin Lu, Q. Yan, Taowen Song","doi":"10.1504/IJAT.2018.10015292","DOIUrl":"https://doi.org/10.1504/IJAT.2018.10015292","url":null,"abstract":"Aiming at production of single-crystal SiC for chemical mechanical polishing, Fenton reaction, and catalytic efficiency of FeSO4, Fe2(SO4)3, FeO, Fe3O4, and Fe2O3 were studied. The mechanical properties are obtained by nanoindentation experiments. Different catalysts can promote Fenton reaction, and all reaction layers formed with the same chemical composition, atomic structure, and hardness at 1.5 GPa. When Fe3O4 was used as catalyst in Fenton reaction, the effect was optimal because its hardness and modulus remained low. After 2 min, the thickness of reaction layer had reached 200 nm, which can fully meet requirements of CMP. Fenton reaction depends on ability of catalyst to ionise Fe2+. The higher concentration of Fe2+, the higher concentration of OH, and the faster reaction rate of SiC surface material.","PeriodicalId":39039,"journal":{"name":"International Journal of Abrasive Technology","volume":"8 1","pages":"232"},"PeriodicalIF":0.0,"publicationDate":"2018-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"49076876","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-22DOI: 10.1504/IJAT.2018.10015291
G. Selvakumar, S. Prakash, N. Lenin
The objective of this study is to present the optimal machining parameters for abrasive water jet machining (AWJM) of Aluminium alloy 5083 (AA5083) by employing artificial neural networks (ANN) modelling for various material thicknesses. Al 5083 alloy finds vast applications in ship building, rail cars, and vehicle bodies and exclusively for cryogenic applications. The experimental work was carried out by using Taguchi L18 orthogonal array to study the influence of the process parameters such as jet diameter, stand-off distance and abrasive flow rate for various ranges of thicknesses over the process yields namely material removal rate (mrr), surface roughness and taper error. Technological table for optimal machining of AA5083 alloy in AWJM was reported for ready to use in industry.
{"title":"Experimental study on abrasive water jet machining of AA5083 in a range of thicknesses","authors":"G. Selvakumar, S. Prakash, N. Lenin","doi":"10.1504/IJAT.2018.10015291","DOIUrl":"https://doi.org/10.1504/IJAT.2018.10015291","url":null,"abstract":"The objective of this study is to present the optimal machining parameters for abrasive water jet machining (AWJM) of Aluminium alloy 5083 (AA5083) by employing artificial neural networks (ANN) modelling for various material thicknesses. Al 5083 alloy finds vast applications in ship building, rail cars, and vehicle bodies and exclusively for cryogenic applications. The experimental work was carried out by using Taguchi L18 orthogonal array to study the influence of the process parameters such as jet diameter, stand-off distance and abrasive flow rate for various ranges of thicknesses over the process yields namely material removal rate (mrr), surface roughness and taper error. Technological table for optimal machining of AA5083 alloy in AWJM was reported for ready to use in industry.","PeriodicalId":39039,"journal":{"name":"International Journal of Abrasive Technology","volume":"8 1","pages":"218"},"PeriodicalIF":0.0,"publicationDate":"2018-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"47260593","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-22DOI: 10.1504/IJAT.2018.10015277
Yanfen Lin, C. Fang
Segmentation of abrasive images of diamond tools is the most important part of computer vision, which is the basis for detecting the state of diamond tools, such as the characteristics of diamond number, distribution, size and state. As diamond images have rich irregular background textures and reflective features, it is a major challenge to detect and segment these diamond images. The present work demonstrates an invalid edge elimination method for such images to segment and mat the diamond grains, which mainly consists of histogram, edge detection, and morphology. Based on the method, the part of diamond in the original images can be accurately and effectively segmented and matted. Then, the method is also used to segment and mat the diamond grains in other images of different diamond tools, and it also has a good segmenting and matting effect. Finally, the segmented and extracted diamond grains are used to analyse the diamond number, density and its wear state, the result indicates that the proposed method can be used in diamond tool detection.
{"title":"Study on the segmentation of abrasive grains in diamond tools","authors":"Yanfen Lin, C. Fang","doi":"10.1504/IJAT.2018.10015277","DOIUrl":"https://doi.org/10.1504/IJAT.2018.10015277","url":null,"abstract":"Segmentation of abrasive images of diamond tools is the most important part of computer vision, which is the basis for detecting the state of diamond tools, such as the characteristics of diamond number, distribution, size and state. As diamond images have rich irregular background textures and reflective features, it is a major challenge to detect and segment these diamond images. The present work demonstrates an invalid edge elimination method for such images to segment and mat the diamond grains, which mainly consists of histogram, edge detection, and morphology. Based on the method, the part of diamond in the original images can be accurately and effectively segmented and matted. Then, the method is also used to segment and mat the diamond grains in other images of different diamond tools, and it also has a good segmenting and matting effect. Finally, the segmented and extracted diamond grains are used to analyse the diamond number, density and its wear state, the result indicates that the proposed method can be used in diamond tool detection.","PeriodicalId":39039,"journal":{"name":"International Journal of Abrasive Technology","volume":"8 1","pages":"203"},"PeriodicalIF":0.0,"publicationDate":"2018-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"46343753","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-08-22DOI: 10.1504/IJAT.2018.10015439
K. Anbarasu, L. Vijayaraghavan, N. Arunachalam
Fluid jet polishing process is an inexpensive technique and capable to produce ultra-smooth surface. In fluid jet polishing process, the surface generation mainly depends upon the size and type of the abrasive particle, the jet pressure, the exposure time, the impact angle, etc. In this work, experimental investigation were carried out to study the influence of different slurry exposure time on surface roughness of optical glass with varying jet pressure, particle diameter and type of particle at 30° impact angle. The surface roughness measurement and surface morphology characterisation were done to understand the surface changes.
{"title":"Experimental study on surface generation in optical glass with fluid jet polishing process","authors":"K. Anbarasu, L. Vijayaraghavan, N. Arunachalam","doi":"10.1504/IJAT.2018.10015439","DOIUrl":"https://doi.org/10.1504/IJAT.2018.10015439","url":null,"abstract":"Fluid jet polishing process is an inexpensive technique and capable to produce ultra-smooth surface. In fluid jet polishing process, the surface generation mainly depends upon the size and type of the abrasive particle, the jet pressure, the exposure time, the impact angle, etc. In this work, experimental investigation were carried out to study the influence of different slurry exposure time on surface roughness of optical glass with varying jet pressure, particle diameter and type of particle at 30° impact angle. The surface roughness measurement and surface morphology characterisation were done to understand the surface changes.","PeriodicalId":39039,"journal":{"name":"International Journal of Abrasive Technology","volume":"8 1","pages":"245"},"PeriodicalIF":0.0,"publicationDate":"2018-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"47467790","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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