首页 > 最新文献

IEEE Microwave Magazine最新文献

英文 中文
LAMC 2025 Call for Papers LAMC 2025 征稿启事
IF 3.6 3区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-11 DOI: 10.1109/mmm.2024.3412289
{"title":"LAMC 2025 Call for Papers","authors":"","doi":"10.1109/mmm.2024.3412289","DOIUrl":"https://doi.org/10.1109/mmm.2024.3412289","url":null,"abstract":"","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":"51 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141610500","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
NanoVNA NanoVNA
IF 3.6 3区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-11 DOI: 10.1109/mmm.2024.3412291
{"title":"NanoVNA","authors":"","doi":"10.1109/mmm.2024.3412291","DOIUrl":"https://doi.org/10.1109/mmm.2024.3412291","url":null,"abstract":"","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":"22 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141610501","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Proceedings 电气和电子工程师学会论文集
IF 3.6 3区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-11 DOI: 10.1109/mmm.2024.3414217
{"title":"IEEE Proceedings","authors":"","doi":"10.1109/mmm.2024.3414217","DOIUrl":"https://doi.org/10.1109/mmm.2024.3414217","url":null,"abstract":"","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":"46 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141610502","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The 2024 MTT-S Graduate Student Fellowship Awards [Education News] 2024 年 MTT-S 研究生奖学金颁奖典礼 [教育新闻]
IF 3.6 3区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-11 DOI: 10.1109/mmm.2024.3403311
Giovanni Crupi, Valeria Vadalà, Marco Mercuri, Changzhi Li, Xun Gong
Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
提供从业人员和研究人员感兴趣的社会信息,包括新闻、评论或技术说明。
{"title":"The 2024 MTT-S Graduate Student Fellowship Awards [Education News]","authors":"Giovanni Crupi, Valeria Vadalà, Marco Mercuri, Changzhi Li, Xun Gong","doi":"10.1109/mmm.2024.3403311","DOIUrl":"https://doi.org/10.1109/mmm.2024.3403311","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":"22 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141610490","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Millimeter-Wave Ceramic Antennas and Fibers for Extremely High-Temperature Applications [Application Notes] 用于极高温应用的毫米波陶瓷天线和光纤 [应用说明]
IF 3.6 3区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-11 DOI: 10.1109/mmm.2024.3403300
Abhishek Sharma, Caleb Romero, Yanghyo Rod Kim
Many industrial, aerospace, and defense applications require electronics operating in harsh conditions like extremely high temperatures [1], [2], [3], [4], [5], [6], [7], [8].
许多工业、航空航天和国防应用要求电子设备在极端高温等恶劣条件下运行 [1]、[2]、[3]、[4]、[5]、[6]、[7]、[8]。
{"title":"Millimeter-Wave Ceramic Antennas and Fibers for Extremely High-Temperature Applications [Application Notes]","authors":"Abhishek Sharma, Caleb Romero, Yanghyo Rod Kim","doi":"10.1109/mmm.2024.3403300","DOIUrl":"https://doi.org/10.1109/mmm.2024.3403300","url":null,"abstract":"Many industrial, aerospace, and defense applications require electronics operating in harsh conditions like extremely high temperatures <xref ref-type=\"bibr\" r xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">[1]</xref>\u0000, <xref ref-type=\"bibr\" r xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">[2]</xref>\u0000, <xref ref-type=\"bibr\" r xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">[3]</xref>\u0000, <xref ref-type=\"bibr\" r xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">[4]</xref>\u0000, <xref ref-type=\"bibr\" r xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">[5]</xref>\u0000, <xref ref-type=\"bibr\" r xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">[6]</xref>\u0000, <xref ref-type=\"bibr\" r xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">[7]</xref>\u0000, <xref ref-type=\"bibr\" r xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">[8]</xref>\u0000.","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":"11 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141614549","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
August 2024 Conference Calendar 2024 年 8 月会议日程
IF 3.6 3区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-11 DOI: 10.1109/mmm.2024.3403316
{"title":"August 2024 Conference Calendar","authors":"","doi":"10.1109/mmm.2024.3403316","DOIUrl":"https://doi.org/10.1109/mmm.2024.3403316","url":null,"abstract":"","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":"72 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141610497","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Information, Knowledge, and Understanding [MicroBusiness] 信息、知识和理解[微商]
IF 3.6 3区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-11 DOI: 10.1109/mmm.2024.3403046
Fred Schindler
As an undergrad in engineering school, I was required to take an introduction to material science course. The textbook we used covered a wide range of material science topics. It described and named various material properties and phenomena. But there was only a superficial treatment of the underlying physics or chemistry. Our professor, no doubt a distinguished material science researcher, was particularly focused on making sure we knew material phenomena and what they were named. Our exams consisted of questions in the form of “What is the name of a certain material property?” or “Describe the phenomenon known by this name.”
作为工学院的本科生,我必须选修一门材料科学导论课程。我们使用的教科书涵盖了广泛的材料科学主题。它描述并命名了各种材料特性和现象。但对其背后的物理或化学却只是浅尝辄止。我们的教授无疑是一位杰出的材料科学研究者,他特别注重确保我们了解材料现象及其名称。我们的考试包括 "某种材料特性的名称是什么?"或 "描述这种名称的现象 "等形式的问题。
{"title":"Information, Knowledge, and Understanding [MicroBusiness]","authors":"Fred Schindler","doi":"10.1109/mmm.2024.3403046","DOIUrl":"https://doi.org/10.1109/mmm.2024.3403046","url":null,"abstract":"As an undergrad in engineering school, I was required to take an introduction to material science course. The textbook we used covered a wide range of material science topics. It described and named various material properties and phenomena. But there was only a superficial treatment of the underlying physics or chemistry. Our professor, no doubt a distinguished material science researcher, was particularly focused on making sure we knew material phenomena and what they were named. Our exams consisted of questions in the form of “What is the name of a certain material property?” or “Describe the phenomenon known by this name.”","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":"32 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141610506","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Preview of the August Issue [From the Editor’s Desk] 八月刊预览 [编辑手记]
IF 3.6 3区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-11 DOI: 10.1109/mmm.2024.3403044
Robert H. Caverly
Even though the date on the cover of this issue of IEEE Microwave Magazine says August 2024, as I write this column, the 2024 International Microwave Symposium (IMS) is still a month away. However, I don’t think I am risking much by saying that the conference was well attended and technically (and socially) engaging, with so many activities going on that one had to use care to pick and choose the ones to attend. Knowing many members of the organizational team for IMS 2024, I know they made those choices difficult, with all of the activities planned that were outlined in the 2024 May issue of IEEE Microwave Magazine. I also know you returned from IMS refreshed and ready to dive into new microwave engineering challenges.
尽管本期《IEEE 微波杂志》封面上的日期是 2024 年 8 月,但在我撰写本专栏时,2024 年国际微波研讨会(IMS)距今还有一个月的时间。然而,我认为我这样说并没有冒多大风险,这次会议的参与度很高,技术(和社交)参与度也很高,有如此多的活动,以至于人们必须小心挑选要参加的活动。我认识 IMS 2024 组织团队的许多成员,我知道他们很难做出这样的选择,因为 IEEE《微波杂志》2024 年 5 月刊中概述了计划开展的所有活动。我也知道你们从 IMS 回来后精神焕发,准备好迎接新的微波工程挑战。
{"title":"A Preview of the August Issue [From the Editor’s Desk]","authors":"Robert H. Caverly","doi":"10.1109/mmm.2024.3403044","DOIUrl":"https://doi.org/10.1109/mmm.2024.3403044","url":null,"abstract":"Even though the date on the cover of this issue of <italic xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">IEEE Microwave Magazine</i> says August 2024, as I write this column, the 2024 International Microwave Symposium (IMS) is still a month away. However, I don’t think I am risking much by saying that the conference was well attended and technically (and socially) engaging, with so many activities going on that one had to use care to pick and choose the ones to attend. Knowing many members of the organizational team for IMS 2024, I know they made those choices difficult, with all of the activities planned that were outlined in the 2024 May issue of <italic xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">IEEE Microwave Magazine</i>\u0000. I also know you returned from IMS refreshed and ready to dive into new microwave engineering challenges.","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":"81 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141610504","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
MTT-S Stay Up to Date (Naylor) MTT-S 保持更新(内勒)
IF 3.6 3区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-11 DOI: 10.1109/mmm.2024.3412309
{"title":"MTT-S Stay Up to Date (Naylor)","authors":"","doi":"10.1109/mmm.2024.3412309","DOIUrl":"https://doi.org/10.1109/mmm.2024.3412309","url":null,"abstract":"","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":"24 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141614548","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Fourier-Space Image Reconstruction Using Microwave Measurements: The Path Toward Real-Time Microwave and Millimeter-Wave Imaging 利用微波测量进行傅立叶空间图像重建:迈向实时微波和毫米波成像之路
IF 3.6 3区 计算机科学 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-11 DOI: 10.1109/mmm.2024.3403047
Reza K. Amineh, Natalia K. Nikolova
The use of electromagnetic waves at microwave and millimeter-wave (mm-wave) frequencies in imaging has been growing rapidly in the last two decades with applications in security screening, biomedical imaging, nondestructive testing, and the inspection of goods and packages. The nonionizing nature of the radiation renders microwave and mm-wave imaging (MMI) safe for humans and, thus, attractive, especially for frequent imaging of living tissue and humans. At the same time, the radiation penetrates many materials, which are optically opaque: e.g., fog and foliage, soil and living tissue, brick and drywall, wood, fabrics, and plastics. Importantly, modern MMI systems offer compact and relatively low-cost hardware due to advancements in high-frequency microelectronics.
微波和毫米波(mm-wave)频率的电磁波在成像中的应用在过去二十年中迅速发展,应用于安检、生物医学成像、无损检测以及货物和包装检查。辐射的非电离特性使微波和毫米波成像(MMI)对人体安全,因此很有吸引力,特别是在对活体组织和人体进行频繁成像时。同时,辐射还能穿透许多光学上不透明的材料:如雾和树叶、土壤和活体组织、砖和干墙、木材、织物和塑料。重要的是,由于高频微电子技术的进步,现代 MMI 系统的硬件结构紧凑,成本相对较低。
{"title":"Fourier-Space Image Reconstruction Using Microwave Measurements: The Path Toward Real-Time Microwave and Millimeter-Wave Imaging","authors":"Reza K. Amineh, Natalia K. Nikolova","doi":"10.1109/mmm.2024.3403047","DOIUrl":"https://doi.org/10.1109/mmm.2024.3403047","url":null,"abstract":"The use of electromagnetic waves at microwave and millimeter-wave (mm-wave) frequencies in imaging has been growing rapidly in the last two decades with applications in security screening, biomedical imaging, nondestructive testing, and the inspection of goods and packages. The nonionizing nature of the radiation renders microwave and mm-wave imaging (MMI) safe for humans and, thus, attractive, especially for frequent imaging of living tissue and humans. At the same time, the radiation penetrates many materials, which are optically opaque: e.g., fog and foliage, soil and living tissue, brick and drywall, wood, fabrics, and plastics. Importantly, modern MMI systems offer compact and relatively low-cost hardware due to advancements in high-frequency microelectronics.","PeriodicalId":55023,"journal":{"name":"IEEE Microwave Magazine","volume":"154 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-07-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141610507","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
IEEE Microwave Magazine
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1