Pub Date : 2026-02-03DOI: 10.1109/TTHZ.2026.3655604
{"title":"IEEE Transactions on Terahertz Science and Technology Information for Authors","authors":"","doi":"10.1109/TTHZ.2026.3655604","DOIUrl":"https://doi.org/10.1109/TTHZ.2026.3655604","url":null,"abstract":"","PeriodicalId":13258,"journal":{"name":"IEEE Transactions on Terahertz Science and Technology","volume":"16 2","pages":"210-211"},"PeriodicalIF":3.9,"publicationDate":"2026-02-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11371492","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146102953","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-12-19DOI: 10.1109/TTHZ.2025.3642663
{"title":"IEEE Microwave Theory and Techniques Society Information","authors":"","doi":"10.1109/TTHZ.2025.3642663","DOIUrl":"https://doi.org/10.1109/TTHZ.2025.3642663","url":null,"abstract":"","PeriodicalId":13258,"journal":{"name":"IEEE Transactions on Terahertz Science and Technology","volume":"16 1","pages":"C2-C2"},"PeriodicalIF":3.9,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306282","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778353","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-12-19DOI: 10.1109/TTHZ.2025.3642685
{"title":"IEEE Transactions on Terahertz Science and Technology Publication Information","authors":"","doi":"10.1109/TTHZ.2025.3642685","DOIUrl":"https://doi.org/10.1109/TTHZ.2025.3642685","url":null,"abstract":"","PeriodicalId":13258,"journal":{"name":"IEEE Transactions on Terahertz Science and Technology","volume":"16 1","pages":"C3-C3"},"PeriodicalIF":3.9,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306281","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778115","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-12-19DOI: 10.1109/TTHZ.2025.3642687
{"title":"IEEE Transactions on Terahertz Science and Technology Information for Authors","authors":"","doi":"10.1109/TTHZ.2025.3642687","DOIUrl":"https://doi.org/10.1109/TTHZ.2025.3642687","url":null,"abstract":"","PeriodicalId":13258,"journal":{"name":"IEEE Transactions on Terahertz Science and Technology","volume":"16 1","pages":"83-84"},"PeriodicalIF":3.9,"publicationDate":"2025-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11306283","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145778386","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Security screening is a crucial method for preventing violent terrorist attacks and potential contraband threats at transportation hubs. Terahertz (THz) imaging technology, as an emerging detection technique, offers a new solution for public security screening due to its nondestructive penetration, low photon energy, and molecular fingerprinting capabilities. In this article, knives of different shapes made of metal, ceramic, and plastic are used as concealed objects, and materials such as multilayer cardboard, polyethylene bubble wrap, foam boxes, and textiles served as covering layers. A dataset of THz images containing concealed objects with mixed occlusion layers is constructed. After analyzing the THz dataset, we propose a you only look once (YOLO) detection model based on boundary information enhancement (BIE-YOLO). This model introduces omni-dimensional dynamic convolution into the backbone network to enhance the feature extraction capability. A BIE module is added to capture detailed boundary information from the shallow layers of the backbone network, mitigating missed or false detections caused by blurred boundaries in THz images. Moreover, to improve detection accuracy for objects with similar contours, a BiFormer is used in the network neck to model global information and capture long-range dependencies. Experimental results demonstrate that the BIE-YOLO model achieves F1 score, mAP50:95, and mAP50 of 79.2%, 79.9%, and 93.8%, respectively, representing improvements of 3.0%, 2.2%, and 1.5% compared to the baseline model YOLOv8. This model effectively detects concealed objects under multilayer occlusions, providing new insights and directions for applying THz technology in security screening.
在交通枢纽，安全检查是防止暴力恐怖袭击和潜在违禁品威胁的关键方法。太赫兹（THz）成像技术作为一种新兴的探测技术，以其无损穿透、低光子能量和分子指纹识别能力为公安安检提供了新的解决方案。在这篇文章中，不同形状的刀具被用作隐藏的物体，由金属、陶瓷和塑料制成，并以多层纸板、聚乙烯气泡膜、泡沫盒和纺织品等材料作为覆盖层。构建了包含混合遮挡层的隐藏目标的太赫兹图像数据集。在分析太赫兹数据集的基础上，提出了一种基于边界信息增强的you only look once （YOLO）检测模型（BIE-YOLO）。该模型在骨干网中引入全维动态卷积，增强了特征提取能力。添加了BIE模块，从骨干网络的浅层捕获详细的边界信息，减轻太赫兹图像中边界模糊引起的遗漏或错误检测。此外，为了提高具有相似轮廓的目标的检测精度，在网络颈部使用了BiFormer来建模全局信息并捕获远程依赖关系。实验结果表明，BIE-YOLO模型的F1分数、mAP50:95和mAP50分别达到79.2%、79.9%和93.8%，比基线模型YOLOv8分别提高了3.0%、2.2%和1.5%。该模型有效地检测了多层遮挡下的隐藏目标，为太赫兹技术在安检中的应用提供了新的见解和方向。
{"title":"Detection of Concealed Objects in Blurred Terahertz Images Based on Boundary Information Enhancement","authors":"Yuying Jiang;Qingcheng Sun;Hao Chen;Hongyi Ge;Yuan Zhang;Xixi Wen;Mengdie Jiang;Yang Zhao","doi":"10.1109/TTHZ.2025.3633052","DOIUrl":"https://doi.org/10.1109/TTHZ.2025.3633052","url":null,"abstract":"Security screening is a crucial method for preventing violent terrorist attacks and potential contraband threats at transportation hubs. Terahertz (THz) imaging technology, as an emerging detection technique, offers a new solution for public security screening due to its nondestructive penetration, low photon energy, and molecular fingerprinting capabilities. In this article, knives of different shapes made of metal, ceramic, and plastic are used as concealed objects, and materials such as multilayer cardboard, polyethylene bubble wrap, foam boxes, and textiles served as covering layers. A dataset of THz images containing concealed objects with mixed occlusion layers is constructed. After analyzing the THz dataset, we propose a you only look once (YOLO) detection model based on boundary information enhancement (BIE-YOLO). This model introduces omni-dimensional dynamic convolution into the backbone network to enhance the feature extraction capability. A BIE module is added to capture detailed boundary information from the shallow layers of the backbone network, mitigating missed or false detections caused by blurred boundaries in THz images. Moreover, to improve detection accuracy for objects with similar contours, a BiFormer is used in the network neck to model global information and capture long-range dependencies. Experimental results demonstrate that the BIE-YOLO model achieves <italic>F</i>1 score, mAP50:95, and mAP50 of 79.2%, 79.9%, and 93.8%, respectively, representing improvements of 3.0%, 2.2%, and 1.5% compared to the baseline model YOLOv8. This model effectively detects concealed objects under multilayer occlusions, providing new insights and directions for applying THz technology in security screening.","PeriodicalId":13258,"journal":{"name":"IEEE Transactions on Terahertz Science and Technology","volume":"16 3","pages":"234-246"},"PeriodicalIF":3.9,"publicationDate":"2025-11-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146216625","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
To address the structural resonances and impedance mismatch commonly observed in waveguide-to-chip transitions, a radial probe-based structure optimized for wideband and low-loss performance in high-frequency systems is proposed. Impedance matching was improved by incorporating a reflective back wall (RBW), which effectively controlled the resonant behavior of a waveguide-to-microstrip transition. In addition, the dimensions of the enclosure of the radial probe were optimized to improve return loss. A waveguide taper was introduced to compensate for dimensional mismatch with a standard rectangular waveguide, thereby ensuring accurate impedance matching. An equivalent circuit model was developed to provide insight into the electromagnetic behavior of the proposed transition. The prototype was fabricated and mounted on a CNC-machined aluminum split block. The experimental results revealed a bandwidth of 265–325 GHz, with a minimum insertion loss of 0.6 dB and a return loss of more than 15 dB. This confirmed the proposed single-ended waveguide-to-microstrip transition, which incorporated the RBW and the optimized enclosure dimensions to achieve wide bandwidth, low insertion loss, and high return loss. The proposed transition offers a practical solution for wideband, low-loss interconnections in high-frequency systems and can be extended to other waveguide-to-chip configurations.
{"title":"Radial Probe for Waveguide-to-Microstrip Transition at 265–325 GHz With a Reflective Back Wall","authors":"Sooyeon Kim;Seung Hwan Kim;Dong Woo Park;Sang-Rok Moon;Eui-Su Lee;Minkyu Sung;Wonkyong Lee;Seung-Hyun Cho","doi":"10.1109/TTHZ.2025.3627687","DOIUrl":"https://doi.org/10.1109/TTHZ.2025.3627687","url":null,"abstract":"To address the structural resonances and impedance mismatch commonly observed in waveguide-to-chip transitions, a radial probe-based structure optimized for wideband and low-loss performance in high-frequency systems is proposed. Impedance matching was improved by incorporating a reflective back wall (RBW), which effectively controlled the resonant behavior of a waveguide-to-microstrip transition. In addition, the dimensions of the enclosure of the radial probe were optimized to improve return loss. A waveguide taper was introduced to compensate for dimensional mismatch with a standard rectangular waveguide, thereby ensuring accurate impedance matching. An equivalent circuit model was developed to provide insight into the electromagnetic behavior of the proposed transition. The prototype was fabricated and mounted on a CNC-machined aluminum split block. The experimental results revealed a bandwidth of 265–325 GHz, with a minimum insertion loss of 0.6 dB and a return loss of more than 15 dB. This confirmed the proposed single-ended waveguide-to-microstrip transition, which incorporated the RBW and the optimized enclosure dimensions to achieve wide bandwidth, low insertion loss, and high return loss. The proposed transition offers a practical solution for wideband, low-loss interconnections in high-frequency systems and can be extended to other waveguide-to-chip configurations.","PeriodicalId":13258,"journal":{"name":"IEEE Transactions on Terahertz Science and Technology","volume":"16 3","pages":"331-341"},"PeriodicalIF":3.9,"publicationDate":"2025-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"146216637","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-06DOI: 10.1109/TTHZ.2025.3629764
{"title":"2025 Index IEEE Transactions on Terahertz Science and Technology","authors":"","doi":"10.1109/TTHZ.2025.3629764","DOIUrl":"https://doi.org/10.1109/TTHZ.2025.3629764","url":null,"abstract":"","PeriodicalId":13258,"journal":{"name":"IEEE Transactions on Terahertz Science and Technology","volume":"15 6","pages":"1105-1136"},"PeriodicalIF":3.9,"publicationDate":"2025-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11230478","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145456051","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-04DOI: 10.1109/TTHZ.2025.3623826
{"title":"IEEE Transactions on Terahertz Science and Technology Information for Authors","authors":"","doi":"10.1109/TTHZ.2025.3623826","DOIUrl":"https://doi.org/10.1109/TTHZ.2025.3623826","url":null,"abstract":"","PeriodicalId":13258,"journal":{"name":"IEEE Transactions on Terahertz Science and Technology","volume":"15 6","pages":"1102-1103"},"PeriodicalIF":3.9,"publicationDate":"2025-11-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11225880","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145435680","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-04DOI: 10.1109/TTHZ.2025.3623828
{"title":"IEEE Women in Engineering","authors":"","doi":"10.1109/TTHZ.2025.3623828","DOIUrl":"https://doi.org/10.1109/TTHZ.2025.3623828","url":null,"abstract":"","PeriodicalId":13258,"journal":{"name":"IEEE Transactions on Terahertz Science and Technology","volume":"15 6","pages":"1104-1104"},"PeriodicalIF":3.9,"publicationDate":"2025-11-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11225875","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145435678","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-04DOI: 10.1109/TTHZ.2025.3623811
{"title":"IEEE Transactions on Terahertz Science and Technology Publication Information","authors":"","doi":"10.1109/TTHZ.2025.3623811","DOIUrl":"https://doi.org/10.1109/TTHZ.2025.3623811","url":null,"abstract":"","PeriodicalId":13258,"journal":{"name":"IEEE Transactions on Terahertz Science and Technology","volume":"15 6","pages":"C3-C3"},"PeriodicalIF":3.9,"publicationDate":"2025-11-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11225878","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145435671","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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