Pub Date : 2021-11-01DOI: 10.1109/irds54852.2021.00009
S. Dukes, Kirk M. Bresniker
The Systems and Architectures section of the roadmap serves as a bridge between application benchmarks and component technologies. The systems analyzed in this section cover a broad range of applications of computing, electronics, and photonics. By studying each of these systems in detail, we can identify requirements for the semiconductor and photonics technologies that make these systems and applications possible.
{"title":"Systems and Architectures","authors":"S. Dukes, Kirk M. Bresniker","doi":"10.1109/irds54852.2021.00009","DOIUrl":"https://doi.org/10.1109/irds54852.2021.00009","url":null,"abstract":"The Systems and Architectures section of the roadmap serves as a bridge between application benchmarks and component technologies. The systems analyzed in this section cover a broad range of applications of computing, electronics, and photonics. By studying each of these systems in detail, we can identify requirements for the semiconductor and photonics technologies that make these systems and applications possible.","PeriodicalId":160542,"journal":{"name":"2021 IEEE International Roadmap for Devices and Systems Outbriefs","volume":"2009 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128903775","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-11-01DOI: 10.1109/irds54852.2021.00015
Devaryan Gupta
Packaging Integration (PI) refers to the integration of separately manufactured components into a higher-level assembly that in the aggregate provides enhanced functionality and improved operating characteristics.
{"title":"Packaging Integration White Paper","authors":"Devaryan Gupta","doi":"10.1109/irds54852.2021.00015","DOIUrl":"https://doi.org/10.1109/irds54852.2021.00015","url":null,"abstract":"Packaging Integration (PI) refers to the integration of separately manufactured components into a higher-level assembly that in the aggregate provides enhanced functionality and improved operating characteristics.","PeriodicalId":160542,"journal":{"name":"2021 IEEE International Roadmap for Devices and Systems Outbriefs","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116068411","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-11-01DOI: 10.1109/irds54852.2021.00011
Shamik Das, Angela Chen, Matthew J. Marinella
Dimensional and functional scaling11Functional Scaling: Suppose that a system has been realized to execute a specific function in a given, currently available, technology. We say that system has been functionally scaled if the system is realized in an alternate technology such that it performs the identical function as the original system and offers improvements in at least one of size, power, speed, or cost, and does not degrade in any of the other metrics. of CMOS is driving information processing22Information processing refers to the input, transmission, storage, manipulation or processing, and output of data. The scope of the BC Chapter is restricted to data or information manipulation, transmission, and storage. technology into a broadening spectrum of new applications. Scaling has enabled many of these applications through increased performance and complexity. As dimensional scaling of CMOS will eventually approach fundamental limits, several new information processing devices and microarchitectures for both existing and new functions are being explored to extend the historical integrated circuit scaling cadence. This is driving interest in new devices for information processing and memory, new technologies for heterogeneous integration of multiple functions, and new paradigms for system architecture. This chapter, therefore, provides an IRDS perspective on emerging research device technologies and serves as a bridge between conventional CMOS and the realm of nanoelectronics beyond the end of CMOS scaling.
{"title":"Beyond CMOS","authors":"Shamik Das, Angela Chen, Matthew J. Marinella","doi":"10.1109/irds54852.2021.00011","DOIUrl":"https://doi.org/10.1109/irds54852.2021.00011","url":null,"abstract":"Dimensional and functional scaling11Functional Scaling: Suppose that a system has been realized to execute a specific function in a given, currently available, technology. We say that system has been functionally scaled if the system is realized in an alternate technology such that it performs the identical function as the original system and offers improvements in at least one of size, power, speed, or cost, and does not degrade in any of the other metrics. of CMOS is driving information processing22Information processing refers to the input, transmission, storage, manipulation or processing, and output of data. The scope of the BC Chapter is restricted to data or information manipulation, transmission, and storage. technology into a broadening spectrum of new applications. Scaling has enabled many of these applications through increased performance and complexity. As dimensional scaling of CMOS will eventually approach fundamental limits, several new information processing devices and microarchitectures for both existing and new functions are being explored to extend the historical integrated circuit scaling cadence. This is driving interest in new devices for information processing and memory, new technologies for heterogeneous integration of multiple functions, and new paradigms for system architecture. This chapter, therefore, provides an IRDS perspective on emerging research device technologies and serves as a bridge between conventional CMOS and the realm of nanoelectronics beyond the end of CMOS scaling.","PeriodicalId":160542,"journal":{"name":"2021 IEEE International Roadmap for Devices and Systems Outbriefs","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125835916","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2021-11-01DOI: 10.1109/irds54852.2021.00013
M. Graef
Since its inception in 1998, the objective of the International Technology Roadmap for Semiconductors (ITRS) has been to identify the technical challenges that had to be addressed in order to ensure that microelectronics would be able to remain a driver for innovation in a wide range of applications. This has resulted in an industrial/academic agenda for pre-competitive research, which is continuously being updated to take into account new trends.
{"title":"More Than Moore White Paper","authors":"M. Graef","doi":"10.1109/irds54852.2021.00013","DOIUrl":"https://doi.org/10.1109/irds54852.2021.00013","url":null,"abstract":"Since its inception in 1998, the objective of the International Technology Roadmap for Semiconductors (ITRS) has been to identify the technical challenges that had to be addressed in order to ensure that microelectronics would be able to remain a driver for innovation in a wide range of applications. This has resulted in an industrial/academic agenda for pre-competitive research, which is continuously being updated to take into account new trends.","PeriodicalId":160542,"journal":{"name":"2021 IEEE International Roadmap for Devices and Systems Outbriefs","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129379838","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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