Pub Date : 1900-01-01DOI: 10.1002/9783527823239.index
{"title":"Index","authors":"","doi":"10.1002/9783527823239.index","DOIUrl":"https://doi.org/10.1002/9783527823239.index","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134560646","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1002/9783527823239.ch15
Xiaojing Wang, F. Niklaus
{"title":"Polymer Bonding","authors":"Xiaojing Wang, F. Niklaus","doi":"10.1002/9783527823239.ch15","DOIUrl":"https://doi.org/10.1002/9783527823239.ch15","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128813320","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1002/9783527823239.ch13
J. Froemel
{"title":"Metal Bonding","authors":"J. Froemel","doi":"10.1002/9783527823239.ch13","DOIUrl":"https://doi.org/10.1002/9783527823239.ch13","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116355189","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1007/springerreference_66275
M. Esashi
{"title":"Anodic Bonding","authors":"M. Esashi","doi":"10.1007/springerreference_66275","DOIUrl":"https://doi.org/10.1007/springerreference_66275","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115701942","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1002/9783527823239.ch20
Zhyao Wang
{"title":"Through‐substrate Vias","authors":"Zhyao Wang","doi":"10.1002/9783527823239.ch20","DOIUrl":"https://doi.org/10.1002/9783527823239.ch20","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121458644","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1002/9783527823239.ch14
Klaus Vogel, S. Braun, Christian Hofmann, Mathias Weiser, M. Wiemer, T. Otto, H. Kuhn
{"title":"Reactive Bonding","authors":"Klaus Vogel, S. Braun, Christian Hofmann, Mathias Weiser, M. Wiemer, T. Otto, H. Kuhn","doi":"10.1002/9783527823239.ch14","DOIUrl":"https://doi.org/10.1002/9783527823239.ch14","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"62 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124506607","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1002/9783527823239.ch19
K. Maenaka
{"title":"Buried Channels in Monolithic\u0000 Si","authors":"K. Maenaka","doi":"10.1002/9783527823239.ch19","DOIUrl":"https://doi.org/10.1002/9783527823239.ch19","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133359828","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1002/9783527823239.ch7
Enes Calayir, S. Merugu, Jaewung Lee, Navab Singh, G. Piazza
{"title":"Heterogeneously Integrated Aluminum Nitride\u0000 MEMS\u0000 Resonators and Filters","authors":"Enes Calayir, S. Merugu, Jaewung Lee, Navab Singh, G. Piazza","doi":"10.1002/9783527823239.ch7","DOIUrl":"https://doi.org/10.1002/9783527823239.ch7","url":null,"abstract":"","PeriodicalId":436477,"journal":{"name":"3D and Circuit Integration of MEMS","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123874016","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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