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2008 IEEE Hot Chips 20 Symposium (HCS)最新文献

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A 300-mW single-chip NTSC/ PAL television for mobile applications 用于移动应用的300兆瓦单芯片NTSC/ PAL电视
Pub Date : 2008-08-01 DOI: 10.1109/HOTCHIPS.2008.7476538
S. Sheng, A. Abo, P. Chi, R. Contreras, R. Gupta, H. Huang, L. Lynn, E. Macdonald, K. Nam, R. Narayanaswami, S. Stoiber, E. Su, D. Yee
Presents a collection of slides covering the following: single-chip NTSC/PAL television; mobile applications; analog television; terrestrial TV; analog TV signaling; TV architecture; direct conversion TV-on-a-chip; NTSC/ PAL receiver; low-noise amplifier; mixer; LO harmonics; harmonic rejection filtering; harmonic rejection mixing; LO generation; VSB Nyquist filtering; and digital TV.
展示了一系列幻灯片,包括以下内容:单芯片NTSC/PAL电视;移动应用程序;模拟电视;地面电视;模拟电视信号;电视架构;直接转换片上电视;NTSC/ PAL接收机;低噪声放大器;混合器;LO谐波;谐波抑制滤波;谐波抑制混频;看哪一代;VSB奈奎斯特滤波;和数字电视。
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引用次数: 2
The roofline model: A pedagogical tool for program analysis and optimization 屋顶线模型:用于项目分析和优化的教学工具
Pub Date : 2008-08-01 DOI: 10.1109/HOTCHIPS.2008.7476531
Samuel Williams, David A. Patterson, L. Oliker, J. Shalf, Kathy Yelick
This article consists of a collection of slides from the authors' conference presentation. The Roofline model is a visually intuitive figure for kernel analysis and optimization. The authors believe undergraduates will find it useful in assessing performance and scalability limitations. It is easily extended to other architectural paradigms. It is easily extendable to other metrics: performance (sort, graphics, crypto...) bandwidth (L2, PCIe, ...). A performance counters could be used to generate a runtime-specific roofline that would greatly aide the optimization.
本文由作者在会议上演讲的幻灯片集合组成。rooline模型是用于核分析和优化的直观图形。作者相信本科生会发现它在评估性能和可伸缩性限制方面很有用。它很容易扩展到其他架构范例。它很容易扩展到其他指标:性能(排序、图形、加密…)带宽(L2、PCIe…)。可以使用性能计数器来生成特定于运行时的顶线,这将极大地帮助优化。
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引用次数: 26
Scalable parallel programming with CUDA introduction 引入CUDA的可扩展并行编程
Pub Date : 2008-08-01 DOI: 10.1109/HOTCHIPS.2008.7476518
J. Nickolls
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引用次数: 18
Tukwila - a quad-core Intel® Itanium® processor Tukwila -四核Intel®Itanium®处理器
Pub Date : 2008-08-01 DOI: 10.1109/HOTCHIPS.2008.7476561
E. Delano
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引用次数: 3
Rock: A SPARC CMT processor Rock: SPARC CMT处理器
Pub Date : 2008-08-01 DOI: 10.1109/HOTCHIPS.2008.7476563
Shailender Chaudhry
This article consists of a collection of slides from the author's conference presentation. Some of the specific areas/topics discussed include: Use of CMT Resources for Single-Thread Performance; and HW Transactional Memory.
本文由作者在会议上的演讲幻灯片组成。讨论的一些具体领域/主题包括:使用CMT资源提高单线程性能;和HW事务性内存。
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引用次数: 4
AMD 780G AMD 780克
Pub Date : 2008-08-01 DOI: 10.1109/hotchips.2008.7476553
N. Burbank
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引用次数: 0
CUDA toolkit and libraries CUDA工具包和库
Pub Date : 2008-08-01 DOI: 10.1109/HOTCHIPS.2008.7476520
M. Fatica
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引用次数: 6
Making cars drive themselves 让汽车自动驾驶
Pub Date : 2008-08-01 DOI: 10.1109/HOTCHIPS.2008.7476533
S. Thrun
Presents a collection of slides covering the following topics: unmanned ground vehicles; drive-by-wire system; and steering control.
展示了一系列涵盖以下主题的幻灯片:无人驾驶地面车辆;线控系统;以及转向控制。
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引用次数: 1
Tera-scale computing and interconnect challenges - 3D stacking considerations 太级计算和互连挑战- 3D堆叠考虑
Pub Date : 2008-08-01 DOI: 10.1109/HOTCHIPS.2008.7476514
J. Bautista
This article consists of a collection of slides from the author's conference presentation. Discusses tera-scale computing and interconnect challenges. Suggests that 3D stacking is an attractive solution for both a large last level cache and increasing bulk DRAM capacities.
本文由作者在会议上的演讲幻灯片组成。讨论了太规模计算和互连的挑战。表明3D堆叠是一个有吸引力的解决方案,无论是大的最后一级缓存和增加批量DRAM容量。
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引用次数: 4
NVIDIA Tegra NVIDIA Tegra
Pub Date : 2008-08-01 DOI: 10.1109/hotchips.2008.7476540
Michael Toksvig, Parthasarathy Sriram, John Matheson, Brian Cabral, Brian Smith
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引用次数: 4
期刊
2008 IEEE Hot Chips 20 Symposium (HCS)
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