Weitao Jia, Shuaibo Wang, Quan Gao, Lifeng Ma, ChenChen Zhi
This study addresses the issues of coarse-grain size in the core and radial microstructural inhomogeneity of extruded magnesium alloy rods by proposing a rotational-bending coupled deformation process for regulation. Combining finite element simulations with experiments, the effects of bending angle (155°–175°), rotational cycle (1–120 r), and deformation temperature (200–350 °C) on the deformation behavior and microstructural properties of the rods are analyzed. Results demonstrate that the established finite element model accurately predicts stress/strain field distributions. The accumulated plastic strain in the bar exhibits a gradient distribution from surface to core, with both the gradient span and circumferential uniformity improving as the bending angle, rotation cycle, and temperature increase. Temperature significantly influences microstructural evolution. At 200 °C, twinning predominates. Upon further heating, dynamic recrystallization intensifies, resulting in pronounced equiaxed grains in the core. Under optimized conditions of θ = 155° and N = 120 revolutions, grain refinement achieves optimal results, reducing grain size by half compared to the initial state. This process enables continuous gradient control of microstructure, significantly enhances overall microhardness, and improves gradient continuity in hardness distribution, providing a novel approach for fabricating gradient-structured magnesium alloy rods.
{"title":"Cumulative Deformation Gradient and Microstructure Evolution of Magnesium Alloy Bars Induced by Rotation-Bending Coupling","authors":"Weitao Jia, Shuaibo Wang, Quan Gao, Lifeng Ma, ChenChen Zhi","doi":"10.1002/adem.202502414","DOIUrl":"https://doi.org/10.1002/adem.202502414","url":null,"abstract":"<p>This study addresses the issues of coarse-grain size in the core and radial microstructural inhomogeneity of extruded magnesium alloy rods by proposing a rotational-bending coupled deformation process for regulation. Combining finite element simulations with experiments, the effects of bending angle (155°–175°), rotational cycle (1–120 r), and deformation temperature (200–350 °C) on the deformation behavior and microstructural properties of the rods are analyzed. Results demonstrate that the established finite element model accurately predicts stress/strain field distributions. The accumulated plastic strain in the bar exhibits a gradient distribution from surface to core, with both the gradient span and circumferential uniformity improving as the bending angle, rotation cycle, and temperature increase. Temperature significantly influences microstructural evolution. At 200 °C, twinning predominates. Upon further heating, dynamic recrystallization intensifies, resulting in pronounced equiaxed grains in the core. Under optimized conditions of <i>θ </i>= 155° and <i>N </i>= 120 revolutions, grain refinement achieves optimal results, reducing grain size by half compared to the initial state. This process enables continuous gradient control of microstructure, significantly enhances overall microhardness, and improves gradient continuity in hardness distribution, providing a novel approach for fabricating gradient-structured magnesium alloy rods.</p>","PeriodicalId":7275,"journal":{"name":"Advanced Engineering Materials","volume":"28 3","pages":""},"PeriodicalIF":3.3,"publicationDate":"2025-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146140170","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The rapid advancement of microelectronic technologies and smart devices has intensified the need for electromagnetic interference (EMI) shielding materials that are not only efficient and multifunctional, but also sustainable and environmentally friendly. Biomass-based materials, with their unique hierarchical architectures, diverse chemical functionalities, and inherent renewability, have emerged as promising candidates in this domain. This review provides a systematic overview of the structural characteristics and functional advantages of biomass-derived EMI shielding composite materials, with an emphasis on shielding mechanisms and performance optimization strategies. Particular attention is given to the synergistic integration of various conductive components (e.g., MXene, carbon, metals, and conductive polymers) with rational structural designs (such as film, porous frameworks, and bicontinuous architectures), which enable the development of materials with enhanced shielding efficiency and structural stability. Finally, the outlook outlines key future directions, including sustainable filler development, intelligent shielding architectures, green scalable fabrication, and data-driven materials design. This work offers comprehensive insights to guide the innovation of next-generation high-performance, ecofriendly EMI shielding materials for advanced electronic and communication applications.
{"title":"Green Electromagnetic Shielding Materials from Biomass: Mechanisms, Design Strategies, and Future Perspectives","authors":"Yong Liu, Kangjie Zhou, Shuaiyuan Wang, Zhen Guo","doi":"10.1002/adem.202502678","DOIUrl":"https://doi.org/10.1002/adem.202502678","url":null,"abstract":"<p>The rapid advancement of microelectronic technologies and smart devices has intensified the need for electromagnetic interference (EMI) shielding materials that are not only efficient and multifunctional, but also sustainable and environmentally friendly. Biomass-based materials, with their unique hierarchical architectures, diverse chemical functionalities, and inherent renewability, have emerged as promising candidates in this domain. This review provides a systematic overview of the structural characteristics and functional advantages of biomass-derived EMI shielding composite materials, with an emphasis on shielding mechanisms and performance optimization strategies. Particular attention is given to the synergistic integration of various conductive components (e.g., MXene, carbon, metals, and conductive polymers) with rational structural designs (such as film, porous frameworks, and bicontinuous architectures), which enable the development of materials with enhanced shielding efficiency and structural stability. Finally, the outlook outlines key future directions, including sustainable filler development, intelligent shielding architectures, green scalable fabrication, and data-driven materials design. This work offers comprehensive insights to guide the innovation of next-generation high-performance, ecofriendly EMI shielding materials for advanced electronic and communication applications.</p>","PeriodicalId":7275,"journal":{"name":"Advanced Engineering Materials","volume":"28 3","pages":""},"PeriodicalIF":3.3,"publicationDate":"2025-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146139884","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Reducing the width and space of copper lines on advanced organic packaging substrates is a direct way to increase the circuit density for multifunctional applications. Herein, a new process called copper tooth transfer printing (CTTP) is reported that can manufacture substrates with fine line width and space using traditional low-cost printed circuit board manufacture equipment. A scalable SiO2/epoxy composite film is fabricated by die coating and performed high performance for realizing the CTTP process. Two types of copper foils of high temperature elongation electrodeposited (HTE) and reverse treat foil (RTF) with different surface roughness are used to evaluate the CTTP process. The pit structure observed on the composite film surface after CTTP process offers rivet point for the forming of copper seed layer. High values of peel strength about 0.48 and 0.33 N mm−1 are achieved by using HTE and RTF copper foils, respectively. Importantly, a high automated optical inspection yield rate of the lines above 96% on both side of the substrate with line width and space of 40/20 μm is achieved by using the RTF copper foil owing to the less copper tumor formed. The CTTP process will be a promising route for fabricating advanced high-density packaging substrates.
减少先进有机封装基板上铜线的宽度和空间是增加多功能应用电路密度的直接途径。本文报道了一种铜齿转移印刷(CTTP)的新工艺,该工艺可以使用传统的低成本印刷电路板制造设备制造具有细线宽度和空间的基板。采用模涂法制备了一种可伸缩的SiO2/环氧复合薄膜,并实现了CTTP工艺的高性能。采用不同表面粗糙度的高温延伸电沉积铜箔(HTE)和反向处理铜箔(RTF)对CTTP工艺进行了评价。CTTP工艺后复合膜表面的凹坑结构为铜籽层的形成提供了铆接点。HTE和RTF铜箔的剥离强度分别为0.48和0.33 N mm−1。重要的是,由于RTF铜箔形成的铜瘤较少,因此在线宽和间距为40/20 μm的衬底两侧实现了96%以上的自动光学检测率。CTTP工艺将是制造先进高密度封装基板的一条有前途的途径。
{"title":"Scalable SiO2/Epoxy Dielectric Films for High-Yield and Fine-Line Substrate Fabrication via Copper Tooth Transfer Printing","authors":"Suibin Luo, Yuying Sui, Junyi Yu, Chunbo Gao, Chuanxi Zhu, Pengpeng Xu, Wen-Di Li, Xun Wei, Shuhui Yu","doi":"10.1002/adem.202502745","DOIUrl":"https://doi.org/10.1002/adem.202502745","url":null,"abstract":"<p>Reducing the width and space of copper lines on advanced organic packaging substrates is a direct way to increase the circuit density for multifunctional applications. Herein, a new process called copper tooth transfer printing (CTTP) is reported that can manufacture substrates with fine line width and space using traditional low-cost printed circuit board manufacture equipment. A scalable SiO<sub>2</sub>/epoxy composite film is fabricated by die coating and performed high performance for realizing the CTTP process. Two types of copper foils of high temperature elongation electrodeposited (HTE) and reverse treat foil (RTF) with different surface roughness are used to evaluate the CTTP process. The pit structure observed on the composite film surface after CTTP process offers rivet point for the forming of copper seed layer. High values of peel strength about 0.48 and 0.33 N mm<sup>−1</sup> are achieved by using HTE and RTF copper foils, respectively. Importantly, a high automated optical inspection yield rate of the lines above 96% on both side of the substrate with line width and space of 40/20 μm is achieved by using the RTF copper foil owing to the less copper tumor formed. The CTTP process will be a promising route for fabricating advanced high-density packaging substrates.</p>","PeriodicalId":7275,"journal":{"name":"Advanced Engineering Materials","volume":"28 4","pages":""},"PeriodicalIF":3.3,"publicationDate":"2025-12-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146256580","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Due to the high brazing temperature and catalytic action of catalyst element Ni, the brazed diamond with Ni–Cr filler alloy is prone to severe thermal damage, thereby resulting in premature interface failure between diamond and filler alloy. In this work, the interface bonding behavior and mechanism, as well as joint performance of brazed diamond with Ni–Cr filler doped with Cu, are systematically investigated through multiscale simulations and experiments. The results show that the mixing of Cu effectively adjusts the ductility of brazing layer and refines the carbides on diamond surface, thereby reducing the residual stress and thermal damage of diamond. Additionally, the mixing of Cu also facilitates a sufficient reaction between Cr and C at the interface, thus improving the interface bonding strength between Ni–Cr filler and diamond. Notably, the machining performance of brazed diamond samples with Ni–Cr filler doped with 10 wt% Cu–Sn–P alloy is significantly enhanced at the low brazing temperature of 1010 °C. The results provide a novel insight to clarify the interface action mechanism and realize the low-temperature brazing of diamond through the composition optimization of Ni–Cr filler based on multiscale feature fusion.
{"title":"Interfacial Behavior and Low-Temperature Brazing Performance of Brazed Diamond with Ni–Cr-Based Filler","authors":"Jian Zhang, Junyi Liu, Qi Xu, Xiaotong Pang, Junhao Sun, Ping Peng","doi":"10.1002/adem.202501670","DOIUrl":"https://doi.org/10.1002/adem.202501670","url":null,"abstract":"<p>Due to the high brazing temperature and catalytic action of catalyst element Ni, the brazed diamond with Ni–Cr filler alloy is prone to severe thermal damage, thereby resulting in premature interface failure between diamond and filler alloy. In this work, the interface bonding behavior and mechanism, as well as joint performance of brazed diamond with Ni–Cr filler doped with Cu, are systematically investigated through multiscale simulations and experiments. The results show that the mixing of Cu effectively adjusts the ductility of brazing layer and refines the carbides on diamond surface, thereby reducing the residual stress and thermal damage of diamond. Additionally, the mixing of Cu also facilitates a sufficient reaction between Cr and C at the interface, thus improving the interface bonding strength between Ni–Cr filler and diamond. Notably, the machining performance of brazed diamond samples with Ni–Cr filler doped with 10 wt% Cu–Sn–P alloy is significantly enhanced at the low brazing temperature of 1010 °C. The results provide a novel insight to clarify the interface action mechanism and realize the low-temperature brazing of diamond through the composition optimization of Ni–Cr filler based on multiscale feature fusion.</p>","PeriodicalId":7275,"journal":{"name":"Advanced Engineering Materials","volume":"28 4","pages":""},"PeriodicalIF":3.3,"publicationDate":"2025-12-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"147280098","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The development of magnesium-based metal matrix composites (MMCs) for biomedical implants is often hindered by the high cost and time associated with conventional trial-and-error optimization. In this study, we present an explainable ML framework to accelerate the design and prediction of mechanical performance in magnesium-based alloys reinforced with HAP and a hybrid system of HAP and GNP. An ensemble of regression models was evaluated, with XGBoost demonstrating superior generalization capability, achieving R2 values of 0.955 for yield strength, 0.954 for ultimate tensile strength, and 0.939 for % elongation. To ensure model transparency, SHAP was integrated to interpret feature contributions at both global and local levels. The analysis revealed that ECAP and weight percentage of reinforcement are the most influential factors, with nonlinear optimal ranges identified for weight percentage of reinforcement, particle size, and reinforcement. Guided by these insights, a new AZ91-matrix composite incorporating a hybrid HAP and GNP reinforcement was designed and fabricated via stir casting. Experimental validation demonstrated excellent agreement between model predictions and measured mechanical responses, confirming the high-fidelity framework. Residual analysis confirmed model robustness and homoscedasticity. This work establishes a transparent, data-driven framework that bridges predictive modeling with physical interpretability, enabling the rational design of high-performance, biodegradable implants with reduced reliance on extensive experimentation.
{"title":"Explainable Artificial Intelligence-Integrated Optimization and Experimental Validation of Mechanical Performance in Mg-Based Composites","authors":"Shahrukh Abid, Ching-Chi Hsu, Song-Jeng Huang, Mahnaz Mahmoudi Belvirdi","doi":"10.1002/adem.202502220","DOIUrl":"https://doi.org/10.1002/adem.202502220","url":null,"abstract":"<p>The development of magnesium-based metal matrix composites (MMCs) for biomedical implants is often hindered by the high cost and time associated with conventional trial-and-error optimization. In this study, we present an explainable ML framework to accelerate the design and prediction of mechanical performance in magnesium-based alloys reinforced with HAP and a hybrid system of HAP and GNP. An ensemble of regression models was evaluated, with XGBoost demonstrating superior generalization capability, achieving R<sup>2</sup> values of 0.955 for yield strength, 0.954 for ultimate tensile strength, and 0.939 for % elongation. To ensure model transparency, SHAP was integrated to interpret feature contributions at both global and local levels. The analysis revealed that ECAP and weight percentage of reinforcement are the most influential factors, with nonlinear optimal ranges identified for weight percentage of reinforcement, particle size, and reinforcement. Guided by these insights, a new AZ91-matrix composite incorporating a hybrid HAP and GNP reinforcement was designed and fabricated via stir casting. Experimental validation demonstrated excellent agreement between model predictions and measured mechanical responses, confirming the high-fidelity framework. Residual analysis confirmed model robustness and homoscedasticity. This work establishes a transparent, data-driven framework that bridges predictive modeling with physical interpretability, enabling the rational design of high-performance, biodegradable implants with reduced reliance on extensive experimentation.</p>","PeriodicalId":7275,"journal":{"name":"Advanced Engineering Materials","volume":"28 3","pages":""},"PeriodicalIF":3.3,"publicationDate":"2025-12-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146136259","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This study investigates the deformation behavior, texture characteristics, and dislocation structures of an Mg-0.4 Bi-0.4Sn alloy subjected to 3% compression. The electron backscatter diffraction imaging reveals the formation of {