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IEEE Transactions on Electromagnetic Compatibility最新文献

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On the Validity of the AIMD Transfer Function Model Developed Over Different Implantation Trajectories 不同植入轨迹下建立的 AIMD 转移函数模型的有效性
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-03 DOI: 10.1109/temc.2024.3464125
Ziyu Zuo, Lijian Yang, Jianfeng Zheng, Qingyan Wang, Hongbae Jeong, Stuart A. Long, Ananda Kumar, Ji Chen
{"title":"On the Validity of the AIMD Transfer Function Model Developed Over Different Implantation Trajectories","authors":"Ziyu Zuo, Lijian Yang, Jianfeng Zheng, Qingyan Wang, Hongbae Jeong, Stuart A. Long, Ananda Kumar, Ji Chen","doi":"10.1109/temc.2024.3464125","DOIUrl":"https://doi.org/10.1109/temc.2024.3464125","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"23 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2024-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142374063","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Fault Injection Caused by Phase-Locked Loop Compromised With IEMI 利用 IEMI 破坏锁相环造成故障注入
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-03 DOI: 10.1109/temc.2024.3468337
Hikaru Nishiyama, Daisuke Fujimoto, Yuichi Hayashi
{"title":"Fault Injection Caused by Phase-Locked Loop Compromised With IEMI","authors":"Hikaru Nishiyama, Daisuke Fujimoto, Yuichi Hayashi","doi":"10.1109/temc.2024.3468337","DOIUrl":"https://doi.org/10.1109/temc.2024.3468337","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"59 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2024-10-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142374062","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Uncertainty Quantification in PEEC Method: A Physics-Informed Neural Networks-Based Polynomial Chaos Expansion PEEC 方法中的不确定性量化:基于物理信息神经网络的多项式混沌扩展
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-01 DOI: 10.1109/temc.2024.3462940
Yuan Ping, Yanming Zhang, Lijun Jiang
{"title":"Uncertainty Quantification in PEEC Method: A Physics-Informed Neural Networks-Based Polynomial Chaos Expansion","authors":"Yuan Ping, Yanming Zhang, Lijun Jiang","doi":"10.1109/temc.2024.3462940","DOIUrl":"https://doi.org/10.1109/temc.2024.3462940","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2024-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142362775","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Uncertainty Analysis for EMC Simulation Based on Bayesian Optimization 基于贝叶斯优化的 EMC 仿真不确定性分析
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-09-30 DOI: 10.1109/temc.2024.3457787
Jinjun Bai, Bing Hu, Alistair Duffy
{"title":"Uncertainty Analysis for EMC Simulation Based on Bayesian Optimization","authors":"Jinjun Bai, Bing Hu, Alistair Duffy","doi":"10.1109/temc.2024.3457787","DOIUrl":"https://doi.org/10.1109/temc.2024.3457787","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"1 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2024-09-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142360159","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Transient Magnetic Shielding of a Planar Conductive Screen in the Presence of a Parallel Circular Loop Carrying Pulsed Current 载脉冲电流的平行圆形环路存在时平面导电屏的瞬态磁屏蔽
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-09-25 DOI: 10.1109/temc.2024.3459923
Sijia Liu, Tianxi Li, He Huang, Chongqing Jiao
{"title":"Transient Magnetic Shielding of a Planar Conductive Screen in the Presence of a Parallel Circular Loop Carrying Pulsed Current","authors":"Sijia Liu, Tianxi Li, He Huang, Chongqing Jiao","doi":"10.1109/temc.2024.3459923","DOIUrl":"https://doi.org/10.1109/temc.2024.3459923","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"38 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2024-09-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142321729","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Frequency Characteristics of Insertion Loss and Loop Gain of VSCC Feedback Active EMI Filters VSCC 有源 EMI 滤波器插入损耗和环路增益的频率特性
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-09-24 DOI: 10.1109/temc.2024.3454127
Qi Chen, Rongxuan Zhang, Zhenyi Niu, Chunying Gong
{"title":"Frequency Characteristics of Insertion Loss and Loop Gain of VSCC Feedback Active EMI Filters","authors":"Qi Chen, Rongxuan Zhang, Zhenyi Niu, Chunying Gong","doi":"10.1109/temc.2024.3454127","DOIUrl":"https://doi.org/10.1109/temc.2024.3454127","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"2 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2024-09-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142317254","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Optimization of Source Modeling From Phaseless Near-Field Scanning Based on SVD-Defined Eigenmodes 基于 SVD 定义特征模式的无相近场扫描源建模优化
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-09-24 DOI: 10.1109/temc.2024.3449375
Min-Hsu Tsai, Hong-Wen Qian, Wei-Kai Chen, Ming-Chung Huang, Jen-Chieh Liu, Ruey-Beei Wu
{"title":"Optimization of Source Modeling From Phaseless Near-Field Scanning Based on SVD-Defined Eigenmodes","authors":"Min-Hsu Tsai, Hong-Wen Qian, Wei-Kai Chen, Ming-Chung Huang, Jen-Chieh Liu, Ruey-Beei Wu","doi":"10.1109/temc.2024.3449375","DOIUrl":"https://doi.org/10.1109/temc.2024.3449375","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"3 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2024-09-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142317255","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
PPO Algorithm-Assisted Design of Absorptive Common-Mode Suppression Filters PPO 算法辅助设计吸收型共模抑制滤波器
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-09-20 DOI: 10.1109/temc.2024.3457629
Cheng-Pan Huang, Yi-Hao Ma, Qi Qiang Liu, Wen-Sheng Zhao, Bin You, Xiang Wang, Cheng-Hao Yu, Da-Wei Wang
{"title":"PPO Algorithm-Assisted Design of Absorptive Common-Mode Suppression Filters","authors":"Cheng-Pan Huang, Yi-Hao Ma, Qi Qiang Liu, Wen-Sheng Zhao, Bin You, Xiang Wang, Cheng-Hao Yu, Da-Wei Wang","doi":"10.1109/temc.2024.3457629","DOIUrl":"https://doi.org/10.1109/temc.2024.3457629","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"106 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2024-09-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142275622","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Generation and Application of a Very Large Dataset for Signal Integrity Via Array and Link Analysis 通过阵列和链路分析生成和应用超大型信号完整性数据集
IF 2.1 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-09-18 DOI: 10.1109/temc.2024.3450307
Til Hillebrecht, Morten Schierholz, Youcef Hassab, Johannes Alfert, Christian Schuster
{"title":"Generation and Application of a Very Large Dataset for Signal Integrity Via Array and Link Analysis","authors":"Til Hillebrecht, Morten Schierholz, Youcef Hassab, Johannes Alfert, Christian Schuster","doi":"10.1109/temc.2024.3450307","DOIUrl":"https://doi.org/10.1109/temc.2024.3450307","url":null,"abstract":"","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"65 1","pages":""},"PeriodicalIF":2.1,"publicationDate":"2024-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142245497","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Visualization of Noise Coupling Paths Based on the Reciprocity Theorem 基于互易定理的噪声耦合路径可视化
IF 2 3区 计算机科学 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-09-18 DOI: 10.1109/TEMC.2024.3425575
Seungtaek Jeong;Jong Hwa Kwon;Deepak Pai;Jagan Rajagopalan;Chulsoon Hwang
In this article, visualization of noise coupling paths is proposed and verified. The coupling coefficient (CC) is derived based on the Reciprocity theorem and time-average coupled power, which represents the contribution of each spatial point to the coupled power. The physical meaning of CC is demonstrated by relating the integrations of CC in a volume space occupied by absorbers to the coupled power being suppressed by the absorbers. The proposed method is applied to a practical device and the identified dominant coupling paths are experimentally verified.
本文提出并验证了噪声耦合路径的可视化。耦合系数(CC)是根据互易定理和时间平均耦合功率得出的,它代表了每个空间点对耦合功率的贡献。通过将吸收体所占体积空间中的 CC 积分与吸收体所抑制的耦合功率联系起来,证明了 CC 的物理意义。我们将所提出的方法应用于一个实际设备,并通过实验验证了所确定的主要耦合路径。
{"title":"Visualization of Noise Coupling Paths Based on the Reciprocity Theorem","authors":"Seungtaek Jeong;Jong Hwa Kwon;Deepak Pai;Jagan Rajagopalan;Chulsoon Hwang","doi":"10.1109/TEMC.2024.3425575","DOIUrl":"10.1109/TEMC.2024.3425575","url":null,"abstract":"In this article, visualization of noise coupling paths is proposed and verified. The coupling coefficient (\u0000<italic>CC</i>\u0000) is derived based on the Reciprocity theorem and time-average coupled power, which represents the contribution of each spatial point to the coupled power. The physical meaning of \u0000<italic>CC</i>\u0000 is demonstrated by relating the integrations of \u0000<italic>CC</i>\u0000 in a volume space occupied by absorbers to the coupled power being suppressed by the absorbers. The proposed method is applied to a practical device and the identified dominant coupling paths are experimentally verified.","PeriodicalId":55012,"journal":{"name":"IEEE Transactions on Electromagnetic Compatibility","volume":"66 5","pages":"1505-1514"},"PeriodicalIF":2.0,"publicationDate":"2024-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142245498","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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IEEE Transactions on Electromagnetic Compatibility
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