{"title":"Get Published in the New IEEE Transactions on Privacy","authors":"","doi":"10.1109/mm.2024.3375127","DOIUrl":"https://doi.org/10.1109/mm.2024.3375127","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"36 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-04-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140585435","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This issue introduces a selection of outstanding papers originally presented at Hot Interconnects (HotI-30) in 2023 and features an article from Meta Reality Labs exploring the use of compute-in-memory for AR/VR applications.
本期介绍了最初在 2023 年 Hot Interconnects（HotI-30）上发表的部分优秀论文，并刊登了一篇来自 Meta Reality Labs 的文章，探讨如何将内存计算用于 AR/VR 应用。
{"title":"Beyond Wires: The Future of Interconnects","authors":"Hsien-Hsin S. Lee","doi":"10.1109/mm.2024.3373336","DOIUrl":"https://doi.org/10.1109/mm.2024.3373336","url":null,"abstract":"This issue introduces a selection of outstanding papers originally presented at Hot Interconnects (HotI-30) in 2023 and features an article from Meta Reality Labs exploring the use of compute-in-memory for AR/VR applications.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"17 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-04-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140585625","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This article is the next article in the series on the patenting behavior and characteristics of computer architecture companies. This article continues to analyze the characteristics for patent families.
本文是计算机体系结构公司专利行为和特点系列的下一篇文章。本文将继续分析专利族的特点。
{"title":"Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies—Part IX: Patent Families","authors":"Joshua J. Yi","doi":"10.1109/mm.2024.3373342","DOIUrl":"https://doi.org/10.1109/mm.2024.3373342","url":null,"abstract":"This article is the next article in the series on the patenting behavior and characteristics of computer architecture companies. This article continues to analyze the characteristics for patent families.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"42 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140585620","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Management of TinyML Enabled Internet of Things Devices","authors":"Tomasz Szydlo, Marcin Nagy","doi":"10.1109/mm.2024.3382488","DOIUrl":"https://doi.org/10.1109/mm.2024.3382488","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"50 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-03-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140585887","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Amir Gholami, Zhewei Yao, Sehoon Kim, Coleman Hooper, Michael W. Mahoney, Kurt Keutzer
{"title":"AI and Memory Wall","authors":"Amir Gholami, Zhewei Yao, Sehoon Kim, Coleman Hooper, Michael W. Mahoney, Kurt Keutzer","doi":"10.1109/mm.2024.3373763","DOIUrl":"https://doi.org/10.1109/mm.2024.3373763","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"70 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-03-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140301704","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Byeongho Kim, Sanghoon Cha, Sangsoo Park, Jieun Lee, Sukhan Lee, Shin-haeng Kang, Jinin So, Kyungsoo Kim, Jin Jung, Jong-Geon Lee, Hyeonsu Kim, Jin-Seong Kim, Yuhwan Ro, YeonGon Cho, Jin Hyun Kim, JoonHo Song, Jaehoon Yu, Seungwon Lee, Jeonghyeon Cho, Kyomin Sohn
{"title":"The Breakthrough Memory Solutions for Improved Performance on LLM Inference","authors":"Byeongho Kim, Sanghoon Cha, Sangsoo Park, Jieun Lee, Sukhan Lee, Shin-haeng Kang, Jinin So, Kyungsoo Kim, Jin Jung, Jong-Geon Lee, Hyeonsu Kim, Jin-Seong Kim, Yuhwan Ro, YeonGon Cho, Jin Hyun Kim, JoonHo Song, Jaehoon Yu, Seungwon Lee, Jeonghyeon Cho, Kyomin Sohn","doi":"10.1109/mm.2024.3375352","DOIUrl":"https://doi.org/10.1109/mm.2024.3375352","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"39 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-03-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140301703","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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