The rapid development in wireless networking has been witnessed in past several years, which aimed on high speed and long range applications. There are different protocol standards used for the short range wireless communication namely the Bluetooth, ZigBee, Wimax and Wi-Fi. Among these standards ZigBee is based on IEEE 802.15.4 protocol can meet a wider variety of real industrial needs due to its long-term battery operation and reliability of the mesh networking architecture. The increasing demand for low data rate and low power networking led to the development of ZigBee technology. This technology was developed for Wireless Personal Area Networks (WPAN), directed at control and military applications, where low cost, low data rate, and more battery life were main requirements. This paper presents VerilogHDL simulation of the Top level module (Cyclic Redundancy Check, Bit-to-Symbol block, Symbol-to-Chip block, OQPSK block and Pulse shaping) of the ZigBee transmitter for IoT applications.
{"title":"ZigBee Transmitter for IoT Wireless Devices","authors":"A. Mounica, G. Subbareddy","doi":"10.2139/ssrn.3377852","DOIUrl":"https://doi.org/10.2139/ssrn.3377852","url":null,"abstract":"The rapid development in wireless networking has been witnessed in past several years, which aimed on high speed and long range applications. There are different protocol standards used for the short range wireless communication namely the Bluetooth, ZigBee, Wimax and Wi-Fi. Among these standards ZigBee is based on IEEE 802.15.4 protocol can meet a wider variety of real industrial needs due to its long-term battery operation and reliability of the mesh networking architecture. The increasing demand for low data rate and low power networking led to the development of ZigBee technology. This technology was developed for Wireless Personal Area Networks (WPAN), directed at control and military applications, where low cost, low data rate, and more battery life were main requirements. This paper presents VerilogHDL simulation of the Top level module (Cyclic Redundancy Check, Bit-to-Symbol block, Symbol-to-Chip block, OQPSK block and Pulse shaping) of the ZigBee transmitter for IoT applications.","PeriodicalId":412391,"journal":{"name":"ChemRN: Materials Processing (Topic)","volume":"106 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115768152","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The Baugh-Wooley algorithm is a well-known iterative algorithm for performing multiplication in digital signal processing applications. Decomposition logic is used with Baugh-Wooley algorithm to enhance the speed and to reduce the critical path delay. In this paper a high speed multiplier is designed and implemented using decomposition logic and Baugh-Wooley algorithm. The result is compared with booth multiplier. FPGA based architecture is presented and design has been implemented using Xilinx 12.3 device.
{"title":"FPGA Implementation of High Speed Baugh-Wooley Multiplier Using Decomposition Logic","authors":"A. Kiran, Navdeep Prashar","doi":"10.5121/eeiej.2015.2301","DOIUrl":"https://doi.org/10.5121/eeiej.2015.2301","url":null,"abstract":"The Baugh-Wooley algorithm is a well-known iterative algorithm for performing multiplication in digital signal processing applications. Decomposition logic is used with Baugh-Wooley algorithm to enhance the speed and to reduce the critical path delay. In this paper a high speed multiplier is designed and implemented using decomposition logic and Baugh-Wooley algorithm. The result is compared with booth multiplier. FPGA based architecture is presented and design has been implemented using Xilinx 12.3 device.","PeriodicalId":412391,"journal":{"name":"ChemRN: Materials Processing (Topic)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-08-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121771808","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
León Romano Brandt, A. Reza, E. Salvati, E. Le Bourhis, F. Hofmann, A. Korsunsky
The effect of magnetron deposition pressure during manufacture of W/Cu nano-laminates on their thermal diffusivity, residual stress depth profiles and texture was analysed. A strong correlation between these properties and the Ar working pressure was confirmed experimentally via a combination of Transient Grating Spectroscopy, Focused Ion Beam ring drilling, and cross-sectional high resolution SEM and EDX characterisation. The underlying mechanisms controlling thermal diffusivity and residual stress can be related to the defect evolution during sputter deposition, which is largely controlled by the interaction of the working gas and the sputtered metal atoms.
{"title":"Controlling Thermal Diffusivity, Residual Stress and Texture in W/Cu Nano-Multilayers by Magnetron Chamber Pressure Variation","authors":"León Romano Brandt, A. Reza, E. Salvati, E. Le Bourhis, F. Hofmann, A. Korsunsky","doi":"10.2139/ssrn.3708723","DOIUrl":"https://doi.org/10.2139/ssrn.3708723","url":null,"abstract":"The effect of magnetron deposition pressure during manufacture of W/Cu nano-laminates on their thermal diffusivity, residual stress depth profiles and texture was analysed. A strong correlation between these properties and the Ar working pressure was confirmed experimentally via a combination of Transient Grating Spectroscopy, Focused Ion Beam ring drilling, and cross-sectional high resolution SEM and EDX characterisation. The underlying mechanisms controlling thermal diffusivity and residual stress can be related to the defect evolution during sputter deposition, which is largely controlled by the interaction of the working gas and the sputtered metal atoms.","PeriodicalId":412391,"journal":{"name":"ChemRN: Materials Processing (Topic)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114440465","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Zhiying Liu, Hongze Wang, M. Haché, X. Chu, E. Irissou, Y. Zou
Cold spray processing is a solid-state coating technique and an emerging method for additive manufacturing, in which metal powder particles are bonded through high-velocity impact-induced deformation. However, the severe plastic deformation of powder particles at extremely high strain rates, high strain gradients, and localized elevated temperatures yields rather complex and heterogeneous microstructures in materials produced as coatings or bulk forms. A good understanding, and even prediction, of such heterogeneous microstructures is essential for determining the post-processing conditions as well as the final properties of cold-sprayed products. In this study, we employ a cold spray system to deposit copper coatings over a large temperature range from 373 K to 873 K and we systematically investigate the microstructural evolutions of the coatings using electron backscatter diffraction (EBSD) and transmission electron microscopy (TEM) techniques. Diverse microstructures have been observed, including recrystallized grains, annealing twins, shear bands, submicron grains, deformation twins, and nanometer-sized grains. To understand the formation of such complex microstructures, we obtain local strains, strain rates and temperatures of the cold-sprayed powder particles using the finite element method (FEM). Based on our experimental and simulation results, we created the first deformation mechanism map for cold sprayed coatings to interpret and predict the heterogeneous microstructural evolutions in copper using the local Zener-Hollomon (Z) parameter and plastic strain (strain-Z-microstructure map). Such a map can be used to predict and design the microstructures of cold-sprayed copper samples based on processing parameters and can also be extended to other severe plastic deformation (SPD) processes, such as cutting, extrusion, and solid-phase welding.
{"title":"Prediction of Heterogeneous Microstructural Evolution in Cold-Sprayed Copper Coatings Using Local Zener-Hollomon Parameter and Strain","authors":"Zhiying Liu, Hongze Wang, M. Haché, X. Chu, E. Irissou, Y. Zou","doi":"10.2139/ssrn.3542971","DOIUrl":"https://doi.org/10.2139/ssrn.3542971","url":null,"abstract":"Cold spray processing is a solid-state coating technique and an emerging method for additive manufacturing, in which metal powder particles are bonded through high-velocity impact-induced deformation. However, the severe plastic deformation of powder particles at extremely high strain rates, high strain gradients, and localized elevated temperatures yields rather complex and heterogeneous microstructures in materials produced as coatings or bulk forms. A good understanding, and even prediction, of such heterogeneous microstructures is essential for determining the post-processing conditions as well as the final properties of cold-sprayed products. In this study, we employ a cold spray system to deposit copper coatings over a large temperature range from 373 K to 873 K and we systematically investigate the microstructural evolutions of the coatings using electron backscatter diffraction (EBSD) and transmission electron microscopy (TEM) techniques. Diverse microstructures have been observed, including recrystallized grains, annealing twins, shear bands, submicron grains, deformation twins, and nanometer-sized grains. To understand the formation of such complex microstructures, we obtain local strains, strain rates and temperatures of the cold-sprayed powder particles using the finite element method (FEM). Based on our experimental and simulation results, we created the first deformation mechanism map for cold sprayed coatings to interpret and predict the heterogeneous microstructural evolutions in copper using the local Zener-Hollomon (Z) parameter and plastic strain (strain-Z-microstructure map). Such a map can be used to predict and design the microstructures of cold-sprayed copper samples based on processing parameters and can also be extended to other severe plastic deformation (SPD) processes, such as cutting, extrusion, and solid-phase welding.","PeriodicalId":412391,"journal":{"name":"ChemRN: Materials Processing (Topic)","volume":"80 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122421841","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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