首页 > 最新文献

Journal of Enhanced Heat Transfer最新文献

英文 中文
Convective and Conjugate Heat Transfer Efficiency Enhancement over Partitioned Channel within Backward-Facing Step using the Lattice Boltzmann Method LBM-DMRT 基于点阵玻尔兹曼方法LBM-DMRT提高后向台阶内分区通道对流和共轭换热效率
IF 2.3 4区 工程技术 Q3 ENGINEERING, MECHANICAL Pub Date : 2022-01-01 DOI: 10.1615/jenhheattransf.2022040357
El Bachir Lahmer, J. Benhamou, Y. Admi, M. Moussaoui, M. Jami, A. Mezrhab, R. K. Phanden
{"title":"Convective and Conjugate Heat Transfer Efficiency Enhancement over Partitioned Channel within Backward-Facing Step using the Lattice Boltzmann Method LBM-DMRT","authors":"El Bachir Lahmer, J. Benhamou, Y. Admi, M. Moussaoui, M. Jami, A. Mezrhab, R. K. Phanden","doi":"10.1615/jenhheattransf.2022040357","DOIUrl":"https://doi.org/10.1615/jenhheattransf.2022040357","url":null,"abstract":"","PeriodicalId":50208,"journal":{"name":"Journal of Enhanced Heat Transfer","volume":"41 1","pages":""},"PeriodicalIF":2.3,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82398322","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Numerical Investigation of Thermofluid Characteristics of Shell-and-Plate Heat Exchangers – A Comparison with Plate Heat Exchangers 壳板式换热器热流体特性的数值研究——与板式换热器的比较
IF 2.3 4区 工程技术 Q3 ENGINEERING, MECHANICAL Pub Date : 2022-01-01 DOI: 10.1615/jenhheattransf.2022039956
Ali Sadeghianjahromi, Po-Lun Kuo, Chi-Chuan Wang
{"title":"Numerical Investigation of Thermofluid Characteristics of Shell-and-Plate Heat Exchangers – A Comparison with Plate Heat Exchangers","authors":"Ali Sadeghianjahromi, Po-Lun Kuo, Chi-Chuan Wang","doi":"10.1615/jenhheattransf.2022039956","DOIUrl":"https://doi.org/10.1615/jenhheattransf.2022039956","url":null,"abstract":"","PeriodicalId":50208,"journal":{"name":"Journal of Enhanced Heat Transfer","volume":"6 1","pages":""},"PeriodicalIF":2.3,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81776350","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
PREFACE: SPECIAL ISSUE OF SYMPOSIUM FLUTE 2021 ON THERMAL MANAGEMENT OF ELECTRONIC DEVICES AND COMPONENTS 前言:电子器件和元件热管理研讨会长笛2021特刊
IF 2.3 4区 工程技术 Q3 ENGINEERING, MECHANICAL Pub Date : 2022-01-01 DOI: 10.1615/jenhheattransf.v29.i3.10
B. Sikarwar, K. Singh, Balkrishna Mehta
The International Symposium on Fluids and Thermal Engineer g, FLUTE 2021, is an international peer-reviewed academic symposium organized b y the Department of Mechanical Engineering at Amity School of Engineering & Technology, Am ity University Uttar Pradesh, India on July 22, 2021. FLUTE 2021 provides a forum to promote rapid communication and exchange ideas between researchers, scientists, and engin e rs the field of fluid and thermal engineering. The theme of FLUTE 2021 was “Thermal Managemen t of Electronic Devices and Components.” With the rapid growth of manufacturing technologies during the past decade, electronic components and devices are exposed to the developing trends for (i) multi-functionality and (ii) miniaturization that simultaneously requires larger elec tronic power and smaller chip component sizes. Consequently, there are increasing challenges for preventing electronic devices from overheating, which badly affects their working efficiency a nd lifetime. Hence, an effective thermal management approach is essential for guaranteeing the n ormal working efficiency and safety of electronic components. In general, the thermal manageme nt techniques of electronic devices and components could be classified into two categories: (i) a ctive cooling and (ii) passive cooling. However, active cooling becomes highly limited for min iaturized electronic devices because it usually requires sufficient space and additional power. I t also has the issues of high noise levels and difficulty in maintenance. For this reason, reliable pas sive cooling has become essential and attractive for improving the thermal performance and life c ycle of small electronic components. This special issue publishes the research outcomes on the th ermal management of electronic devices and components. The articles contribute to the exis ting body of knowledge and provide new insights and perspectives on the theme of FLUTE 2021. The invit d authors are those who were conducting research on a variety of technologies in var ious settings through theoretical and empirical research investigations. This special issue consists of six research articles that are extended versions of the papers presented in FLUTE 2021. Als o, the papers submitted by other renowned authors working on the theme of FLUTE 2021 were also considered. The rigorous review process of the Journal of Enhanced Heat Transfer (JEHT) was followed to reach a final decision. The first paper presents an experimental study of a phase chan ge material (PCM)-based hybrid heat sink for electronic cooling. In the second paper , an experimental investigation of the spray cooling system for next-generation electronic de vices is discussed. The third paper presents the numerical study of tube diameter effects on the solidification of PCM in a compact heat exchanger. The fourth paper proposes a study on convect ive and conjugate heat transfer efficiency enhancement over the partitioned channel within a backward-facing
国际流体与热工程研讨会(FLUTE 2021)是由印度北方邦阿姆ity大学阿姆ity工程技术学院机械工程系于2021年7月22日组织的国际同行评审学术研讨会。长笛2021提供了一个论坛,以促进研究人员,科学家和工程师在流体和热工领域之间的快速沟通和交流思想。长笛2021的主题是“电子器件和组件的热管理”。在过去的十年中,随着制造技术的快速发展,电子元件和设备面临着(1)多功能和(2)小型化的发展趋势,同时需要更大的电子功率和更小的芯片组件尺寸。因此,防止电子设备过热的挑战越来越大,严重影响电子设备的工作效率和使用寿命。因此,有效的热管理方法对于保证电子元件的正常工作效率和安全至关重要。一般来说,电子设备和元件的热管理技术可分为两类:(i)主动冷却和(ii)被动冷却。然而,主动冷却对于小型电子设备来说是非常有限的,因为它通常需要足够的空间和额外的功率。它也有高噪音水平和维护困难的问题。因此,可靠的被动冷却对于改善小型电子元件的热性能和寿命周期变得至关重要和有吸引力。这期特刊发表了电子器件和元件热管理方面的研究成果。这些文章为现有的知识体系做出了贡献,并为长笛2021的主题提供了新的见解和观点。被邀请的作者是那些通过理论和实证研究调查对各种环境下的各种技术进行研究的人。本期特刊由六篇研究文章组成,这些文章是长笛2021上发表的论文的扩展版本。此外,其他知名作者提交的关于长笛2021主题的论文也被考虑在内。通过对《强化传热杂志》(JEHT)的严格审查,最终做出了最终决定。第一篇论文介绍了一种基于相变材料(PCM)的电子冷却混合散热器的实验研究。在第二篇论文中,讨论了下一代电子器件喷雾冷却系统的实验研究。第三篇论文给出了管径对紧凑换热器中PCM凝固影响的数值研究。第四篇论文提出了一种利用格点-玻尔兹曼方法对后向台阶内分区通道的对流和共轭传热效率提高进行研究。第五篇论文提出了一种新的栅格-波尔兹曼法微通道共轭传热模型离散化策略。在第六篇论文中,作者研究了时变阶跃函数激励下单线电缆的温度计算。
{"title":"PREFACE: SPECIAL ISSUE OF SYMPOSIUM FLUTE 2021 ON THERMAL MANAGEMENT OF ELECTRONIC DEVICES AND COMPONENTS","authors":"B. Sikarwar, K. Singh, Balkrishna Mehta","doi":"10.1615/jenhheattransf.v29.i3.10","DOIUrl":"https://doi.org/10.1615/jenhheattransf.v29.i3.10","url":null,"abstract":"The International Symposium on Fluids and Thermal Engineer g, FLUTE 2021, is an international peer-reviewed academic symposium organized b y the Department of Mechanical Engineering at Amity School of Engineering & Technology, Am ity University Uttar Pradesh, India on July 22, 2021. FLUTE 2021 provides a forum to promote rapid communication and exchange ideas between researchers, scientists, and engin e rs the field of fluid and thermal engineering. The theme of FLUTE 2021 was “Thermal Managemen t of Electronic Devices and Components.” With the rapid growth of manufacturing technologies during the past decade, electronic components and devices are exposed to the developing trends for (i) multi-functionality and (ii) miniaturization that simultaneously requires larger elec tronic power and smaller chip component sizes. Consequently, there are increasing challenges for preventing electronic devices from overheating, which badly affects their working efficiency a nd lifetime. Hence, an effective thermal management approach is essential for guaranteeing the n ormal working efficiency and safety of electronic components. In general, the thermal manageme nt techniques of electronic devices and components could be classified into two categories: (i) a ctive cooling and (ii) passive cooling. However, active cooling becomes highly limited for min iaturized electronic devices because it usually requires sufficient space and additional power. I t also has the issues of high noise levels and difficulty in maintenance. For this reason, reliable pas sive cooling has become essential and attractive for improving the thermal performance and life c ycle of small electronic components. This special issue publishes the research outcomes on the th ermal management of electronic devices and components. The articles contribute to the exis ting body of knowledge and provide new insights and perspectives on the theme of FLUTE 2021. The invit d authors are those who were conducting research on a variety of technologies in var ious settings through theoretical and empirical research investigations. This special issue consists of six research articles that are extended versions of the papers presented in FLUTE 2021. Als o, the papers submitted by other renowned authors working on the theme of FLUTE 2021 were also considered. The rigorous review process of the Journal of Enhanced Heat Transfer (JEHT) was followed to reach a final decision. The first paper presents an experimental study of a phase chan ge material (PCM)-based hybrid heat sink for electronic cooling. In the second paper , an experimental investigation of the spray cooling system for next-generation electronic de vices is discussed. The third paper presents the numerical study of tube diameter effects on the solidification of PCM in a compact heat exchanger. The fourth paper proposes a study on convect ive and conjugate heat transfer efficiency enhancement over the partitioned channel within a backward-facing ","PeriodicalId":50208,"journal":{"name":"Journal of Enhanced Heat Transfer","volume":"142 1","pages":""},"PeriodicalIF":2.3,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73438507","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Stepped Semispherical Solar Still with PV Powered Electrical Heaters and an Automated Single-Axis Sun Tracker System 阶梯式半球形太阳能蒸馏器,带有PV供电电加热器和自动单轴太阳跟踪系统
IF 2.3 4区 工程技术 Q3 ENGINEERING, MECHANICAL Pub Date : 2022-01-01 DOI: 10.1615/jenhheattransf.2022041845
Safa M. Aldarabseh, S. Abdallah
{"title":"Stepped Semispherical Solar Still with PV Powered Electrical Heaters and an Automated Single-Axis Sun Tracker System","authors":"Safa M. Aldarabseh, S. Abdallah","doi":"10.1615/jenhheattransf.2022041845","DOIUrl":"https://doi.org/10.1615/jenhheattransf.2022041845","url":null,"abstract":"","PeriodicalId":50208,"journal":{"name":"Journal of Enhanced Heat Transfer","volume":"51 1","pages":""},"PeriodicalIF":2.3,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83093208","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Thermal Performance Analysis of a Solar Air Heater Design Employing Wavy Corrugated Plates and Impinging Air Jet Array for High Thermal Performance 采用波状波纹板和冲击气流阵列的太阳能空气加热器的热性能分析
IF 2.3 4区 工程技术 Q3 ENGINEERING, MECHANICAL Pub Date : 2022-01-01 DOI: 10.1615/jenhheattransf.2022044410
Satyender Singh, S. Chaurasiya
{"title":"Thermal Performance Analysis of a Solar Air Heater Design Employing Wavy Corrugated Plates and Impinging Air Jet Array for High Thermal Performance","authors":"Satyender Singh, S. Chaurasiya","doi":"10.1615/jenhheattransf.2022044410","DOIUrl":"https://doi.org/10.1615/jenhheattransf.2022044410","url":null,"abstract":"","PeriodicalId":50208,"journal":{"name":"Journal of Enhanced Heat Transfer","volume":"290 1","pages":""},"PeriodicalIF":2.3,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86432583","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Effect of Location of Discrete Heat Sources on a Wavy-Wall Microchannel for Liquid Cooling 离散热源位置对波壁液体冷却微通道的影响
IF 2.3 4区 工程技术 Q3 ENGINEERING, MECHANICAL Pub Date : 2022-01-01 DOI: 10.1615/jenhheattransf.2022041688
D. Sathish Kumar, S. Jayavel
{"title":"Effect of Location of Discrete Heat Sources on a Wavy-Wall Microchannel for Liquid Cooling","authors":"D. Sathish Kumar, S. Jayavel","doi":"10.1615/jenhheattransf.2022041688","DOIUrl":"https://doi.org/10.1615/jenhheattransf.2022041688","url":null,"abstract":"","PeriodicalId":50208,"journal":{"name":"Journal of Enhanced Heat Transfer","volume":"545 1","pages":""},"PeriodicalIF":2.3,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77185597","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
AN EXPERIMENTAL INVESTIGATION OF SPRAY COOLING SYSTEM FOR NEXT-GENERATION ELECTRONIC DEVICES 下一代电子器件喷雾冷却系统的实验研究
IF 2.3 4区 工程技术 Q3 ENGINEERING, MECHANICAL Pub Date : 2022-01-01 DOI: 10.1615/jenhheattransf.2022040602
B. Kumar
{"title":"AN EXPERIMENTAL INVESTIGATION OF SPRAY COOLING SYSTEM FOR NEXT-GENERATION ELECTRONIC DEVICES","authors":"B. Kumar","doi":"10.1615/jenhheattransf.2022040602","DOIUrl":"https://doi.org/10.1615/jenhheattransf.2022040602","url":null,"abstract":"","PeriodicalId":50208,"journal":{"name":"Journal of Enhanced Heat Transfer","volume":"1 1","pages":""},"PeriodicalIF":2.3,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77950728","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
A Numerical Study on Multi-objective Design Optimization of Heatsinks for Forced and Natural Convection Cooling of Immersion Cooled Servers 浸没式服务器强制和自然对流散热散热器多目标设计优化数值研究
IF 2.3 4区 工程技术 Q3 ENGINEERING, MECHANICAL Pub Date : 2022-01-01 DOI: 10.1615/jenhheattransf.2022043805
S. Saini, Tushar Wagh, Pratik V. Bansode, Pardeep Shahi, J. Herring, Jacob Lamotte-Dawaghreh, Jimil M. Shah, D. Agonafer
{"title":"A Numerical Study on Multi-objective Design Optimization of Heatsinks for Forced and Natural Convection Cooling of Immersion Cooled Servers","authors":"S. Saini, Tushar Wagh, Pratik V. Bansode, Pardeep Shahi, J. Herring, Jacob Lamotte-Dawaghreh, Jimil M. Shah, D. Agonafer","doi":"10.1615/jenhheattransf.2022043805","DOIUrl":"https://doi.org/10.1615/jenhheattransf.2022043805","url":null,"abstract":"","PeriodicalId":50208,"journal":{"name":"Journal of Enhanced Heat Transfer","volume":"15 1","pages":""},"PeriodicalIF":2.3,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89198356","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Heat transfer enhancement of mono ethylene glycol – water based solar thermic fluids dispersed with multiwalled carbon nano tubes in a coiled tube heat exchanger 多壁碳纳米管分散单乙二醇-水基太阳能热流体在盘管换热器中的强化传热研究
IF 2.3 4区 工程技术 Q3 ENGINEERING, MECHANICAL Pub Date : 2022-01-01 DOI: 10.1615/jenhheattransf.2022044682
S. Vadapalli, J. Sagari, Haricharan Alapati, Vishnuvardhan reddy Kalamalla, Ravi Su
{"title":"Heat transfer enhancement of mono ethylene glycol – water based solar thermic fluids dispersed with multiwalled carbon nano tubes in a coiled tube heat exchanger","authors":"S. Vadapalli, J. Sagari, Haricharan Alapati, Vishnuvardhan reddy Kalamalla, Ravi Su","doi":"10.1615/jenhheattransf.2022044682","DOIUrl":"https://doi.org/10.1615/jenhheattransf.2022044682","url":null,"abstract":"","PeriodicalId":50208,"journal":{"name":"Journal of Enhanced Heat Transfer","volume":"11 1","pages":""},"PeriodicalIF":2.3,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83854472","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Experimental and numerical studies of the orientation effect on the natural convection heat dissipation of composite polymer heat sinks 取向对复合聚合物散热器自然对流散热影响的实验与数值研究
IF 2.3 4区 工程技术 Q3 ENGINEERING, MECHANICAL Pub Date : 2022-01-01 DOI: 10.1615/jenhheattransf.2022041768
Dang Peng, Mehdi Khatamifar, W. Lin
{"title":"Experimental and numerical studies of the orientation effect on the natural convection heat dissipation of composite polymer heat sinks","authors":"Dang Peng, Mehdi Khatamifar, W. Lin","doi":"10.1615/jenhheattransf.2022041768","DOIUrl":"https://doi.org/10.1615/jenhheattransf.2022041768","url":null,"abstract":"","PeriodicalId":50208,"journal":{"name":"Journal of Enhanced Heat Transfer","volume":"350 1","pages":""},"PeriodicalIF":2.3,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75724214","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
期刊
Journal of Enhanced Heat Transfer
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1