Pub Date : 2024-08-06DOI: 10.1109/mmm.2024.3412568
Chang Ge, Lei Guo, Qiaowei Yuan
The Women in Engineering (WIE) session was successfully held on 10 May 2024, at the Uji Campus of Kyoto University, Japan, during the 2024 IEEE Wireless Power Technology Conference and Expo (WPTCE2024). The session was financially sponsored by IEEE WPTCE2024, the IEEE Microwave Theory and Technology Society (MTT-S) Diversity and Inclusion (D&I) Ad Hoc Committee, as well as the IEEE Power and Electronics Society (PEL-S) WIE, and technically supported by the MTT-S Women in Microwaves (WIM). The event was organized by Prof. Qiaowei Yuan of the Tohoku Institute of Technology, Japan. The primary objective of the session was to underscore the significance of D&I activities for the broad IEEE community, shed light on the ongoing initiatives of the MTT-S and PEL-S, and explore the way forward in the future. Additionally, the aim was to discuss the interconnections among D&I activities and other affinity groups, such as WIM and Young Professionals. Two months before the event, the organizing team conducted a survey on both Google and the WeChat platforms to facilitate broad participation from users worldwide. The session was conducted both online and offline to ensure widespread participation.
{"title":"Empowering Diversity and Inclusion: The WIE Session at WPTCE2024 [Women in Microwaves]","authors":"Chang Ge, Lei Guo, Qiaowei Yuan","doi":"10.1109/mmm.2024.3412568","DOIUrl":"https://doi.org/10.1109/mmm.2024.3412568","url":null,"abstract":"The Women in Engineering (WIE) session was successfully held on 10 May 2024, at the Uji Campus of Kyoto University, Japan, during the 2024 IEEE Wireless Power Technology Conference and Expo (WPTCE2024). The session was financially sponsored by IEEE WPTCE2024, the IEEE Microwave Theory and Technology Society (MTT-S) Diversity and Inclusion (D&I) Ad Hoc Committee, as well as the IEEE Power and Electronics Society (PEL-S) WIE, and technically supported by the MTT-S Women in Microwaves (WIM). The event was organized by Prof. Qiaowei Yuan of the Tohoku Institute of Technology, Japan. The primary objective of the session was to underscore the significance of D&I activities for the broad IEEE community, shed light on the ongoing initiatives of the MTT-S and PEL-S, and explore the way forward in the future. Additionally, the aim was to discuss the interconnections among D&I activities and other affinity groups, such as WIM and Young Professionals. Two months before the event, the organizing team conducted a survey on both Google and the WeChat platforms to facilitate broad participation from users worldwide. The session was conducted both online and offline to ensure widespread participation.","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":"16 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141948343","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
With the rapid development of semiconductor manufacturing technology and the booming demand in the electronics market, researchers, guided by Moore’s Law, are working toward the miniaturization and integration of devices: loading more circuits onto smaller semiconductor die and expecting smaller units to achieve superior performance. Therefore, the complexity of the transmission line routing between components or between units is rising, with iterative advanced packaging technology improving the interconnection density in integrated circuits (ICs). As a result, multiple signals in a microwave circuits inevitably intersect at one point, and the crossover comes into being.
{"title":"A Review of Nonmultilayer Planar Crossovers: Device for Transmission and Isolation of Multiple Signals in a Planar Configuration","authors":"Lanlan Liao, Zhongmao Li, Mengjie Qin, Pengzhan Liu, Xin Qiu, Zhiqiang Li","doi":"10.1109/mmm.2024.3356428","DOIUrl":"https://doi.org/10.1109/mmm.2024.3356428","url":null,"abstract":"With the rapid development of semiconductor manufacturing technology and the booming demand in the electronics market, researchers, guided by Moore’s Law, are working toward the miniaturization and integration of devices: loading more circuits onto smaller semiconductor die and expecting smaller units to achieve superior performance. Therefore, the complexity of the transmission line routing between components or between units is rising, with iterative advanced packaging technology improving the interconnection density in integrated circuits (ICs). As a result, multiple signals in a microwave circuits inevitably intersect at one point, and the crossover comes into being.","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":"46 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-07-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141610495","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-07-11DOI: 10.1109/mmm.2024.3403312
Robert L. Schmid, Nils Pohl
Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
提供从业人员和研究人员感兴趣的社会信息,包括新闻、评论或技术说明。
{"title":"Technical Committee 24 Report 2021–2023 [MTT-S Society News]","authors":"Robert L. Schmid, Nils Pohl","doi":"10.1109/mmm.2024.3403312","DOIUrl":"https://doi.org/10.1109/mmm.2024.3403312","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":"35 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141610491","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}