首页 > 最新文献

IEEE Electrical Insulation Magazine最新文献

英文 中文
Stories from China 来自中国的故事
IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-06-21 DOI: 10.1109/MEI.2024.10568084
Zepeng Lv
The vacuum breakdown issue severely hinders the performance of vacuum electrical devices, such as vacuum interrupters, X-ray sources, fusion reactors, and particle accelerators [1]–[3]. In general, vacuum breakdown is initiated by thermal instability at the cathode or anode due to the electron emission current, which heats the protrusion itself or transfers kinetic energy to the anode. Then, the initial vapor and ion population could be produced by the atom evaporation due to extreme heating, induced by the field electron emission current. Due to the evaporated atoms, the gap pressure increases and the mean free path of electrons may become less than the gap distance, where avalanche ionization will occur and cause the plasma discharge. Thus, the dynamics of electron emission and the electrode's properties will determine the dielectric strength and insulation performance of the gap.
真空击穿问题严重影响真空电气设备的性能,例如真空断路器、X 射线源、聚变反应堆和粒子加速器 [1]-[3]。一般来说,真空击穿是由电子发射电流导致阴极或阳极的热不稳定性引发的,电子发射电流会加热突起本身或将动能传递到阳极。然后,在场强电子发射电流的诱导下,原子因极度加热而蒸发,从而产生初始蒸汽和离子群。由于原子蒸发,间隙压力增大,电子的平均自由路径可能小于间隙距离,从而发生雪崩电离,导致等离子体放电。因此,电子发射动态和电极特性将决定间隙的介电强度和绝缘性能。
{"title":"Stories from China","authors":"Zepeng Lv","doi":"10.1109/MEI.2024.10568084","DOIUrl":"https://doi.org/10.1109/MEI.2024.10568084","url":null,"abstract":"The vacuum breakdown issue severely hinders the performance of vacuum electrical devices, such as vacuum interrupters, X-ray sources, fusion reactors, and particle accelerators [1]–[3]. In general, vacuum breakdown is initiated by thermal instability at the cathode or anode due to the electron emission current, which heats the protrusion itself or transfers kinetic energy to the anode. Then, the initial vapor and ion population could be produced by the atom evaporation due to extreme heating, induced by the field electron emission current. Due to the evaporated atoms, the gap pressure increases and the mean free path of electrons may become less than the gap distance, where avalanche ionization will occur and cause the plasma discharge. Thus, the dynamics of electron emission and the electrode's properties will determine the dielectric strength and insulation performance of the gap.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 4","pages":"44-45"},"PeriodicalIF":2.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10568084","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141439334","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Electrical Insulation Magazine, a Publication of DEIS IEEE 电气绝缘杂志》,DEIS 的出版物
IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-06-21 DOI: 10.1109/MEI.2024.10568094
{"title":"IEEE Electrical Insulation Magazine, a Publication of DEIS","authors":"","doi":"10.1109/MEI.2024.10568094","DOIUrl":"https://doi.org/10.1109/MEI.2024.10568094","url":null,"abstract":"","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 4","pages":"1-1"},"PeriodicalIF":2.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10568094","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141439398","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Author's Guide for IEEE Electrical Insulation Magazine Technical Articles IEEE 电气绝缘杂志技术文章作者指南
IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-06-21 DOI: 10.1109/MEI.2024.10568099
{"title":"Author's Guide for IEEE Electrical Insulation Magazine Technical Articles","authors":"","doi":"10.1109/MEI.2024.10568099","DOIUrl":"https://doi.org/10.1109/MEI.2024.10568099","url":null,"abstract":"","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 4","pages":"1-1"},"PeriodicalIF":2.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10568099","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141439450","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Bulletin Board: Third Thematic School on Dielectrics 公告栏:第三届电介质专题学校
IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-06-21 DOI: 10.1109/MEI.2024.10566872
{"title":"Bulletin Board: Third Thematic School on Dielectrics","authors":"","doi":"10.1109/MEI.2024.10566872","DOIUrl":"https://doi.org/10.1109/MEI.2024.10566872","url":null,"abstract":"","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 4","pages":"59-59"},"PeriodicalIF":2.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10566872","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141439452","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
From the Editor 编辑的话
IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-06-21 DOI: 10.1109/MEI.2024.10568086
In the first featured article in this issue, “Trends in Diagnostics and Monitoring of High-Voltage Insulation,” members of the IEEE DEIS Technical Committee on Diagnostics collaborated to highlight trends in the monitoring of high-voltage insulation. The article covers a wide range of applications from traditional power generation and transmission to emerging sectors such as transportation electrification.
在本期第一篇特写文章 "高压绝缘诊断和监测的趋势 "中,IEEE DEIS 诊断技术委员会的成员合作重点介绍了高压绝缘监测的趋势。文章涵盖了从传统发电和输电到交通电气化等新兴领域的广泛应用。
{"title":"From the Editor","authors":"","doi":"10.1109/MEI.2024.10568086","DOIUrl":"https://doi.org/10.1109/MEI.2024.10568086","url":null,"abstract":"In the first featured article in this issue, “Trends in Diagnostics and Monitoring of High-Voltage Insulation,” members of the IEEE DEIS Technical Committee on Diagnostics collaborated to highlight trends in the monitoring of high-voltage insulation. The article covers a wide range of applications from traditional power generation and transmission to emerging sectors such as transportation electrification.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 4","pages":"5-5"},"PeriodicalIF":2.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10568086","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141439433","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Bulletin Board: 2024 Awards 公告栏:2024 年奖项
IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-06-21 DOI: 10.1109/MEI.2024.10568079
The IEEE Dielectrics and Electrical Insulation Society (DEIS) has two DEIS-level technical awards that it bestows every two years. They are the highest-level IEEE technical awards in the dielectrics and electrical insulation field. DEIS President Davide Fabiani announced the winners of the 2024 awards in April. Prof. Yoshimichi Ohki is the 2024 Dakin Award recipient, and Prof. Yao Zhou is the 2024 Boggs Award recipient.
电气和电子工程师学会(IEEE)电介质和电气绝缘协会(DEIS)每两年颁发两个 DEIS 级技术奖。它们是 IEEE 在电介质和电气绝缘领域的最高级别技术奖项。DEIS 主席达维德-法比亚尼(Davide Fabiani)于今年 4 月宣布了 2024 年度的获奖者名单。Yoshimichi Ohki教授是2024年达金奖的获得者,Yao Zhou教授是2024年博格斯奖的获得者。
{"title":"Bulletin Board: 2024 Awards","authors":"","doi":"10.1109/MEI.2024.10568079","DOIUrl":"https://doi.org/10.1109/MEI.2024.10568079","url":null,"abstract":"The IEEE Dielectrics and Electrical Insulation Society (DEIS) has two DEIS-level technical awards that it bestows every two years. They are the highest-level IEEE technical awards in the dielectrics and electrical insulation field. DEIS President Davide Fabiani announced the winners of the 2024 awards in April. Prof. Yoshimichi Ohki is the 2024 Dakin Award recipient, and Prof. Yao Zhou is the 2024 Boggs Award recipient.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 4","pages":"54-55"},"PeriodicalIF":2.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10568079","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141439447","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Bulletin Board: APEC 2024 公告栏:2024 年亚太经合组织
IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-06-21 DOI: 10.1109/MEI.2024.10568096
The IEEE Applied Power Electronics Conference (APEC) focuses on the practical and applied aspects of the power electronics business. This year it was held at Long Beach, California, on February 25–29, 2024, and a new industry session was introduced, “Topics in High-Voltage Components and Systems.” The session was chaired by Conor Quinn (PhD) of Advanced Energy and Fang Lou (PhD) of Stony Brook University. The session, which was held on Thursday morning, included the following six presentations:
IEEE 应用电力电子会议(APEC)关注电力电子业务的实践和应用方面。今年的会议于 2024 年 2 月 25-29 日在加利福尼亚州的长滩举行,并引入了一个新的行业会议,即 "高压组件和系统专题"。会议由先进能源公司的 Conor Quinn(博士)和石溪大学的 Fang Lou(博士)主持。会议于周四上午举行,包括以下六个专题报告:
{"title":"Bulletin Board: APEC 2024","authors":"","doi":"10.1109/MEI.2024.10568096","DOIUrl":"https://doi.org/10.1109/MEI.2024.10568096","url":null,"abstract":"The IEEE Applied Power Electronics Conference (APEC) focuses on the practical and applied aspects of the power electronics business. This year it was held at Long Beach, California, on February 25–29, 2024, and a new industry session was introduced, “Topics in High-Voltage Components and Systems.” The session was chaired by Conor Quinn (PhD) of Advanced Energy and Fang Lou (PhD) of Stony Brook University. The session, which was held on Thursday morning, included the following six presentations:","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 4","pages":"57-57"},"PeriodicalIF":2.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10568096","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141439448","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Guide to Changes Made in Edition 4 of IEC 60270, Charge-Based Partial Discharge Measurements IEC 60270《基于电荷的局部放电测量》第 4 版修改指南
IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-06-21 DOI: 10.1109/MEI.2024.10568081
Glenn Behrmann;Detlev Gross;Michael Muhr
IEC 60270 is the horizontal standard covering conventional, charge-based partial discharge measurement and has just undergone substantial updates and revision throughout. This article presents a detailed summary of the changes made, together with some of the technical background behind them.
IEC 60270 是涵盖传统的、基于电荷的局部放电测量的横向标准,刚刚进行了大幅更新和修订。本文详细概述了所做的修改,以及修改背后的一些技术背景。
{"title":"Guide to Changes Made in Edition 4 of IEC 60270, Charge-Based Partial Discharge Measurements","authors":"Glenn Behrmann;Detlev Gross;Michael Muhr","doi":"10.1109/MEI.2024.10568081","DOIUrl":"https://doi.org/10.1109/MEI.2024.10568081","url":null,"abstract":"IEC 60270 is the horizontal standard covering conventional, charge-based partial discharge measurement and has just undergone substantial updates and revision throughout. This article presents a detailed summary of the changes made, together with some of the technical background behind them.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 4","pages":"27-39"},"PeriodicalIF":2.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141439331","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Trends in Diagnostics and Monitoring of High-Voltage Insulation 高压绝缘诊断和监测的发展趋势
IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-06-21 DOI: 10.1109/MEI.2024.10568085
B. Biswas;B. X. Du;M. Florkowski;T. Hammarström;M. D. Judd;W. Kołtunowicz;B. Kordi;M. Kuniewski;G. Ma;C. Pan;C. Park;A. K. Pradhan;L. Satish;G. Stone
This paper is a joint contribution from members of the IEEE DEIS Technical Committee for Diagnostics that highlights selected trends, challenges, and techniques in diagnostics and monitoring of high-voltage electrical insulation. Especially important are broad application areas including traditional generation, transmission and distribution, and renewable energy, along with emerging fields including new sectors in transportation electrification such as electromobility and electric aviation.
本文是 IEEE DEIS 诊断技术委员会成员共同撰写的论文,重点介绍了高压电气绝缘诊断和监测的部分趋势、挑战和技术。尤其重要的是包括传统发电、输配电和可再生能源在内的广泛应用领域,以及包括电动交通和电动航空等交通电气化新领域在内的新兴领域。
{"title":"Trends in Diagnostics and Monitoring of High-Voltage Insulation","authors":"B. Biswas;B. X. Du;M. Florkowski;T. Hammarström;M. D. Judd;W. Kołtunowicz;B. Kordi;M. Kuniewski;G. Ma;C. Pan;C. Park;A. K. Pradhan;L. Satish;G. Stone","doi":"10.1109/MEI.2024.10568085","DOIUrl":"https://doi.org/10.1109/MEI.2024.10568085","url":null,"abstract":"This paper is a joint contribution from members of the IEEE DEIS Technical Committee for Diagnostics that highlights selected trends, challenges, and techniques in diagnostics and monitoring of high-voltage electrical insulation. Especially important are broad application areas including traditional generation, transmission and distribution, and renewable energy, along with emerging fields including new sectors in transportation electrification such as electromobility and electric aviation.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 4","pages":"6-26"},"PeriodicalIF":2.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141439332","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Young Professionals 青年专业人员
IF 2.6 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-06-21 DOI: 10.1109/MEI.2024.10568080
Ashok Narayan Tripathi
The IEEE DEIS Student Branch Chapter Indian Institute of Technology Kanpur has completed its first year. Since its inauguration, we have been constantly promoting the motto of IEEE, “Advancing Technology for Humanity.” We have organized events throughout the year, which include webinars, expert talks, panel discussions, and social gatherings.
印度理工学院坎普尔分校 IEEE DEIS 学生分会已成立一年。自成立以来,我们一直在不断宣传 IEEE 的座右铭 "推动人类科技进步"。我们全年都在组织各种活动,包括网络研讨会、专家讲座、小组讨论和社交聚会。
{"title":"Young Professionals","authors":"Ashok Narayan Tripathi","doi":"10.1109/MEI.2024.10568080","DOIUrl":"https://doi.org/10.1109/MEI.2024.10568080","url":null,"abstract":"The IEEE DEIS Student Branch Chapter Indian Institute of Technology Kanpur has completed its first year. Since its inauguration, we have been constantly promoting the motto of IEEE, “Advancing Technology for Humanity.” We have organized events throughout the year, which include webinars, expert talks, panel discussions, and social gatherings.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"40 4","pages":"46-47"},"PeriodicalIF":2.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10568080","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141439446","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
IEEE Electrical Insulation Magazine
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1