{"title":"AMD Next Generation \"Zen 4\" Core and 4th Gen AMD EPYC™ Server CPUs","authors":"Ravi Bhargava, Kai Troester","doi":"10.1109/mm.2024.3375070","DOIUrl":"https://doi.org/10.1109/mm.2024.3375070","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"43 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140116481","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Quantifying CO2 Emission Reduction through Spatial Partitioning in Deep Learning Recommendation System Workloads","authors":"Andrei Bersatti, Euna Kim, Hyesoon Kim","doi":"10.1109/mm.2024.3373443","DOIUrl":"https://doi.org/10.1109/mm.2024.3373443","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"39 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-03-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140045867","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
In this issue, IEEE MICRO welcomes the newly inaugurated Editor-in-Chief Dr. Hsien-Hsin Sean Lee and introduces the Special Issue on COOL chips for the state-of-the-art in low-power design for computing.
{"title":"Computing With COOL Chips","authors":"Hsien-Hsin S. Lee","doi":"10.1109/mm.2024.3354368","DOIUrl":"https://doi.org/10.1109/mm.2024.3354368","url":null,"abstract":"In this issue, IEEE MICRO welcomes the newly inaugurated Editor-in-Chief Dr. Hsien-Hsin Sean Lee and introduces the Special Issue on COOL chips for the state-of-the-art in low-power design for computing.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"158 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139754486","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"IEEE Annals of the History of Computing","authors":"","doi":"10.1109/mm.2023.3340847","DOIUrl":"https://doi.org/10.1109/mm.2023.3340847","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"71 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139954813","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This article is the next article in the series on the patenting behavior and characteristics of computer architecture companies. This article analyzes the characteristics for patent families.
本文是计算机体系结构公司专利行为和特点系列的下一篇文章。本文分析了专利族的特征。
{"title":"Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies—Part VIII: Patent Families","authors":"Joshua J. Yi","doi":"10.1109/mm.2024.3353948","DOIUrl":"https://doi.org/10.1109/mm.2024.3353948","url":null,"abstract":"This article is the next article in the series on the patenting behavior and characteristics of computer architecture companies. This article analyzes the characteristics for patent families.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"40 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139754265","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This introduction to the special issue on low-power, high speed chips (COOL chips) discusses state-of-the-art COOL chips and the challenges facing researchers. It introduces four articles exploring different solutions for reducing power consumption and enhancing chip performance.
{"title":"Special Issue on COOL Chips","authors":"Ryusuke Egawa, Yasutaka Wada","doi":"10.1109/mm.2024.3353949","DOIUrl":"https://doi.org/10.1109/mm.2024.3353949","url":null,"abstract":"This introduction to the special issue on low-power, high speed chips (COOL chips) discusses state-of-the-art COOL chips and the challenges facing researchers. It introduces four articles exploring different solutions for reducing power consumption and enhancing chip performance.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"12 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-02-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139903800","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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