Pub Date : 2008-10-17DOI: 10.1109/AVFOP.2008.4653147
Ronald Pirich, P. Anumolu
Microwave photonic links and RF photonics will appear frequently in military antenna systems. As photonic link performance continues to improve, RF Photonics insertion into antenna systems will expand in areas including RF pre-processing and filtering, RF front-end technology, A/D conversion, photonic switched true time delay (TTD) beam forming networks for intelligence, surveillance and reconnaissance as well as electronic warfare manned and unmanned applications.
{"title":"Next-generation fiber-optic technology enablers for manned & unmanned ISR platforms","authors":"Ronald Pirich, P. Anumolu","doi":"10.1109/AVFOP.2008.4653147","DOIUrl":"https://doi.org/10.1109/AVFOP.2008.4653147","url":null,"abstract":"Microwave photonic links and RF photonics will appear frequently in military antenna systems. As photonic link performance continues to improve, RF Photonics insertion into antenna systems will expand in areas including RF pre-processing and filtering, RF front-end technology, A/D conversion, photonic switched true time delay (TTD) beam forming networks for intelligence, surveillance and reconnaissance as well as electronic warfare manned and unmanned applications.","PeriodicalId":142148,"journal":{"name":"2008 IEEE Avionics, Fiber-Optics and Photonics Technology Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125808504","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2008-10-17DOI: 10.1109/AVFOP.2008.4653176
E. Chan, D. Koshinz, W. Krug, H. Hager
We presented a low cost experimental WLED transceiver which is capable to perform wireless communication at 10 Mb/s in an airplane or a space craft physical environment. From the experimental results, we derived the operational requirements of the WLED transceiver with OOK NRZ modulation. These results demonstrate the WLED wireless communication link technology is viable for size, weight, power and cost reduction in future generation of airplanes and space vehicles.
{"title":"Low cost, high data rate white LED (WLED) transceiver demonstration","authors":"E. Chan, D. Koshinz, W. Krug, H. Hager","doi":"10.1109/AVFOP.2008.4653176","DOIUrl":"https://doi.org/10.1109/AVFOP.2008.4653176","url":null,"abstract":"We presented a low cost experimental WLED transceiver which is capable to perform wireless communication at 10 Mb/s in an airplane or a space craft physical environment. From the experimental results, we derived the operational requirements of the WLED transceiver with OOK NRZ modulation. These results demonstrate the WLED wireless communication link technology is viable for size, weight, power and cost reduction in future generation of airplanes and space vehicles.","PeriodicalId":142148,"journal":{"name":"2008 IEEE Avionics, Fiber-Optics and Photonics Technology Conference","volume":"275 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121993499","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2008-10-17DOI: 10.1109/AVFOP.2008.4653180
Jing Ma, K. Leong, L. Park, Yingyan Huang, S. Ho
A tunable distributed feedback (DFB) laser packaging platform has been developed for military avionic application. The packaged tunable DFB laser transmitter has successfully undergone 500 temperature cycles of initial testing based on MIL-STD-883 Method 1010. It has a wide operating temperature range of -55 degC to 95 degC with a single mode fiber coupled output power of >1 mW. The transmitter can be directly modulated at 2.5 Gb/s and has 4-channel tunability at 100 GHz channel spacing.
{"title":"Integrated ruggedized fiber optic transmitter for avionic WDM network applications","authors":"Jing Ma, K. Leong, L. Park, Yingyan Huang, S. Ho","doi":"10.1109/AVFOP.2008.4653180","DOIUrl":"https://doi.org/10.1109/AVFOP.2008.4653180","url":null,"abstract":"A tunable distributed feedback (DFB) laser packaging platform has been developed for military avionic application. The packaged tunable DFB laser transmitter has successfully undergone 500 temperature cycles of initial testing based on MIL-STD-883 Method 1010. It has a wide operating temperature range of -55 degC to 95 degC with a single mode fiber coupled output power of >1 mW. The transmitter can be directly modulated at 2.5 Gb/s and has 4-channel tunability at 100 GHz channel spacing.","PeriodicalId":142148,"journal":{"name":"2008 IEEE Avionics, Fiber-Optics and Photonics Technology Conference","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124351424","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2008-10-17DOI: 10.1109/AVFOP.2008.4653187
P. Kolesar
To address the need for better agreement between test sets and to provide a conservative measurement, standards formulating committees in both TIA and IEC have been developing new launch conditions for the purpose of measuring the loss of installed 50-mum and 62.5-mum multimode cabling. After more than two years of development, this work is leading to revisions of multiple existing standards that may serve both enterprise and avionics environments.
{"title":"Standardization of measurment launch condition for multimode fiber cabling","authors":"P. Kolesar","doi":"10.1109/AVFOP.2008.4653187","DOIUrl":"https://doi.org/10.1109/AVFOP.2008.4653187","url":null,"abstract":"To address the need for better agreement between test sets and to provide a conservative measurement, standards formulating committees in both TIA and IEC have been developing new launch conditions for the purpose of measuring the loss of installed 50-mum and 62.5-mum multimode cabling. After more than two years of development, this work is leading to revisions of multiple existing standards that may serve both enterprise and avionics environments.","PeriodicalId":142148,"journal":{"name":"2008 IEEE Avionics, Fiber-Optics and Photonics Technology Conference","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121910674","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2008-10-17DOI: 10.1109/AVFOP.2008.4653165
M. Mozafari, Z. Sanjabi, N. Granpayeh
We have designed and fabricated a piezo-optical voltage sensor based on Fabry-Perot interferometer, which can measure AC voltages from 1 to 400 V rms with linear response. It can be used in Optical Voltage Transducers.
{"title":"Design and fabrication of piezo-optical Fabry-Perot voltage sensor","authors":"M. Mozafari, Z. Sanjabi, N. Granpayeh","doi":"10.1109/AVFOP.2008.4653165","DOIUrl":"https://doi.org/10.1109/AVFOP.2008.4653165","url":null,"abstract":"We have designed and fabricated a piezo-optical voltage sensor based on Fabry-Perot interferometer, which can measure AC voltages from 1 to 400 V rms with linear response. It can be used in Optical Voltage Transducers.","PeriodicalId":142148,"journal":{"name":"2008 IEEE Avionics, Fiber-Optics and Photonics Technology Conference","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127548625","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2008-10-17DOI: 10.1109/AVFOP.2008.4653157
M. Evrard, A. Meade
The author discuss the the technology, performance and applications of hermetic fiber optic connectors. The main challenges of providing hermetic fiber optic connectors are: (1) manufacture a hermetic fiber optic contact : hermetically seal the fiber into the ferrule without damaging it and (2) hermetically assemble the fiber optic contacts into an insert and the connector shell.
{"title":"Hermetic fiber optic connectors and feedthrus","authors":"M. Evrard, A. Meade","doi":"10.1109/AVFOP.2008.4653157","DOIUrl":"https://doi.org/10.1109/AVFOP.2008.4653157","url":null,"abstract":"The author discuss the the technology, performance and applications of hermetic fiber optic connectors. The main challenges of providing hermetic fiber optic connectors are: (1) manufacture a hermetic fiber optic contact : hermetically seal the fiber into the ferrule without damaging it and (2) hermetically assemble the fiber optic contacts into an insert and the connector shell.","PeriodicalId":142148,"journal":{"name":"2008 IEEE Avionics, Fiber-Optics and Photonics Technology Conference","volume":"475 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125837829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2008-10-17DOI: 10.1109/AVFOP.2008.4653168
D. Liang, A. Fang, Hui-wen Chen, J. Bowers
Compound semiconductors-silicon integration has never been of such great demand until the recent difficulty to maintain Moore's law in the microelectronics industry. Recently, we have developed a hybrid silicon evanescent platform (HSEP), which enables the coherent marriage of incompatible characteristics of III-V and silicon, i.e., direct bandgap and high mobility at III-V side and mature CMOS manufacturability and low-optical loss at silicon side. A series of critical components including lasers, amplifiers, photodetectors, and modulators have been successfully implemented in this platform.
{"title":"Wafer bonded silicon photonics","authors":"D. Liang, A. Fang, Hui-wen Chen, J. Bowers","doi":"10.1109/AVFOP.2008.4653168","DOIUrl":"https://doi.org/10.1109/AVFOP.2008.4653168","url":null,"abstract":"Compound semiconductors-silicon integration has never been of such great demand until the recent difficulty to maintain Moore's law in the microelectronics industry. Recently, we have developed a hybrid silicon evanescent platform (HSEP), which enables the coherent marriage of incompatible characteristics of III-V and silicon, i.e., direct bandgap and high mobility at III-V side and mature CMOS manufacturability and low-optical loss at silicon side. A series of critical components including lasers, amplifiers, photodetectors, and modulators have been successfully implemented in this platform.","PeriodicalId":142148,"journal":{"name":"2008 IEEE Avionics, Fiber-Optics and Photonics Technology Conference","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132962029","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2008-10-17DOI: 10.1109/AVFOP.2008.4653149
M. Bakir, C. King, D. Sekar, B. Dang
Three-dimensional (3D) system integration is widely accepted as a key enabler for future systems. Although there are a number of approaches to 3D integration, none have addressed the need for cooling in a 3D stack of high-performance chips (microprocessors). This is a significant omission and imposes a constraint on the ability to fully utilize the benefits of 3D technology. Thus, new 3D integration technologies are needed for high-performance applications as well as those that require the integration of photonics within the 3D stack.
{"title":"Electrical, optical, and fluidic interconnect networks for 3D heterogeneous integrated systems","authors":"M. Bakir, C. King, D. Sekar, B. Dang","doi":"10.1109/AVFOP.2008.4653149","DOIUrl":"https://doi.org/10.1109/AVFOP.2008.4653149","url":null,"abstract":"Three-dimensional (3D) system integration is widely accepted as a key enabler for future systems. Although there are a number of approaches to 3D integration, none have addressed the need for cooling in a 3D stack of high-performance chips (microprocessors). This is a significant omission and imposes a constraint on the ability to fully utilize the benefits of 3D technology. Thus, new 3D integration technologies are needed for high-performance applications as well as those that require the integration of photonics within the 3D stack.","PeriodicalId":142148,"journal":{"name":"2008 IEEE Avionics, Fiber-Optics and Photonics Technology Conference","volume":"55 4","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120973515","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2008-10-17DOI: 10.1109/AVFOP.2008.4653170
D. Nicholls, A. Avak, J. Mazurowski
The focus of the project being summarized herein is to develop a method for predicting the reliability of photonic components and assemblies that is compatible with MIL-HDBK-217, so that system level designers can efficiently estimate the reliability of systems using fiber optics and photonics. Photonic part types being addressed in this study are: WDMs (Thin film and Fiber based), Couplers (fiber), Taps, Bandsplitters, Isolators, Optical Fiber, Laser pump modules, Photodiodes, Transmitters, Receivers, Transceivers, Filters, Variable Optical Attenuators (VOAs), Fiber connectors, Cable assemblies, and Splices.
{"title":"Photonic component and subsystem reliability modeling","authors":"D. Nicholls, A. Avak, J. Mazurowski","doi":"10.1109/AVFOP.2008.4653170","DOIUrl":"https://doi.org/10.1109/AVFOP.2008.4653170","url":null,"abstract":"The focus of the project being summarized herein is to develop a method for predicting the reliability of photonic components and assemblies that is compatible with MIL-HDBK-217, so that system level designers can efficiently estimate the reliability of systems using fiber optics and photonics. Photonic part types being addressed in this study are: WDMs (Thin film and Fiber based), Couplers (fiber), Taps, Bandsplitters, Isolators, Optical Fiber, Laser pump modules, Photodiodes, Transmitters, Receivers, Transceivers, Filters, Variable Optical Attenuators (VOAs), Fiber connectors, Cable assemblies, and Splices.","PeriodicalId":142148,"journal":{"name":"2008 IEEE Avionics, Fiber-Optics and Photonics Technology Conference","volume":"17 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122977390","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2008-10-17DOI: 10.1109/AVFOP.2008.4653179
P. Guilfoyle, K. M. Patel, M. Harris, U. Retnasingham, S. Luong, D. Kumar, D. Louderback, S. Mahnkopf
The development of a transceiver module was presented. The transceiver is capable of transmitting and receiving 4 wavelength channels. Each channel of the module can be modulated at 2.5 Gbps. Significant performance improvements including operation at 10 Gbps are expected after the integration of a microlens array into the optical subassembly.
{"title":"Multi-mode WDM transceiver","authors":"P. Guilfoyle, K. M. Patel, M. Harris, U. Retnasingham, S. Luong, D. Kumar, D. Louderback, S. Mahnkopf","doi":"10.1109/AVFOP.2008.4653179","DOIUrl":"https://doi.org/10.1109/AVFOP.2008.4653179","url":null,"abstract":"The development of a transceiver module was presented. The transceiver is capable of transmitting and receiving 4 wavelength channels. Each channel of the module can be modulated at 2.5 Gbps. Significant performance improvements including operation at 10 Gbps are expected after the integration of a microlens array into the optical subassembly.","PeriodicalId":142148,"journal":{"name":"2008 IEEE Avionics, Fiber-Optics and Photonics Technology Conference","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-10-17","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125059550","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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