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Journal of the Korean Institute of Electromagnetic Engineering and Science最新文献

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Sensor Application Using UWB Communication: In-Vehicle Seat Occupancy Detection 基于超宽带通信的传感器应用:车载座位占用检测
Pub Date : 2023-04-01 DOI: 10.5515/kjkiees.2023.34.4.249
Chang Jin Kim, B. Han, Junyoung Lee, Sunwoo Jung, Byung-Jun Jang
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引用次数: 0
Liquid Crystal-Based Reconfigurable Reflectarray Antenna Unit Cell Structure with Improved Response Time 改进响应时间的液晶可重构反射天线单元结构
Pub Date : 2023-04-01 DOI: 10.5515/kjkiees.2023.34.4.277
Euiho Shin, Jungsuek Oh
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引用次数: 0
A Ka-Band Radar Receiver with Built-in X8 Multiplier 一种内置X8倍频的ka波段雷达接收机
Pub Date : 2023-04-01 DOI: 10.5515/kjkiees.2022.34.4.326
Changui Lee, D. Yang, Seuk-Won kang, Byung-Sung Kim
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引用次数: 0
Design of a 433 MHz Ultra-Low Power Wake-Up Receiver Using Dickson Rectifier 基于Dickson整流器的433mhz超低功耗唤醒接收机设计
Pub Date : 2023-04-01 DOI: 10.5515/kjkiees.2023.34.4.289
S. Jang, Shinae Kim, Young-Sik Kim
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引用次数: 0
Design of a Wideband Shark-Fin Antenna Using Coupler and Half-Wavelength Loop Pattern 基于耦合器和半波长环路模式的宽带鲨鱼鳍天线设计
Pub Date : 2023-04-01 DOI: 10.5515/kjkiees.2023.34.4.256
Hyok Lee, Won-Sun Chung, Jae-Hyun Kim, Jae-Hoon Choi
{"title":"Design of a Wideband Shark-Fin Antenna Using Coupler and\u0000 Half-Wavelength Loop Pattern","authors":"Hyok Lee, Won-Sun Chung, Jae-Hyun Kim, Jae-Hoon Choi","doi":"10.5515/kjkiees.2023.34.4.256","DOIUrl":"https://doi.org/10.5515/kjkiees.2023.34.4.256","url":null,"abstract":"","PeriodicalId":55817,"journal":{"name":"Journal of the Korean Institute of Electromagnetic Engineering and Science","volume":"38 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85831489","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Ka-Band Radar Receiver with Built-in X8 Multiplier 一种内置X8倍频的ka波段雷达接收机
Pub Date : 2023-04-01 DOI: 10.5515/kjkiees.2023.34.4.326
Chan-Jong Lee, Dong-Yeol Yang, Seuk-Won kang, Byung-Sung Kim
This paper proposes a 32 GHz band radar receiver with an X8 multiplier. The Ka-band Rx chip used in the receiver was fabricated by using a 28-nm complimentary metal-oxide-semiconductor (CMOS) process and its built-in X8 multiplier enables the chip to driven by a low reference signal of 4 GHz. The designed Rx chip was attached to the ground plane of a microstrip patch antenna and connected to the feedline via the bonding wire. The impedance matching circuit was implemented along the antenna feedline by considering the impedance changes caused by the bonding wire. The reference input signal, intermediate frequency (IF) output, and bias of the receiver were supplied on an FR4 substrate with a cavity, which enabled easy implementation of the Ka-band receiver module without requiring expensive and precise packaging technology. The performance of the fabricated receiver module was verified in an over-the-air (OTA) test.
提出了一种采用X8倍频的32 GHz波段雷达接收机。接收器中使用的ka波段Rx芯片采用28纳米互补金属氧化物半导体(CMOS)工艺制造,其内置的X8倍频器使芯片能够由4 GHz的低参考信号驱动。所设计的Rx芯片附着在微带贴片天线的接地面上,通过键合线与馈线连接。考虑结合线引起的阻抗变化,沿天线馈线实现阻抗匹配电路。参考输入信号、中频(IF)输出和接收器的偏置在带腔的FR4基板上提供,这使得ka波段接收器模块易于实现,而不需要昂贵和精确的封装技术。制造的接收模块的性能在空中(OTA)测试中得到验证。
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引用次数: 0
S-Band Wideband Harmonic Transponder with Wide Input Power Range 宽输入功率范围的s波段宽带谐波转发器
Pub Date : 2023-04-01 DOI: 10.5515/kjkiees.2023.34.4.283
Sungyu Kim, Jisu Kim, Juntaek Oh
{"title":"S-Band Wideband Harmonic Transponder with Wide\u0000 Input Power Range","authors":"Sungyu Kim, Jisu Kim, Juntaek Oh","doi":"10.5515/kjkiees.2023.34.4.283","DOIUrl":"https://doi.org/10.5515/kjkiees.2023.34.4.283","url":null,"abstract":"","PeriodicalId":55817,"journal":{"name":"Journal of the Korean Institute of Electromagnetic Engineering and Science","volume":"38 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79838284","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Electromagnetic Scattering Analysis of 3D Dielectric Multi-Coated Structures Using Finite Element Method 三维介质多层涂层结构的电磁散射有限元分析
Pub Date : 2023-04-01 DOI: 10.5515/kjkiees.2023.34.4.263
Hyesun Na, Eunjung Lee
{"title":"Electromagnetic Scattering Analysis of 3D Dielectric Multi-Coated\u0000 Structures Using Finite Element Method","authors":"Hyesun Na, Eunjung Lee","doi":"10.5515/kjkiees.2023.34.4.263","DOIUrl":"https://doi.org/10.5515/kjkiees.2023.34.4.263","url":null,"abstract":"","PeriodicalId":55817,"journal":{"name":"Journal of the Korean Institute of Electromagnetic Engineering and Science","volume":"55 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81798691","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Millimeter-Wave Flip-Chip Bonding for On-Board Measurement 用于板上测量的毫米波倒装芯片键合
Pub Date : 2023-04-01 DOI: 10.5515/kjkiees.2023.34.4.273
Ju-Won Kim, B. Min
{"title":"Millimeter-Wave Flip-Chip Bonding for On-Board\u0000 Measurement","authors":"Ju-Won Kim, B. Min","doi":"10.5515/kjkiees.2023.34.4.273","DOIUrl":"https://doi.org/10.5515/kjkiees.2023.34.4.273","url":null,"abstract":"","PeriodicalId":55817,"journal":{"name":"Journal of the Korean Institute of Electromagnetic Engineering and Science","volume":"36 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72473237","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A 130-GHz Low-Area Power Amplifier in 40-nm CMOS 一种采用40纳米CMOS的130 ghz低面积功率放大器
Pub Date : 2023-04-01 DOI: 10.5515/kjkiees.2022.34.4.310
Jaegwan Kim, C. Lee, M. Seo
{"title":"A 130-GHz Low-Area Power Amplifier in 40-nm CMOS","authors":"Jaegwan Kim, C. Lee, M. Seo","doi":"10.5515/kjkiees.2022.34.4.310","DOIUrl":"https://doi.org/10.5515/kjkiees.2022.34.4.310","url":null,"abstract":"","PeriodicalId":55817,"journal":{"name":"Journal of the Korean Institute of Electromagnetic Engineering and Science","volume":"33 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75069390","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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Journal of the Korean Institute of Electromagnetic Engineering and Science
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