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Advanced Engineering Materials最新文献
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Low Loss Chip-to-Chip Couplers for High-Density Co-Packaged Optics
IF 3.4
3区 材料科学
Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY
Advanced Engineering Materials
Pub Date : 2025-02-18
DOI: 10.1002/adem.202570012
Drew Weninger, Samuel Serna, Luigi Ranno, Lionel Kimerling, Anuradha Agarwal
Co-Packaged Optics