Pub Date : 2000-09-26DOI: 10.1109/ISSM.2000.993681
A. Chen, P.-S. Guo, P. Lin
The enormous complexity of a semiconductor manufacturing system is the main obstacle for making quality manufacturing control decisions. Conventional methodologies, such as queueing network and simulation analysis, are often too complex to be used effectively. In this paper, we will demonstrate a methodology to build simple statistical models that faithfully characterize the manufacturing system. We then show how these models can help improve the quality of manufacturing control decisions.
{"title":"Statistical analysis and design of semiconductor manufacturing systems","authors":"A. Chen, P.-S. Guo, P. Lin","doi":"10.1109/ISSM.2000.993681","DOIUrl":"https://doi.org/10.1109/ISSM.2000.993681","url":null,"abstract":"The enormous complexity of a semiconductor manufacturing system is the main obstacle for making quality manufacturing control decisions. Conventional methodologies, such as queueing network and simulation analysis, are often too complex to be used effectively. In this paper, we will demonstrate a methodology to build simple statistical models that faithfully characterize the manufacturing system. We then show how these models can help improve the quality of manufacturing control decisions.","PeriodicalId":104122,"journal":{"name":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","volume":"416 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132415226","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-09-26DOI: 10.1109/ISSM.2000.993610
W. Harris
An increasingly expensive element of wafer cost is spares. The Integrated Spares Solutions (ISS) program breaks out of the traditional mold of relying on equipment manufacturers to supply parts, which has proven to be expensive and unreliable in terms of spares availability. The ISS program utilizes a distributor to direct source product at reduced cost and to streamline inventory and order management. This strategy exists in other industries (automotive), but has not found a foothold in the semiconductor industry. The scope of the program is high usage, non-proprietary parts. Suppliers had to be identified developed and managed The suppliers' experience in semiconductor spares is critical. ISS yields many benefits. 1. Integration is facilitated through on-site personnel. 2. The supply base is consolidated reducing supplier management tasks and variability. 3. The inventory investment is reduced. Parts are on-site (consignment) and are stocked in local depots for emergency back up, which improves availability. 4. Prices decline as the suppliers go direct to the part manufacturers. 5. Product is located in the factory near the tool. 6 Order management is consolidated, as are shipments, and the web is utilized. Significant cost savings have been realized and spares availability metrics have improved 10X.
{"title":"Integrated Spares Solutions (ISS) program","authors":"W. Harris","doi":"10.1109/ISSM.2000.993610","DOIUrl":"https://doi.org/10.1109/ISSM.2000.993610","url":null,"abstract":"An increasingly expensive element of wafer cost is spares. The Integrated Spares Solutions (ISS) program breaks out of the traditional mold of relying on equipment manufacturers to supply parts, which has proven to be expensive and unreliable in terms of spares availability. The ISS program utilizes a distributor to direct source product at reduced cost and to streamline inventory and order management. This strategy exists in other industries (automotive), but has not found a foothold in the semiconductor industry. The scope of the program is high usage, non-proprietary parts. Suppliers had to be identified developed and managed The suppliers' experience in semiconductor spares is critical. ISS yields many benefits. 1. Integration is facilitated through on-site personnel. 2. The supply base is consolidated reducing supplier management tasks and variability. 3. The inventory investment is reduced. Parts are on-site (consignment) and are stocked in local depots for emergency back up, which improves availability. 4. Prices decline as the suppliers go direct to the part manufacturers. 5. Product is located in the factory near the tool. 6 Order management is consolidated, as are shipments, and the web is utilized. Significant cost savings have been realized and spares availability metrics have improved 10X.","PeriodicalId":104122,"journal":{"name":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116511976","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-09-26DOI: 10.1109/ISSM.2000.993683
H. Toba, M. Yonekura
We propose a load balancing method which balances all processing operations of products among multiple semiconductor wafer fabrication lines by using predictive scheduling results. From our simulation experiment we confirmed that the proposed method achieves a moderate load balancing feature among multiple fabrication lines each of which can independently fabricate wafers and has different wafer processing capacity. The load balancing feature effectively works to reduce waiting time at each process step and lead time of all products in multiple fabrication lines.
{"title":"Dynamic load balancing among multiple fabrication lines","authors":"H. Toba, M. Yonekura","doi":"10.1109/ISSM.2000.993683","DOIUrl":"https://doi.org/10.1109/ISSM.2000.993683","url":null,"abstract":"We propose a load balancing method which balances all processing operations of products among multiple semiconductor wafer fabrication lines by using predictive scheduling results. From our simulation experiment we confirmed that the proposed method achieves a moderate load balancing feature among multiple fabrication lines each of which can independently fabricate wafers and has different wafer processing capacity. The load balancing feature effectively works to reduce waiting time at each process step and lead time of all products in multiple fabrication lines.","PeriodicalId":104122,"journal":{"name":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","volume":"606 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132118082","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-09-26DOI: 10.1109/ISSM.2000.993651
U. Arazy, Y. De Russo
In the Semiconductor Industry, we often find ourselves with LRP (Long Range Plan) being obsolete the day it is officially published, we need to be able quickly respond to changing requirements, i.e. be agile! We start with a practical definition of agility for fabs and the fab supply chain. Agility is simply defined as "The ability to respond and execute to a business scenario change quickly and at a low cost." We show 25 actions that can be taken within the Fab Supply Chain to achieve agility. These actions are classified according to their Scope of Influence, and are mapped into the Agility Framework Model. The Agility Framework Model ties these notions together, aligned with the above definition, in a crisp 2 /spl times/ 2 matrix model. An organization that can respond to changing requirements quickly and at a low cost is said to be agile. One that responds quickly but at a high cost is reactive. In order to achieve agility in a consistent and systematic way, an organization needs to go through three stages of the Agility Flow: strategic, proactive projects, and agility execution. We propose that agility needs to be an organizational value and may at times be in conflict with 'traditional' fab priorities. We believe that the model and the concepts are generic and applicable to other organizations.
{"title":"A framework model for fab agility and 25 ways to be agile","authors":"U. Arazy, Y. De Russo","doi":"10.1109/ISSM.2000.993651","DOIUrl":"https://doi.org/10.1109/ISSM.2000.993651","url":null,"abstract":"In the Semiconductor Industry, we often find ourselves with LRP (Long Range Plan) being obsolete the day it is officially published, we need to be able quickly respond to changing requirements, i.e. be agile! We start with a practical definition of agility for fabs and the fab supply chain. Agility is simply defined as \"The ability to respond and execute to a business scenario change quickly and at a low cost.\" We show 25 actions that can be taken within the Fab Supply Chain to achieve agility. These actions are classified according to their Scope of Influence, and are mapped into the Agility Framework Model. The Agility Framework Model ties these notions together, aligned with the above definition, in a crisp 2 /spl times/ 2 matrix model. An organization that can respond to changing requirements quickly and at a low cost is said to be agile. One that responds quickly but at a high cost is reactive. In order to achieve agility in a consistent and systematic way, an organization needs to go through three stages of the Agility Flow: strategic, proactive projects, and agility execution. We propose that agility needs to be an organizational value and may at times be in conflict with 'traditional' fab priorities. We believe that the model and the concepts are generic and applicable to other organizations.","PeriodicalId":104122,"journal":{"name":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126875089","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-09-26DOI: 10.1109/ISSM.2000.993619
M. Kishimoto, K. Ozawa
We focus on operator efficiency in the CMP (chemical mechanical polishing) operation, which, as a typical manually operated tool, influences cycle time. The main purpose is to optimize CMP operation by using online/offline unit hour analysis and X-factor theory, and describe the relationship between operator headcount and cycle time. The online/offline unit hour analysis has been designed to optimize operator allocation and headcount in our production line in order to archive the shortest cycle time.
{"title":"Optimized CMP operation by extended X-factor theory including offline unit hour","authors":"M. Kishimoto, K. Ozawa","doi":"10.1109/ISSM.2000.993619","DOIUrl":"https://doi.org/10.1109/ISSM.2000.993619","url":null,"abstract":"We focus on operator efficiency in the CMP (chemical mechanical polishing) operation, which, as a typical manually operated tool, influences cycle time. The main purpose is to optimize CMP operation by using online/offline unit hour analysis and X-factor theory, and describe the relationship between operator headcount and cycle time. The online/offline unit hour analysis has been designed to optimize operator allocation and headcount in our production line in order to archive the shortest cycle time.","PeriodicalId":104122,"journal":{"name":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124699146","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-09-26DOI: 10.1109/ISSM.2000.993621
S. Pampel, J. Domaschke, H. Jetter
The standards of the semiconductor market with its specifications are leading to a basic demand for an increase in productivity. On a department level, this can be achieved through an increase in equipment throughput and/or in an increase in wafer starts at constant and/or less clean-room area used by the process group. Through simulation of Clustertools in various operation modes, possibilities were found to improve the operation of this equipment. In addition, Infineon Dresden was able to examine different hardware configurations in the dry etch sector. In concrete examples, discrete event simulation results of Clustertools showed possibilities for throughput increases and performance improvements of up to 20%, thus supporting the decisions for capacity developments and hardware alterations. The comparison with data from on-tool tests verified the simulation software and its results. Important general findings on the behaviour of Clustertools will be introduced.
{"title":"Productivity improvement for dry etch equipment through the application of simulation","authors":"S. Pampel, J. Domaschke, H. Jetter","doi":"10.1109/ISSM.2000.993621","DOIUrl":"https://doi.org/10.1109/ISSM.2000.993621","url":null,"abstract":"The standards of the semiconductor market with its specifications are leading to a basic demand for an increase in productivity. On a department level, this can be achieved through an increase in equipment throughput and/or in an increase in wafer starts at constant and/or less clean-room area used by the process group. Through simulation of Clustertools in various operation modes, possibilities were found to improve the operation of this equipment. In addition, Infineon Dresden was able to examine different hardware configurations in the dry etch sector. In concrete examples, discrete event simulation results of Clustertools showed possibilities for throughput increases and performance improvements of up to 20%, thus supporting the decisions for capacity developments and hardware alterations. The comparison with data from on-tool tests verified the simulation software and its results. Important general findings on the behaviour of Clustertools will be introduced.","PeriodicalId":104122,"journal":{"name":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129503631","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-09-26DOI: 10.1109/ISSM.2000.993655
M. Locy
A new method of service delivery in the semiconductor industry is required. Current equipment support implementations fail to address the requirements of the industry for both the equipment supplier and the semiconductor manufacturer. This work examines the development, impact, and direction of "e-diagnostics" as a viable, if not necessary, method of support delivery.
{"title":"On line diagnostics and support as a key part of process module control","authors":"M. Locy","doi":"10.1109/ISSM.2000.993655","DOIUrl":"https://doi.org/10.1109/ISSM.2000.993655","url":null,"abstract":"A new method of service delivery in the semiconductor industry is required. Current equipment support implementations fail to address the requirements of the industry for both the equipment supplier and the semiconductor manufacturer. This work examines the development, impact, and direction of \"e-diagnostics\" as a viable, if not necessary, method of support delivery.","PeriodicalId":104122,"journal":{"name":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","volume":"116 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126309333","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-09-26DOI: 10.1109/ISSM.2000.993703
Y. Lo, Yi-kong Tsai
It has been proposed that phase shifting mask (PSM) will be applied as a convenient and effective means of optical enhancement for IC lithography. Practical materials are needed for PSM at different wavelength lithography if these theoretical improvements are to be realized. Our goal is to create an alternating (Levenson) phase shifting mask (altPSM) with single-layer interference fringes structure of birefringent effect, corresponding to the patterns of enhance resolution being transferred into the wafer.
{"title":"Interference method to fabricate phase shifter of alternate phase shifting mask","authors":"Y. Lo, Yi-kong Tsai","doi":"10.1109/ISSM.2000.993703","DOIUrl":"https://doi.org/10.1109/ISSM.2000.993703","url":null,"abstract":"It has been proposed that phase shifting mask (PSM) will be applied as a convenient and effective means of optical enhancement for IC lithography. Practical materials are needed for PSM at different wavelength lithography if these theoretical improvements are to be realized. Our goal is to create an alternating (Levenson) phase shifting mask (altPSM) with single-layer interference fringes structure of birefringent effect, corresponding to the patterns of enhance resolution being transferred into the wafer.","PeriodicalId":104122,"journal":{"name":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","volume":"93 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124252709","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-09-26DOI: 10.1109/ISSM.2000.993689
T. Moriya, N. Ito, F. Uesugi, Y. Hayashi, K. Okamura
An in situ particle-monitoring system-which uses laser light scattering to detect "flaked particles" individually and determines their trajectories-was developed and installed in a tungsten RF plasma etch-back machine. It was found that the flaked particles have a positive charge. We installed a bias electrode inside the etching chamber in order to investigate the effect of a bias voltage on particle behavior. Consequently, it was shown that the particles are captured when the supplied voltage on the bias electrode is less than -100 V. On the other hand, a lot of particles are produced and pushed toward the wafer when the voltage is more than -50 V. It is therefore concluded that the bias electrode can control the behavior of the flaked particles and keep the chamber particle free.
{"title":"Control of behavior of particles flaked off an anode in plasma etch-back equipment by bias electrode","authors":"T. Moriya, N. Ito, F. Uesugi, Y. Hayashi, K. Okamura","doi":"10.1109/ISSM.2000.993689","DOIUrl":"https://doi.org/10.1109/ISSM.2000.993689","url":null,"abstract":"An in situ particle-monitoring system-which uses laser light scattering to detect \"flaked particles\" individually and determines their trajectories-was developed and installed in a tungsten RF plasma etch-back machine. It was found that the flaked particles have a positive charge. We installed a bias electrode inside the etching chamber in order to investigate the effect of a bias voltage on particle behavior. Consequently, it was shown that the particles are captured when the supplied voltage on the bias electrode is less than -100 V. On the other hand, a lot of particles are produced and pushed toward the wafer when the voltage is more than -50 V. It is therefore concluded that the bias electrode can control the behavior of the flaked particles and keep the chamber particle free.","PeriodicalId":104122,"journal":{"name":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130890217","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2000-09-26DOI: 10.1109/ISSM.2000.993635
T. Yoda, M. Shimizu
Reducing PFC emissions from PECVD (plasma enhanced chemical vapor deposition) cleaning is the key to meet the strict targets set by the WSC (World Semiconductor Council) in 1999. The effective method using the chamber impedance monitor is proposed for reducing PFC emissions for existing production lines.
{"title":"The most effective method for reducing PFC emissions caused by PECVD cleaning using the chamber impedance monitor","authors":"T. Yoda, M. Shimizu","doi":"10.1109/ISSM.2000.993635","DOIUrl":"https://doi.org/10.1109/ISSM.2000.993635","url":null,"abstract":"Reducing PFC emissions from PECVD (plasma enhanced chemical vapor deposition) cleaning is the key to meet the strict targets set by the WSC (World Semiconductor Council) in 1999. The effective method using the chamber impedance monitor is proposed for reducing PFC emissions for existing production lines.","PeriodicalId":104122,"journal":{"name":"Proceedings of ISSM2000. Ninth International Symposium on Semiconductor Manufacturing (IEEE Cat. No.00CH37130)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130899652","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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