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Global Communications Newsletter 全球通讯
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2024-09-03 DOI: 10.1109/mcom.2024.10663815
Stefano Bregni, Yessica Sáez, James Won-Ki Hong, Myung-Sup Kim, Baek-Young Choi, Roberto Riggio, Ana García Armada
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引用次数: 0
Interference Management for Full-Duplex ISAC in B5G/6G Networks: Architectures, Challenges, and Solutions B5G/6G 网络中全双工 ISAC 的干扰管理：架构、挑战和解决方案
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2024-09-03 DOI: 10.1109/mcom.001.2300654
Aimin Tang, Xudong Wang, J. Andrew Zhang
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引用次数: 0
Comsoc AW Training Comsoc AW 培训
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2024-09-03 DOI: 10.1109/mcom.2024.10663799
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引用次数: 0
Toward Green RF Chain Design for Integrated Sensing and Communications: Technologies and Future Directions 为综合传感与通信设计绿色射频链：技术与未来方向
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2024-09-03 DOI: 10.1109/mcom.001.2300698
Yi Gong, Xinru Li, Fanke Meng, Lei Liu, Mohsen Guizani, Zhan Xu
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引用次数: 0
Guest Editorial: Integrating Sensing and Communications 特邀社论：传感与通信一体化
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2024-09-03 DOI: 10.1109/mcom.2024.10663789
Weijie Yuan, Giuseppe Caire, Carlos Cordeiro, Tao Gu
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引用次数: 0
AI-Enhanced Integrated Sensing and Communications: Advancements, Challenges, and Prospects 人工智能增强型综合传感与通信：进步、挑战与前景
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2024-09-03 DOI: 10.1109/mcom.001.2300724
Nan Wu, Rongkun Jiang, Xinyi Wang, Lyuxiao Yang, Kecheng Zhang, Wenqiang Yi, Arumugam Nallanathan
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引用次数: 0
Comsoc IWC Training Comsoc IWC 培训
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2024-09-03 DOI: 10.1109/mcom.2024.10663810
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引用次数: 0
Advertisters Index 广告商索引
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2024-09-03 DOI: 10.1109/mcom.2024.10663813
{"title":"Advertisters Index","authors":"","doi":"10.1109/mcom.2024.10663813","DOIUrl":"https://doi.org/10.1109/mcom.2024.10663813","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":null,"pages":null},"PeriodicalIF":11.2,"publicationDate":"2024-09-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142130686","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
800G Low-Latency Photonic Data-Center Interconnections over 5 km Hollow-Core Fiber 通过 5 千米空芯光纤实现 800G 低延迟光子数据中心互联
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2024-09-02 DOI: 10.1109/mcom.001.2300806
Hailin Yang, Meng Xiang, Wenzhuo Cheng, Gai Zhou, Jianping Li, Yingying Wang, Shoufei Gao, Wei Ding, Songnian Fu, Yuwen Qin
{"title":"800G Low-Latency Photonic Data-Center Interconnections over 5 km Hollow-Core Fiber","authors":"Hailin Yang, Meng Xiang, Wenzhuo Cheng, Gai Zhou, Jianping Li, Yingying Wang, Shoufei Gao, Wei Ding, Songnian Fu, Yuwen Qin","doi":"10.1109/mcom.001.2300806","DOIUrl":"https://doi.org/10.1109/mcom.001.2300806","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":null,"pages":null},"PeriodicalIF":11.2,"publicationDate":"2024-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142123855","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Future Optical Access Networks Enabled by Digital Signal Processing and Physical Layer Softwarization 数字信号处理和物理层软化带来的未来光接入网络
IF 11.2 2区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC
IEEE Communications Magazine
Pub Date : 2024-09-02 DOI: 10.1109/mcom.001.2400098
Sang-Yuep Kim, Takahiro Suzuki, Jun-ichi Kani, Tomoaki Yoshida
{"title":"Future Optical Access Networks Enabled by Digital Signal Processing and Physical Layer Softwarization","authors":"Sang-Yuep Kim, Takahiro Suzuki, Jun-ichi Kani, Tomoaki Yoshida","doi":"10.1109/mcom.001.2400098","DOIUrl":"https://doi.org/10.1109/mcom.001.2400098","url":null,"abstract":"","PeriodicalId":55030,"journal":{"name":"IEEE Communications Magazine","volume":null,"pages":null},"PeriodicalIF":11.2,"publicationDate":"2024-09-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142123806","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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