首页 > 最新文献

IEEE Communications Magazine最新文献

英文 中文
IEEE World Forum IoT 电气和电子工程师学会世界物联网论坛
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-11-06 DOI: 10.1109/mcom.2024.10746296
{"title":"IEEE World Forum IoT","authors":"","doi":"10.1109/mcom.2024.10746296","DOIUrl":"https://doi.org/10.1109/mcom.2024.10746296","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"33 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2024-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142594856","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Tower Companies vs. Mergers in Mobile Networks 铁塔公司与移动网络合并
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-11-06 DOI: 10.1109/mcom.001.2400108
Pantelis Koutroumpis, Konstantinos Masselos
{"title":"Tower Companies vs. Mergers in Mobile Networks","authors":"Pantelis Koutroumpis, Konstantinos Masselos","doi":"10.1109/mcom.001.2400108","DOIUrl":"https://doi.org/10.1109/mcom.001.2400108","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"2 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2024-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142594862","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE App IEEE 应用程序
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-11-06 DOI: 10.1109/mcom.2024.10746297
{"title":"IEEE App","authors":"","doi":"10.1109/mcom.2024.10746297","DOIUrl":"https://doi.org/10.1109/mcom.2024.10746297","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"9 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2024-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142594866","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Techno-Economic Assessment of LEO Mega-Constellation with Multi-Satellite Collaboration 多卫星合作的低地球轨道巨型星座技术经济评估
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-11-06 DOI: 10.1109/mcom.006.2400126
Neng Ye, Chaoqun Hou, Qiaolin Ouyang, Bichen Kang, Hyundong Shin, Shahid Mumtaz
{"title":"Techno-Economic Assessment of LEO Mega-Constellation with Multi-Satellite Collaboration","authors":"Neng Ye, Chaoqun Hou, Qiaolin Ouyang, Bichen Kang, Hyundong Shin, Shahid Mumtaz","doi":"10.1109/mcom.006.2400126","DOIUrl":"https://doi.org/10.1109/mcom.006.2400126","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"34 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2024-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142594871","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Look Back 回顾过去
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-11-06 DOI: 10.1109/mcom.2024.10746288
{"title":"A Look Back","authors":"","doi":"10.1109/mcom.2024.10746288","DOIUrl":"https://doi.org/10.1109/mcom.2024.10746288","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"34 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2024-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142594880","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Cover 3 封面 3
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-11-06 DOI: 10.1109/mcom.2024.10746294
{"title":"Cover 3","authors":"","doi":"10.1109/mcom.2024.10746294","DOIUrl":"https://doi.org/10.1109/mcom.2024.10746294","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"3 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2024-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142594882","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
ComSoc AW Training ComSoc AW 培训
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-11-06 DOI: 10.1109/mcom.2024.10746295
{"title":"ComSoc AW Training","authors":"","doi":"10.1109/mcom.2024.10746295","DOIUrl":"https://doi.org/10.1109/mcom.2024.10746295","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"42 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2024-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142594859","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Foundation 电气和电子工程师学会基金会
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-11-06 DOI: 10.1109/mcom.2024.10746305
{"title":"IEEE Foundation","authors":"","doi":"10.1109/mcom.2024.10746305","DOIUrl":"https://doi.org/10.1109/mcom.2024.10746305","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"28 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2024-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142594873","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Women in Engineering 工程学领域的女性
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-11-06 DOI: 10.1109/mcom.2024.10746293
{"title":"Women in Engineering","authors":"","doi":"10.1109/mcom.2024.10746293","DOIUrl":"https://doi.org/10.1109/mcom.2024.10746293","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"37 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2024-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142594878","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
ComSoc Emerging Technologies ComSoc 新兴技术
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-11-06 DOI: 10.1109/mcom.2024.10746261
Robert Schober, Fambirai Takawira
{"title":"ComSoc Emerging Technologies","authors":"Robert Schober, Fambirai Takawira","doi":"10.1109/mcom.2024.10746261","DOIUrl":"https://doi.org/10.1109/mcom.2024.10746261","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"60 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2024-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142594885","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
IEEE Communications Magazine
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1