首页 > 最新文献

IEEE Transactions on Electromagnetic Compatibility最新文献

英文 中文
Efficient Prediction of HEMP Coupling Response to Multilocation Transmission Lines Within a Rectangular Enclosure With Small Aperture 小孔径矩形箱体内多位置传输线HEMP耦合响应的有效预测
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-25 DOI: 10.1109/temc.2025.3634155
Haizhe Zhong, Jiantao Liang, Anxue Zhang, Fei Yang, Guoqing Wang, Xihai Li
{"title":"Efficient Prediction of HEMP Coupling Response to Multilocation Transmission Lines Within a Rectangular Enclosure With Small Aperture","authors":"Haizhe Zhong, Jiantao Liang, Anxue Zhang, Fei Yang, Guoqing Wang, Xihai Li","doi":"10.1109/temc.2025.3634155","DOIUrl":"https://doi.org/10.1109/temc.2025.3634155","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"150 1","pages":"1-4"},"PeriodicalIF":2.1,"publicationDate":"2025-11-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145599388","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Tortuous Lightning Channel Impact on the Direct Lightning Performance of Distribution Lines 曲折闪电通道对配电线路直击性能的影响
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-25 DOI: 10.1109/temc.2025.3632209
Akifumi Yamanaka, Kazuyuki Ishimoto, Akiyoshi Tatematsu
{"title":"Tortuous Lightning Channel Impact on the Direct Lightning Performance of Distribution Lines","authors":"Akifumi Yamanaka, Kazuyuki Ishimoto, Akiyoshi Tatematsu","doi":"10.1109/temc.2025.3632209","DOIUrl":"https://doi.org/10.1109/temc.2025.3632209","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"171 1","pages":"1-11"},"PeriodicalIF":2.1,"publicationDate":"2025-11-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145599387","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Theoretical Estimation on Maximum-to-Maximum Ratio of the Total Electric Field to Its Rectangular Component Within Reverberation Chambers 混响室内总电场与其矩形分量的最大与最大比值的理论估计
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-18 DOI: 10.1109/temc.2025.3626020
Peng Hu, Fujun Deng, Kai Guo, Shengyan Chen, Ru Wang, Manqi Xu, Liangliang Liu, Zhuo Li
{"title":"Theoretical Estimation on Maximum-to-Maximum Ratio of the Total Electric Field to Its Rectangular Component Within Reverberation Chambers","authors":"Peng Hu, Fujun Deng, Kai Guo, Shengyan Chen, Ru Wang, Manqi Xu, Liangliang Liu, Zhuo Li","doi":"10.1109/temc.2025.3626020","DOIUrl":"https://doi.org/10.1109/temc.2025.3626020","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"185 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145545735","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Two-Stage Adaptive Data Recovery Method From Electromagnetic Emanations Using Error Detection Codes 基于错误检测码的电磁辐射两阶段自适应数据恢复方法
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-18 DOI: 10.1109/temc.2025.3631109
Koki Abe, Taiki Kitazawa, Daisuke Fujimoto, Yuichi Hayashi
{"title":"Two-Stage Adaptive Data Recovery Method From Electromagnetic Emanations Using Error Detection Codes","authors":"Koki Abe, Taiki Kitazawa, Daisuke Fujimoto, Yuichi Hayashi","doi":"10.1109/temc.2025.3631109","DOIUrl":"https://doi.org/10.1109/temc.2025.3631109","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"32 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-11-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145545734","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Modeling Mutual Inductance in Horizontal Inductors: A Simple Analytical Method Accounting for Multidirectional Near-Field Coupling 水平电感互感的建模：一种考虑多向近场耦合的简单解析方法
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-14 DOI: 10.1109/temc.2025.3628063
Mohamed G. Congo, Mohsen Koohestani, Frédéric Lafon, Richard Perdriau, Mohamed Ramdani
{"title":"Modeling Mutual Inductance in Horizontal Inductors: A Simple Analytical Method Accounting for Multidirectional Near-Field Coupling","authors":"Mohamed G. Congo, Mohsen Koohestani, Frédéric Lafon, Richard Perdriau, Mohamed Ramdani","doi":"10.1109/temc.2025.3628063","DOIUrl":"https://doi.org/10.1109/temc.2025.3628063","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"174 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-11-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145515964","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Reinforcement Learning-Based Multiphysics Optimization of Composite Material Component With Slot-Structure in UAV System 基于强化学习的无人机缝状结构复合材料构件多物理场优化
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-13 DOI: 10.1109/temc.2025.3627846
Xinsong Wang, Guangzhi Chen, Shunchuan Yang, Qiang Ren, Zhiyu Jia, Jingxuan Chen, Yifei Gao, Wanli Du, Donglin Su
{"title":"A Reinforcement Learning-Based Multiphysics Optimization of Composite Material Component With Slot-Structure in UAV System","authors":"Xinsong Wang, Guangzhi Chen, Shunchuan Yang, Qiang Ren, Zhiyu Jia, Jingxuan Chen, Yifei Gao, Wanli Du, Donglin Su","doi":"10.1109/temc.2025.3627846","DOIUrl":"https://doi.org/10.1109/temc.2025.3627846","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"25 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145509478","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Characterization and Full-Wave Modeling of Corona Discharge Induced Coupling to Touchscreen Displays 触屏显示器电晕放电耦合特性及全波建模
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-13 DOI: 10.1109/temc.2025.3626743
Zhekun Peng, Shubhankar Marathe, Javad Meiguni, Ali Foudazi, Jianchi Zhou, Li Shen, Viswa Pilla, Cheung-Wei Lam, DongHyun Kim, David Pommerenke, Daryl G. Beetner
{"title":"Characterization and Full-Wave Modeling of Corona Discharge Induced Coupling to Touchscreen Displays","authors":"Zhekun Peng, Shubhankar Marathe, Javad Meiguni, Ali Foudazi, Jianchi Zhou, Li Shen, Viswa Pilla, Cheung-Wei Lam, DongHyun Kim, David Pommerenke, Daryl G. Beetner","doi":"10.1109/temc.2025.3626743","DOIUrl":"https://doi.org/10.1109/temc.2025.3626743","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"7 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145509481","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Modeling of Slot-Backed Microstrip Line for EMI Applications 用于电磁干扰应用的槽背微带线建模
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-13 DOI: 10.1109/temc.2025.3626471
Jongsuk Hyun, Wenchang Huang, Chulsoon Hwang
{"title":"Modeling of Slot-Backed Microstrip Line for EMI Applications","authors":"Jongsuk Hyun, Wenchang Huang, Chulsoon Hwang","doi":"10.1109/temc.2025.3626471","DOIUrl":"https://doi.org/10.1109/temc.2025.3626471","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"11 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-11-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145509476","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Orthopedic Implants Induced Unintended Nerve Stimulation During Transcutaneous Electrical Nerve Stimulation Treatment 骨科植入物在经皮神经电刺激治疗中诱导非预期神经刺激
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-11 DOI: 10.1109/temc.2025.3627884
Farzad Mir, Mingtao Du, Ziyu Zuo, Lijian Yang, Norbert Kaula, Hui Ye, Jianfeng Zheng, Ji Chen
{"title":"Orthopedic Implants Induced Unintended Nerve Stimulation During Transcutaneous Electrical Nerve Stimulation Treatment","authors":"Farzad Mir, Mingtao Du, Ziyu Zuo, Lijian Yang, Norbert Kaula, Hui Ye, Jianfeng Zheng, Ji Chen","doi":"10.1109/temc.2025.3627884","DOIUrl":"https://doi.org/10.1109/temc.2025.3627884","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"72 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145491810","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Dual-Mode Decoupling Network for Differential- and Common-Mode Noise Suppression in High-Speed Connector Systems 一种用于高速连接器系统差分和共模噪声抑制的双模解耦网络
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Transactions on Electromagnetic Compatibility
Pub Date : 2025-11-07 DOI: 10.1109/temc.2025.3624698
Chih-Yu Fang, Bin-Chyi Tseng, Tzong-Lin Wu
{"title":"A Dual-Mode Decoupling Network for Differential- and Common-Mode Noise Suppression in High-Speed Connector Systems","authors":"Chih-Yu Fang, Bin-Chyi Tseng, Tzong-Lin Wu","doi":"10.1109/temc.2025.3624698","DOIUrl":"https://doi.org/10.1109/temc.2025.3624698","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"167 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2025-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145461359","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
首页 上一页 下一页 尾页
类型
全部 化学•材料 生命科学 医学 物理 工程技术 环境•农林 材料科学 地球科学 法学 管理学 化学 环境科学与生态学 计算机科学 教育学 经济学 农林科学 人文科学 生物学 数学 物理与天体物理 心理学 综合性期刊 其他 工业工程 理学 历史学 农学 文学 信息工程
数据库
全部 ACS Publications Elsevier ieeexplore Springer The Royal Society of Chemistry Wiley
期刊
IEEE Transactions on Electromagnetic Compatibility
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
﹀
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号：604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们：info@booksci.cn
Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1