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3D and Circuit Integration of MEMS最新文献

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Metal Surface Micromachining 金属表面微加工
3D and Circuit Integration of MEMS
Pub Date : 2021-04-23 DOI: 10.1002/9783527823239.ch6
M. Sasaki
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引用次数: 0
MEMS Using CMOS Wafer 采用CMOS晶圆的MEMS
3D and Circuit Integration of MEMS
Pub Date : 2021-04-23 DOI: 10.1002/9783527823239.ch8
W. Fang, Sheng-Shian Li, Yi Chiu, Ming-Huang Li
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引用次数: 1
Packaging, Sealing, and Interconnection 包装、密封、互连
3D and Circuit Integration of MEMS
Pub Date : 2021-04-23 DOI: 10.1002/9783527823239.ch17
M. Esashi
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引用次数: 2
Soldering by Local Heating 局部加热焊接
3D and Circuit Integration of MEMS
Pub Date : 2021-04-23 DOI: 10.1002/9783527823239.ch16
Yu-Ting Cheng, Liwei Lin
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引用次数: 0
Direct Bonding 直接键合
3D and Circuit Integration of MEMS
Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch12
H. Takagi
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引用次数: 1
Piezoelectric MEMS 压电式MEMS
3D and Circuit Integration of MEMS
Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch10
T. T. Kobayashi (AIST)
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引用次数: 1
Overview 概述
3D and Circuit Integration of MEMS
Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch1
Masayoshi Esashi
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引用次数: 0
Epitaxial Poly Si Surface Micromachining 外延多晶硅表面微加工
3D and Circuit Integration of MEMS
Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch4
M. Esashi
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引用次数: 0
Vacuum Packaging 真空包装
3D and Circuit Integration of MEMS
Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch18
M. Esashi
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引用次数: 12
Wafer Transfer 晶片传送
3D and Circuit Integration of MEMS
Pub Date : 1900-01-01 DOI: 10.1002/9783527823239.ch9
M. Esashi
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引用次数: 0
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