Pub Date : 2025-12-19DOI: 10.1109/MEI.2026.11306293
Mattewos Tefferi
When I was appointed as chair of the DEIS Young Professionals (YP) Committee in early 2023, I outlined several priorities in my editorial in IEEE Electrical Insulation Magazine [1]. Looking back now, as my term comes to an end, I am proud of what the YP Committee has accomplished over the past three years.
{"title":"Young Professionals: Retiring from the Young Professionals Committee","authors":"Mattewos Tefferi","doi":"10.1109/MEI.2026.11306293","DOIUrl":"https://doi.org/10.1109/MEI.2026.11306293","url":null,"abstract":"When I was appointed as chair of the DEIS Young Professionals (YP) Committee in early 2023, I outlined several priorities in my editorial in IEEE Electrical Insulation Magazine [1]. Looking back now, as my term comes to an end, I am proud of what the YP Committee has accomplished over the past three years.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"42 1","pages":"45-47"},"PeriodicalIF":1.3,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306293","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778250","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-12-19DOI: 10.1109/MEI.2026.11306291
Rui Wang;Haoyu Gao
My name is Rui Wang, and I am happy to share the progress I have made as a DEIS Graduate Student Fellow. This fellowship has provided invaluable support to improve my PhD research. I am deeply grateful to the DEIS Education Committee for the opportunity and to my advisor for continuous guidance.
{"title":"Young Professionals: DEIS Graduate Student Fellowship","authors":"Rui Wang;Haoyu Gao","doi":"10.1109/MEI.2026.11306291","DOIUrl":"https://doi.org/10.1109/MEI.2026.11306291","url":null,"abstract":"My name is Rui Wang, and I am happy to share the progress I have made as a DEIS Graduate Student Fellow. This fellowship has provided invaluable support to improve my PhD research. I am deeply grateful to the DEIS Education Committee for the opportunity and to my advisor for continuous guidance.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"42 1","pages":"48-49"},"PeriodicalIF":1.3,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306291","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778307","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-12-19DOI: 10.1109/MEI.2026.11306328
Bálint Németh;Richárd Cselkó
This article offers readers a glimpse into the daily operations of the High Voltage Laboratory at the Budapest University of Technology and Economics. This article, part of the “A Day in the Life of a ____ Laboratory” series, highlights the laboratory's unique role in live-line maintenance, encompassing the education of future professionals and development of innovative technologies.
{"title":"A Day in the Life of a High-Voltage Laboratory in Budapest","authors":"Bálint Németh;Richárd Cselkó","doi":"10.1109/MEI.2026.11306328","DOIUrl":"https://doi.org/10.1109/MEI.2026.11306328","url":null,"abstract":"This article offers readers a glimpse into the daily operations of the High Voltage Laboratory at the Budapest University of Technology and Economics. This article, part of the “A Day in the Life of a ____ Laboratory” series, highlights the laboratory's unique role in live-line maintenance, encompassing the education of future professionals and development of innovative technologies.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"42 1","pages":"30-36"},"PeriodicalIF":1.3,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306328","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778354","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-05DOI: 10.1109/MEI.2025.11230224
If you are excited to work together in a team of experts and help shape the content of IEEE Electrical Insulation Magazine (EIM), you may want to apply for a position on the Editorial Board. DEIS is now looking for two new board members, starting January 1, 2026.
{"title":"Bulletin Board: IEEE Electrical Insulation Magazine Is Looking for Two New Board Members","authors":"","doi":"10.1109/MEI.2025.11230224","DOIUrl":"https://doi.org/10.1109/MEI.2025.11230224","url":null,"abstract":"If you are excited to work together in a team of experts and help shape the content of IEEE Electrical Insulation Magazine (EIM), you may want to apply for a position on the Editorial Board. DEIS is now looking for two new board members, starting January 1, 2026.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"41 5","pages":"52-52"},"PeriodicalIF":1.3,"publicationDate":"2025-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11230224","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145442741","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-05DOI: 10.1109/MEI.2025.11230320
Kai Zhang;Alai Muniozguren
Effective communication of scientific research is important to ensure the easy recognition and impact of state-of-the-art re-search outcomes within the international community. IEEE DEIS sponsored “Communicating Science,” a series of seminars aimed at young researchers to enhance their scientific writing, presentation, and proposal-preparation skills. As delegates, from a Latin-speaking country and a Chinese-speaking country with multilingual backgrounds, we share our experiences and provide a concise recap of the course structure. From the perspective of the author and seminar presenter, Professor Emeritus Raymond Boxman, effective scientific writing prioritizes clear communication of key messages over linguistic gymnastics or unnecessary jargon.
{"title":"Young Professionals: Communicating Science Colloquium for Early-Career Researchers: Endnotes and Reflections","authors":"Kai Zhang;Alai Muniozguren","doi":"10.1109/MEI.2025.11230320","DOIUrl":"https://doi.org/10.1109/MEI.2025.11230320","url":null,"abstract":"Effective communication of scientific research is important to ensure the easy recognition and impact of state-of-the-art re-search outcomes within the international community. IEEE DEIS sponsored “Communicating Science,” a series of seminars aimed at young researchers to enhance their scientific writing, presentation, and proposal-preparation skills. As delegates, from a Latin-speaking country and a Chinese-speaking country with multilingual backgrounds, we share our experiences and provide a concise recap of the course structure. From the perspective of the author and seminar presenter, Professor Emeritus Raymond Boxman, effective scientific writing prioritizes clear communication of key messages over linguistic gymnastics or unnecessary jargon.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"41 5","pages":"38-40"},"PeriodicalIF":1.3,"publicationDate":"2025-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11230320","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145442743","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-05DOI: 10.1109/MEI.2025.11230328
The 6th International Conference on Dielectrics will be accepting abstract submissions from September 1 to October 31, 2025. This edition will take place in Southampton, United Kingdom, from June 21 to 25, 2026, under the theme “Next-Gen Sustainable Dielectrics.”
{"title":"Bulletin Board: IEEE ICD 2026—Program Highlight","authors":"","doi":"10.1109/MEI.2025.11230328","DOIUrl":"https://doi.org/10.1109/MEI.2025.11230328","url":null,"abstract":"The 6th International Conference on Dielectrics will be accepting abstract submissions from September 1 to October 31, 2025. This edition will take place in Southampton, United Kingdom, from June 21 to 25, 2026, under the theme “Next-Gen Sustainable Dielectrics.”","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"41 5","pages":"54-54"},"PeriodicalIF":1.3,"publicationDate":"2025-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11230328","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145442745","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-05DOI: 10.1109/MEI.2025.11230310
Tony Lujia Chen
This issue features three articles, the first of which is by Suraci and Fabiani, titled “Changes in physical-chemical and electrical properties of cross-linked-polyethylene-insulated cable subjected to radio-thermal aging and simulation of loss-of-coolant accident (LOCA).” This article presents a detailed investigation into the degradation mechanisms of low-voltage instrumentation and control cables used in nuclear power plants. It explores how combined radiation and thermal aging, as well as simulated design-basis events, affect the physical-chemical and electrical properties of cross-linked-polyethylene insulation. The study highlights the formation of oxidized species, changes in crystallinity, and the emergence of quasi-DC conduction phenomena. This comprehensive analysis is particularly relevant for engineers and researchers focused on the long-term reliability and safety of nuclear-grade cable systems.
{"title":"From the Editor","authors":"Tony Lujia Chen","doi":"10.1109/MEI.2025.11230310","DOIUrl":"https://doi.org/10.1109/MEI.2025.11230310","url":null,"abstract":"This issue features three articles, the first of which is by Suraci and Fabiani, titled “Changes in physical-chemical and electrical properties of cross-linked-polyethylene-insulated cable subjected to radio-thermal aging and simulation of loss-of-coolant accident (LOCA).” This article presents a detailed investigation into the degradation mechanisms of low-voltage instrumentation and control cables used in nuclear power plants. It explores how combined radiation and thermal aging, as well as simulated design-basis events, affect the physical-chemical and electrical properties of cross-linked-polyethylene insulation. The study highlights the formation of oxidized species, changes in crystallinity, and the emergence of quasi-DC conduction phenomena. This comprehensive analysis is particularly relevant for engineers and researchers focused on the long-term reliability and safety of nuclear-grade cable systems.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"41 5","pages":"5-5"},"PeriodicalIF":1.3,"publicationDate":"2025-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11230310","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145442701","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-05DOI: 10.1109/MEI.2025.11230225
The 44th Electrical Insulation Conference (EIC) will be held in Las Vegas, Nevada, USA, July 12-16, 2026, in conjunction with the International Power Modulator and High Voltage Conference. The conference will feature technical sessions, poster sessions, and exhibitor displays.
{"title":"Bulletin Board: EIC 2026 Call for Papers","authors":"","doi":"10.1109/MEI.2025.11230225","DOIUrl":"https://doi.org/10.1109/MEI.2025.11230225","url":null,"abstract":"The 44th Electrical Insulation Conference (EIC) will be held in Las Vegas, Nevada, USA, July 12-16, 2026, in conjunction with the International Power Modulator and High Voltage Conference. The conference will feature technical sessions, poster sessions, and exhibitor displays.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"41 5","pages":"55-55"},"PeriodicalIF":1.3,"publicationDate":"2025-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11230225","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145442713","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-05DOI: 10.1109/MEI.2025.11230311
Zepeng Lv
In high-voltage power cable systems, numerous metallic sheath joints and grounding interfaces are employed. These connection points include cable metallic sheaths, copper casings or tail tubes of accessories, and grounding connectors for intermediate joints. These metallic components and their associated sealing regions are critical for ensuring thermal sealing integrity, water ingress prevention, and mechanical stress tolerance. They also provide conductive paths for circulating and single-phase short-circuit currents. If the sealing of the metallic sheath is compromised or develops cracks, moisture may infiltrate the cable. This can lead to surface tracking along the main insulation, resulting in insulation breakdown and even failure incidents with significant economic losses. To mitigate such risks, the metallic reconnection of cable sheaths must exhibit low electrical resistance, high density, and robust mechanical bonding.
{"title":"Stories from China","authors":"Zepeng Lv","doi":"10.1109/MEI.2025.11230311","DOIUrl":"https://doi.org/10.1109/MEI.2025.11230311","url":null,"abstract":"In high-voltage power cable systems, numerous metallic sheath joints and grounding interfaces are employed. These connection points include cable metallic sheaths, copper casings or tail tubes of accessories, and grounding connectors for intermediate joints. These metallic components and their associated sealing regions are critical for ensuring thermal sealing integrity, water ingress prevention, and mechanical stress tolerance. They also provide conductive paths for circulating and single-phase short-circuit currents. If the sealing of the metallic sheath is compromised or develops cracks, moisture may infiltrate the cable. This can lead to surface tracking along the main insulation, resulting in insulation breakdown and even failure incidents with significant economic losses. To mitigate such risks, the metallic reconnection of cable sheaths must exhibit low electrical resistance, high density, and robust mechanical bonding.","PeriodicalId":444,"journal":{"name":"IEEE Electrical Insulation Magazine","volume":"41 5","pages":"34-37"},"PeriodicalIF":1.3,"publicationDate":"2025-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11230311","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145442721","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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