首页 > 最新文献

IEEE Communications Magazine最新文献

英文 中文
ComSoc's Progress and Accomplishments in 2024–2025 2024-2025年ComSoc的进展与成就
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2025-12-09 DOI: 10.1109/mcom.2025.11293144
Robert Schober, Chengshan Xiao, Ana Garcia Armada, Octavia A. Dobre, Wei Zhang
{"title":"ComSoc's Progress and Accomplishments in 2024–2025","authors":"Robert Schober, Chengshan Xiao, Ana Garcia Armada, Octavia A. Dobre, Wei Zhang","doi":"10.1109/mcom.2025.11293144","DOIUrl":"https://doi.org/10.1109/mcom.2025.11293144","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"149 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2025-12-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145717769","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Innovation Testbed IEEE创新试验台
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2025-12-09 DOI: 10.1109/mcom.2025.11293162
{"title":"IEEE Innovation Testbed","authors":"","doi":"10.1109/mcom.2025.11293162","DOIUrl":"https://doi.org/10.1109/mcom.2025.11293162","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"249 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2025-12-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145718193","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Foundation IEEE基金会
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2025-12-09 DOI: 10.1109/mcom.2025.11293142
{"title":"IEEE Foundation","authors":"","doi":"10.1109/mcom.2025.11293142","DOIUrl":"https://doi.org/10.1109/mcom.2025.11293142","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"38 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2025-12-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145717760","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
2025–2026 Conference Calendar 2025-2026年会议日历
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2025-12-09 DOI: 10.1109/mcom.2025.11293018
{"title":"2025–2026 Conference Calendar","authors":"","doi":"10.1109/mcom.2025.11293018","DOIUrl":"https://doi.org/10.1109/mcom.2025.11293018","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"37 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2025-12-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145717761","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
In Memoriam: Professor Hussein Mouftah 纪念：Hussein Mouftah教授
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2025-12-09 DOI: 10.1109/mcom.2025.11293153
Celia Desmond, Admela Jukan, Melike Erol-Kantarci, Hossam Hassanein, Burak Kantarci, Suresh Subramaniam, Hussein Mouftah
{"title":"In Memoriam: Professor Hussein Mouftah","authors":"Celia Desmond, Admela Jukan, Melike Erol-Kantarci, Hossam Hassanein, Burak Kantarci, Suresh Subramaniam, Hussein Mouftah","doi":"10.1109/mcom.2025.11293153","DOIUrl":"https://doi.org/10.1109/mcom.2025.11293153","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"143 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2025-12-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145717768","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Advance Communications and Sensing Development: Keysight 先进通信和传感发展：是德科技
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2025-12-09 DOI: 10.1109/mcom.2025.11293175
{"title":"Advance Communications and Sensing Development: Keysight","authors":"","doi":"10.1109/mcom.2025.11293175","DOIUrl":"https://doi.org/10.1109/mcom.2025.11293175","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"7 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2025-12-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145717772","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Access IEEE访问
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2025-12-09 DOI: 10.1109/mcom.2025.11293171
{"title":"IEEE Access","authors":"","doi":"10.1109/mcom.2025.11293171","DOIUrl":"https://doi.org/10.1109/mcom.2025.11293171","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"112 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2025-12-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145717771","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Women in Engineering 工程领域的女性
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2025-12-09 DOI: 10.1109/mcom.2025.11293193
{"title":"Women in Engineering","authors":"","doi":"10.1109/mcom.2025.11293193","DOIUrl":"https://doi.org/10.1109/mcom.2025.11293193","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"8 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2025-12-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145718355","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Corporate Programs 企业项目
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2025-12-09 DOI: 10.1109/mcom.2025.11293161
{"title":"Corporate Programs","authors":"","doi":"10.1109/mcom.2025.11293161","DOIUrl":"https://doi.org/10.1109/mcom.2025.11293161","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"142 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2025-12-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145717762","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Look Back 回顾过去
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2025-12-09 DOI: 10.1109/mcom.2025.11293202
{"title":"A Look Back","authors":"","doi":"10.1109/mcom.2025.11293202","DOIUrl":"https://doi.org/10.1109/mcom.2025.11293202","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":"38 1","pages":""},"PeriodicalIF":11.2,"publicationDate":"2025-12-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145717774","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
首页 上一页
类型
全部 化学•材料 生命科学 医学 物理 工程技术 环境•农林 材料科学 地球科学 法学 管理学 化学 环境科学与生态学 计算机科学 教育学 经济学 农林科学 人文科学 生物学 数学 物理与天体物理 心理学 综合性期刊 其他 工业工程 理学 历史学 农学 文学 信息工程
数据库
全部 ACS Publications Elsevier ieeexplore Springer The Royal Society of Chemistry Wiley
期刊
IEEE Communications Magazine
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
﹀
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号：604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们：info@booksci.cn
Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1