Pub Date : 2019-02-01DOI: 10.23919/PanPacific.2019.8696919
M. Nagao
The external factors around the semiconductor has changed dynamically. The factors include the smartphone growth that had lead the market about decades has slowed down and the growth of the advanced technology needs for realizing the society using 5G and AI, constructing the datacenters to handle the huge data and the trade conflict between US and China etc. Toppan printings has covered the front-end business including leadframe, photmasks, OCF(On-chip colour filter) and FCBGA(Flip Chip Ball Grid Array) and have our own business forecast and the analysis. This paper will give you the analysis and the suggestion for the current situation of the semiconductor market and the forecast based on the view from the frontend semiconductor side.
{"title":"The Semiconductor Trend From The Front-End View","authors":"M. Nagao","doi":"10.23919/PanPacific.2019.8696919","DOIUrl":"https://doi.org/10.23919/PanPacific.2019.8696919","url":null,"abstract":"The external factors around the semiconductor has changed dynamically. The factors include the smartphone growth that had lead the market about decades has slowed down and the growth of the advanced technology needs for realizing the society using 5G and AI, constructing the datacenters to handle the huge data and the trade conflict between US and China etc. Toppan printings has covered the front-end business including leadframe, photmasks, OCF(On-chip colour filter) and FCBGA(Flip Chip Ball Grid Array) and have our own business forecast and the analysis. This paper will give you the analysis and the suggestion for the current situation of the semiconductor market and the forecast based on the view from the frontend semiconductor side.","PeriodicalId":6747,"journal":{"name":"2019 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"1991 1","pages":"1-6"},"PeriodicalIF":0.0,"publicationDate":"2019-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82342277","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-02-01DOI: 10.23919/PANPACIFIC.2019.8696890
K. Piotrowska, Simone Laganá, M. Jellesen, R. Ambat
The reliability issues faced by modern electronic devices are inherently related to the non-optimized manufacturing process, which leaves behind a substantial amount of soldering residues of an aggressive nature. The use of flux systems for soldering purposes is vital, however, upon exposure of the device to harsh climatic conditions, it can result in the compromised corrosion reliability of the Printed Circuit Board Assembly (PCBA) due to the corrosive nature of the flux system. In this paper, the behavior of reflow process-related solder flux residues was investigated. The evolutions of potentially corrosive flux components from the soldered pads exposed to high humidity and temperature conditions was studied as a function of exposure climate and solder paste type using the acidity indication gel test. Changes in the filmformer morphology due to the climatic exposure were visualized using light optical and scanning electron microscopy, and correlated to the observations from the gel test. Quantification of the residue level was performed using the conductivity measurements. Results show that evolution of acidic residues from the reflow-soldered pads occurs upon exposure to high temperature and humidity levels. The exposure time defines the extent of evolution, and it was found to be typically directly proportional.
{"title":"Impact of Process-Related Flux Contamination on the Electronics Reliability Issues Under Detrimental Climatic Conditions","authors":"K. Piotrowska, Simone Laganá, M. Jellesen, R. Ambat","doi":"10.23919/PANPACIFIC.2019.8696890","DOIUrl":"https://doi.org/10.23919/PANPACIFIC.2019.8696890","url":null,"abstract":"The reliability issues faced by modern electronic devices are inherently related to the non-optimized manufacturing process, which leaves behind a substantial amount of soldering residues of an aggressive nature. The use of flux systems for soldering purposes is vital, however, upon exposure of the device to harsh climatic conditions, it can result in the compromised corrosion reliability of the Printed Circuit Board Assembly (PCBA) due to the corrosive nature of the flux system. In this paper, the behavior of reflow process-related solder flux residues was investigated. The evolutions of potentially corrosive flux components from the soldered pads exposed to high humidity and temperature conditions was studied as a function of exposure climate and solder paste type using the acidity indication gel test. Changes in the filmformer morphology due to the climatic exposure were visualized using light optical and scanning electron microscopy, and correlated to the observations from the gel test. Quantification of the residue level was performed using the conductivity measurements. Results show that evolution of acidic residues from the reflow-soldered pads occurs upon exposure to high temperature and humidity levels. The exposure time defines the extent of evolution, and it was found to be typically directly proportional.","PeriodicalId":6747,"journal":{"name":"2019 Pan Pacific Microelectronics Symposium (Pan Pacific)","volume":"69 1","pages":"1-8"},"PeriodicalIF":0.0,"publicationDate":"2019-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90724282","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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