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Erratum: “Acquisition and analysis of scanning tunneling spectroscopy data—WSe2 monolayer” [J. Vac. Sci. Technol. A 39, 011001 (2021)] 更正:"扫描隧道光谱数据的获取与分析--WSe2 单层" [J. Vac. Sci. Technol. A 39, 011001 (2021)]
Pub Date : 2024-03-04 DOI: 10.1116/6.0003535
Randall M. Feenstra, G. R. Frazier, Yi Pan, Stefan Fölsch, Yu-Chuan Lin, B. Jariwala, Kehao Zhang, Joshua A. Robinson
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引用次数: 0
Revealing the mechanism of interfacial adhesion enhancement between the SiO2 film and the GaAs substrate via plasma pre-treatments 揭示通过等离子体预处理增强二氧化硅薄膜与砷化镓基底之间界面附着力的机制
Pub Date : 2024-02-29 DOI: 10.1116/6.0003412
Zhiwei He, Chanjuan Liu, Jiuru Gao, Zichao Li, Kaidong Xu, Shiwei Zhuang
The formation mechanism of a highly adherent silicon dioxide (SiO2) film on gallium arsenide (GaAs) substrate by plasma enhanced chemical vapor deposition (PECVD) is proposed. Ar, N2, and NH3 were used as pre-treatment gas to improve the interfacial adhesion. The interfacial adhesion was measured by the cross-cut tape test. By the measurement of spectroscopic ellipsometry and x-ray photoelectron spectroscopy (XPS), it is revealed that nitrogen plasma pre-treatment had formed a very thin GaN transition layer on the surface, which was responsible for the improvement of interfacial adhesion. XPS depth-profiling further confirmed various pre-treatment gases generate plasma mixtures and form thin film layers with different compositions on the GaAs surface. These layers have a significant impact on the adhesion of the subsequently prepared SiO2 film. The primary mechanism for improving interfacial adhesion is the renovation of the substrate composition via plasma pre-treatment by PECVD, which forms a transition layer of nitrides that eliminates the negative effects of oxides on adhesion. This study reveals the mechanism of interfacial adhesion enhancement between SiO2 film and GaAs substrate, which is of significant importance in fabricating high-performance and reliable semiconductor devices.
提出了等离子体增强化学气相沉积(PECVD)技术在砷化镓(GaAs)衬底上形成高附着性二氧化硅(SiO2)薄膜的机理。预处理气体为 Ar、N2 和 NH3,以提高界面附着力。界面附着力是通过横切带试验测量的。通过光谱椭偏仪和 X 射线光电子能谱(XPS)的测量,发现氮等离子体预处理在表面形成了很薄的氮化镓过渡层,这是改善界面附着力的原因。XPS 深度分析进一步证实,各种预处理气体会产生等离子混合物,并在砷化镓表面形成不同成分的薄膜层。这些薄膜层对随后制备的二氧化硅薄膜的附着力有重大影响。改善界面附着力的主要机制是通过 PECVD 等离子预处理翻新基底成分,形成氮化物过渡层,消除氧化物对附着力的负面影响。这项研究揭示了二氧化硅薄膜与砷化镓衬底之间界面附着力增强的机理,这对于制造高性能、高可靠性的半导体器件具有重要意义。
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引用次数: 0
Spatially differentiated crystalline inorganic coatings deposited by an atmospheric pressure dielectric barrier discharge with immobilized filaments 通过固定丝的常压介质阻挡放电沉积的空间分化结晶无机涂层
Pub Date : 2024-02-29 DOI: 10.1116/6.0003268
M. Brabant, A. Demaude, J. Zveny, A. Remy, T. Segato, D. Petitjean, M. Delplancke-Ogletree, F. Reniers
The one-step deposition of spatially differentiated crystalline vanadium oxide coatings (V2O5) using an atmospheric pressure dielectric barrier discharge is reported. This feasibility study uses an original combination of immobilized filaments inside the plasma and an inductive heating device. Preliminary results show that thick crystalline deposits are achieved under the immobilized filaments, whether the interfilament spacing leads to much thinner deposits, with a different chemical composition. The gas flow inside the reactor, combined to the filament reactivity, leads to local depletions of reactants.
本报告介绍了利用常压介质阻挡放电一步沉积空间分化结晶氧化钒涂层(V2O5)的方法。这项可行性研究采用了等离子体内固定丝和感应加热装置的独创组合。初步结果表明,在固定丝下可以获得厚的结晶沉积物,而丝间间距是否会导致化学成分不同的更薄的沉积物。反应器内的气体流动与灯丝的反应性相结合,导致了反应物的局部耗竭。
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引用次数: 0
Growth of conformal TiN thin film with low resistivity and impurity via hollow cathode plasma atomic layer deposition 通过空心阴极等离子体原子层沉积技术生长低电阻率和杂质的保形 TiN 薄膜
Pub Date : 2024-02-29 DOI: 10.1116/6.0003319
Ha Young Lee, Jeong Hwan Han, Byung Joon Choi
Copper has been used as an interconnect material in integrated semiconductor devices because of its excellent conductivity, mechanical strength, and electromigration resistance. Introducing a diffusion barrier layer using transition metals such as Ti, Ta, W, Mo, and their nitrides can effectively prevent copper diffusion into the transistor region. TiN is widely used as the diffusion barrier. Plasma-enhanced atomic layer deposition (PEALD), which uses plasma to activate molecular reactions, can be used to fabricate high-quality thin films at lower temperatures than thermal atomic layer deposition. However, its high electrical resistivity and poor step coverage are disadvantageous for its adoption in highly scaled three-dimensional structures. In this study, TiN thin films were fabricated using PEALD with a hollow cathode plasma (HCP) source. The fabricated TiN exhibited a high density (5.29 g/cm3), which was very close to the theoretical density of TiN. Moreover, it has low electrical resistivity (132 μΩ cm) and excellent step coverage (>98%) in a trench pattern with a high aspect ratio of 32:1. These results suggest the possible application of the PEALD of TiN films using HCP sources in semiconductor device manufacturing.
铜具有出色的导电性、机械强度和抗电迁移性,因此一直被用作集成半导体器件的互连材料。利用过渡金属(如 Ti、Ta、W、Mo 及其氮化物)引入扩散阻挡层可以有效防止铜扩散到晶体管区域。TiN 被广泛用作扩散屏障。等离子体增强原子层沉积(PEALD)是一种利用等离子体激活分子反应的方法,与热原子层沉积相比,它可以在更低的温度下制造出高质量的薄膜。然而,它的高电阻率和较差的阶跃覆盖率不利于其在高比例三维结构中的应用。在本研究中,使用带有空心阴极等离子体 (HCP) 源的 PEALD 制造了 TiN 薄膜。制备的 TiN 密度很高(5.29 克/立方厘米),非常接近 TiN 的理论密度。此外,它还具有较低的电阻率(132 μΩ cm)和出色的阶跃覆盖率(>98%),沟槽图案的高宽比为 32:1。这些结果表明,使用 HCP 源对 TiN 薄膜进行 PEALD 可应用于半导体器件制造。
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引用次数: 0
High enhancement, low cost, large area surface enhanced Raman scattering substrates all by atomic layer deposition on porous filter paper 在多孔滤纸上通过原子层沉积实现高增强、低成本、大面积的表面增强拉曼散射基底
Pub Date : 2024-02-29 DOI: 10.1116/6.0003352
Feng Niu, Yimin Hu, Stephen LeKarz, Wei Lu
We successfully developed an atomic layer deposition (ALD) method for making Ag noble nanoparticles on cheap, commercial filter paper consisting of three-dimensional porous glass fibers and investigated the evolution of Ag nanostructures with some key process parameters. By tuning Ag particle sizes and controlling the cycle numbers of ALD deposited Ag films, we were able to obtain high-density isolated Ag nanoparticles with average sizes in 3–9 nm without the formation of agglomerates and continuous Ag films. We proved the presence of strong localized surface plasmon resonance peaks near a target wavelength of 632 nm. We further proved the presence of surface enhanced Raman scattering (SERS) signals on the Ag coated filter paper substrates using pyridine as the test analyte. Our results demonstrate that ALD is a very promising technique for a rational design of SERS substrates and, thus, has great potential for the fabrication of large-area, low-cost SERS substrates for future commercial applications, as compared to other existing techniques.
我们成功开发了一种原子层沉积(ALD)方法,用于在由三维多孔玻璃纤维组成的廉价商用滤纸上制备贵金属纳米颗粒,并研究了纳米银结构随一些关键工艺参数的变化。通过调整银粒子尺寸和控制 ALD 沉积银膜的循环次数,我们获得了平均尺寸在 3-9 nm 的高密度分离银纳米粒子,且未形成团聚和连续的银膜。我们证明了在目标波长 632 纳米附近存在强局部表面等离子体共振峰。我们还以吡啶作为测试分析物,进一步证明了银涂层滤纸基底上存在表面增强拉曼散射(SERS)信号。我们的研究结果表明,ALD 是一种非常有前途的合理设计 SERS 基底的技术,因此,与其他现有技术相比,它在为未来的商业应用制造大面积、低成本的 SERS 基底方面具有巨大的潜力。
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引用次数: 0
Intrinsic and extrinsic contributions in the ferroelectric response of chemically synthesized BiFeO3-xPbTiO3 thin films 化学合成 BiFeO3-xPbTiO3 薄膜铁电响应的内在和外在贡献
Pub Date : 2024-02-29 DOI: 10.1116/6.0003371
Layiq Zia, Eesha Tur Razia, G. Hassnain Jaffari, S. Ismat Shah
Multiferroic (BiFeO3)1−x-(PbTiO3)x (1−x)BF−xPT thin films exhibit very high electromechanical properties in the vicinity of the morphotropic phase boundary (MPB), making them important candidates for use in several modern device applications. However, preparing high-quality (1−x)BF−xPT thin films is challenging due to the high conductivity caused by oxygen vacancies produced during the synthesis process. This study aims to understand the effect of size and porosity density on the electrical properties of (1−x)BF−xPT thin films. A series of (1−x)BF−xPT solid solution thin films were fabricated using the spin-coating method on Pt/TiO2/SiO2/Si(100) substrates through chemical solution deposition. X-ray diffraction studies revealed a polycrystalline structure. Surface SEM images showed that the films have a uniform surface with average grain sizes ranging between 50 and 200 nm and an average film thickness of 1.5 μm. A decrease in average pore size and an increase in the number of pores were observed with the increase in PT concentration in the prepared films. Ferroelectric characterization revealed that the films exhibit room-temperature ferroelectric hysteresis loops. Sources of various contributions to polarization were extracted from hysteresis loops, including true ferroelectric switching and space charge contributions. Thin films with 0.30 < x < 0.45 show higher remanent and saturation polarization values, suggesting that these compositions exhibit the MPB. The highest remanent polarization value (PR = 16.68 μC/cm2) was observed for the thin film with x = 0.40. The correlation between the phase, composition, film morphology, and ferroelectric response is described and discussed.
多铁性 (BiFeO3)1-x-(PbTiO3)x (1-x)BF-xPT 薄膜在各向异性相边界 (MPB) 附近表现出极高的机电特性,使其成为多种现代设备应用的重要候选材料。然而,由于合成过程中产生的氧空位会导致高电导率,因此制备高质量的 (1-x)BF-xPT 薄膜极具挑战性。本研究旨在了解尺寸和孔隙密度对 (1-x)BF-xPT 薄膜电学特性的影响。通过化学溶液沉积法,采用旋涂法在 Pt/TiO2/SiO2/Si(100) 基底上制备了一系列 (1-x)BF-xPT 固溶体薄膜。X 射线衍射研究显示薄膜具有多晶结构。表面扫描电子显微镜图像显示,薄膜表面均匀,平均晶粒大小在 50 至 200 nm 之间,平均膜厚为 1.5 μm。随着所制备薄膜中 PT 浓度的增加,平均孔径减小,孔数增加。铁电特性分析表明,薄膜表现出室温铁电滞后环。从磁滞回线中提取了极化的各种贡献来源,包括真正的铁电转换和空间电荷贡献。0.30 < x < 0.45 的薄膜显示出较高的剩电位极化值和饱和极化值,表明这些成分显示出 MPB。x = 0.40 的薄膜的剩电位极化值最高(PR = 16.68 μC/cm2)。本文对相位、成分、薄膜形态和铁电响应之间的相关性进行了描述和讨论。
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引用次数: 0
Fabrication of the low-k films with tunable k value as spacers in advanced CMOS technology 在先进 CMOS 技术中制作 k 值可调的低 k 薄膜作为间隔物
Pub Date : 2024-02-29 DOI: 10.1116/6.0003357
Lewen Qian, Xin Sun, Tao Liu, Ziqiang Huang, Xinlong Guo, Maolin Pan, Dawei Wang, Saisheng Xu, Min Xu, Chen Wang, Chunlei Wu, David Wei Zhang
In advanced CMOS technology, a suitable spacer scheme is crucial to alleviate the effects of increasing parasitic resistance and capacitance on device performance as the critical dimensions shrinking. Low dielectric constant (low-k) films, possessing a tunable k value ranging from 3.5 to 6.5, were fabricated using plasma-enhanced atomic layer deposition in a single chamber. The fabrication process involved the deposition of the SiN film via SiH2I2 with N2 plasma, as well as the deposition of the SiOX, SiOCN, and SiON films using diisopropylamino silane with O2, Ar/O2, and N2/O2 plasmas, respectively. The introduction of groups containing carbon (C) tended to loosen the film structure, due to its weak bond strength with Si, thus made distinctions in structural and electrical stability. We developed such a process which can adjust the C-group concentration and O, N content to tune the film k value. The SiOx, SiOCN, SiON, and SiN films had high breakdown strength of 9.04, 7.23, 9.41, and over 11 MV cm−1, and meanwhile low leakage current density of 2.42 × 10−9, 4.78 × 10−8, 1.29 × 10−9, and 9.26 × 10−10 A cm−2, respectively. The films exhibited remarkable thermal stability, enhanced breakdown strength, and suppressed leakage with annealing treatment, which could be attributed to the desorption of —CHX groups. Moreover, the low-k materials demonstrated excellent step coverage both in the inner-spacer cavity and on sidewalls, exploring the potential application as spacers in advanced CMOS structure.
在先进的 CMOS 技术中,一个合适的隔层方案对于缓解临界尺寸缩小时寄生电阻和电容增加对器件性能的影响至关重要。利用等离子体增强原子层沉积技术在单室中制造出了低介电常数(低 k)薄膜,其 k 值可调,范围在 3.5 到 6.5 之间。制备过程包括在 N2 等离子体中通过 SiH2I2 沉积 SiN 薄膜,以及在 O2、Ar/O2 和 N2/O2 等离子体中分别使用二异丙基氨基硅烷沉积 SiOX、SiOCN 和 SiON 薄膜。引入含碳(C)的基团后,由于碳与硅的结合强度较弱,薄膜结构趋于松散,因此在结构和电气稳定性方面有所区别。我们开发了这样一种工艺,可以通过调节 C 基团浓度和 O、N 含量来调整薄膜的 k 值。SiOx、SiOCN、SiON 和 SiN 薄膜的击穿强度分别为 9.04、7.23、9.41 和超过 11 MV cm-1,同时漏电流密度分别为 2.42 × 10-9、4.78 × 10-8、1.29 × 10-9 和 9.26 × 10-10 A cm-2。这些薄膜表现出显著的热稳定性,击穿强度增强,退火处理后漏电抑制,这可能归功于 -CHX 基团的解吸。此外,低 k 材料在内层间隔腔和侧壁上都表现出了极好的阶跃覆盖性,从而探索了在先进 CMOS 结构中用作间隔层的潜在应用。
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引用次数: 0
Spin-related negative magnetoresistance in germanium films 锗薄膜中与自旋相关的负磁阻
Pub Date : 2024-02-29 DOI: 10.1116/6.0003337
Zhaoguo Li, Yuechuan Luo, Jia Li, Jicheng Zhang
Herein, we report the transport properties of Ge films. The variable-range hopping transport at low temperatures (T≲50K) and thermal activation transport at high temperatures (T≳50K) are observed in our Ge films. In the different temperature regimes, the anomalous magnetotransport properties are observed. In the low-temperature regime (T≲15K), the negative magnetoresistance (MR) at low field and positive MR at high field can be seen. In the moderate-temperature regime (15K≲T≲100K), the positive MR curve gradually evolves from a linear curve to a parabolic curve with increasing temperature, and the MR magnitude appears to be insensitive to temperature. In the high-temperature regime (T≳100K), the positive MR value increases with increasing temperature. By considering the angular-dependent MR, we can determine that the negative MR comes from the spin-related mechanism, and the positive MR is caused by the orbital-related mechanism. However, further study is required to determine the exact mechanisms behind the anomalous magnetotransport properties.
在此,我们报告了 Ge 薄膜的传输特性。在我们的 Ge 薄膜中观察到了低温(T≲50K)下的变程跳跃传输和高温(T≲50K)下的热激活传输。在不同的温度条件下,都能观察到反常的磁传输特性。在低温状态(T≲15K)下,可以看到低磁场下的负磁阻(MR)和高磁场下的正磁阻。在中温区(15K≲T≲100K),随着温度的升高,正磁阻曲线逐渐从线性曲线演变为抛物线曲线,而且磁阻大小似乎对温度不敏感。在高温区(T≲100K),MR 正值随温度升高而增加。通过考虑随角度变化的磁共振,我们可以确定负磁共振来自自旋相关机制,而正磁共振由轨道相关机制引起。然而,要确定异常磁传输特性背后的确切机制,还需要进一步的研究。
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引用次数: 0
Quantification in high-energy resolution Auger electron spectroscopy; Proposal of a reference target convolution technique for direct spectra 高能分辨率欧杰电子能谱仪的定量分析;关于直接光谱参考目标卷积技术的建议
Pub Date : 2024-02-29 DOI: 10.1116/6.0003379
Katsumi Watanabe, Daisuke Watanabe, Kazutoshi Mamiya, Seiji Koizumi, Noriaki Sanada, Mineharu Suzuki
Currently, high-energy resolution Auger electron spectroscopy (AES) is utilized for chemical-state qualitative analysis, such as x-ray photoelectron spectroscopy. It is highly desirable to perform quantitative analysis using the high-energy resolution direct spectra used for qualitative analysis. However, AES analysis parameters, such as relative sensitivity factors (RSFs), derived from conventional-energy resolution differentiated spectra cannot be adopted for high-energy resolution direct spectra. Furthermore, for quantification by high-energy resolution direct spectra, there is no established method for determining peak intensity, and no database of RSFs is available in surface analysis communities. Therefore, we tasked ourselves with investigating the use of the analysis parameters obtained from conventional-energy resolution-differentiated spectra obtained with a cylindrical mirror analyzer (CMA)-type AES instrument for high-energy resolution direct spectra measured with a spherical capacitor analyzer (SCA)-type AES instrument. The convolution technique proposed here is achieved by using a conventional-energy resolution spectral dataset obtained with CMA-AES as a target. By applying the convolution with the window function of the convoluted function of the Gaussian function and rectangular function, high-energy resolution direct spectra containing the inherent nature of fine structures are converted to the similar shapes of conventional-energy resolution direct spectra after the Shirley type background subtraction [Watanabe et al., J. Vac. Sci. Technol. A 41, 043209 (2023)]. Results revealed that for all spectra of conventional-energy resolution spectra taken with CMA-AES, as well as high-energy resolution spectra taken with SCA-AES with various energy resolutions, the ratios of the background-subtracted direct peak areas and the differentiated peak-to-peak intensities were well-aligned along the identical parabolic curve as a function of the kinetic energy (KE). Experimental results also revealed that the generalized conversion function f(KE;ΔE)=IareacmaIareaconv.sca(KE;ΔE), which is the ratio of the conventional-energy resolution spectral area (Iareacma) and the convoluted high-energy resolution spectral area (Iareaconv.sca), which can transform differentiated intensities of convoluted high-energy resolution spectra, such that they are similar to those of conventional-energy resolution spectra obtained using the CMA-AES instrument, being a function of KE and the energy resolution ΔE. By applying the conversion function, the historically accumulated AES analysis parameters for conventional-energy resolution differentiated spectra can be adopted to differentiated high-energy resolution spectra. Finally, the results revealed the sufficiency of the conversion function obtained by the actual measurements of the four reference specimens for the practical quantification of high-energy resolution AES direct spectra.
目前,高能分辨率奥杰电子能谱(AES)被用于化学状态定性分析,如 X 射线光电子能谱。利用用于定性分析的高能分辨率直接光谱进行定量分析是非常理想的。然而,高能分辨直接光谱不能采用从传统能分辨分光光谱得出的 AES 分析参数,如相对灵敏度系数 (RSF)。此外,对于高能量分辨率直接光谱的量化,目前还没有确定峰值强度的成熟方法,表面分析界也没有 RSFs 数据库。因此,我们的任务是研究如何将使用圆柱镜分析仪(CMA)型 AES 仪器获得的传统能量分辨率分辨光谱中获得的分析参数用于使用球形电容器分析仪(SCA)型 AES 仪器测量的高能量分辨率直接光谱。本文提出的卷积技术是以 CMA-AES 获得的常规能量分辨率光谱数据集为目标实现的。通过应用高斯函数和矩形函数卷积函数的窗口函数进行卷积,含有精细结构固有性质的高能分辨率直接光谱在经过雪莉型背景减除后被转换成与常规能分辨率直接光谱相似的形状[Watanabe 等人,J. Vac. Sci. Technol. A 41, 043209 (2023)]。结果表明,对于用 CMA-AES 扫描的所有常规能量分辨率光谱,以及用 SCA-AES 扫描的各种能量分辨率的高能量分辨率光谱,背景减去的直接峰面积与区分的峰对峰强度之比均沿着与动能(KE)函数相同的抛物线很好地对齐。实验结果还表明,广义转换函数 f(KE;ΔE)=IareacmaIareaconv.sca(KE;ΔE) 是常规能量分辨率光谱区域(Iareacma)与卷积高能分辨率光谱区域(Iareaconv.sca)的比值,它可以转换卷积高能分辨率光谱的分辨强度,使其与使用 CMA-AES 仪器获得的常规能分辨率光谱的分辨强度相似,是 KE 和能量分辨率 ΔE 的函数。通过应用转换函数,历史上积累的用于常规能量分辨率分辨光谱的 AES 分析参数可用于高能分辨率分辨光谱。最后,研究结果表明,通过对四个参考试样的实际测量获得的转换函数足以用于高能分辨率 AES 直接光谱的实际量化。
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引用次数: 0
Advances in growth, doping, and devices and applications of zinc oxide 氧化锌的生长、掺杂、设备和应用方面的进展
Pub Date : 2024-02-29 DOI: 10.1116/6.0003171
V. Saravade, Zhe Chuan Feng, Manika Tun Nafisa, Chuanle Zhou, N. Lu, B. Klein, Ian Ferguson
Zinc oxide is a breakthrough multifunctional material of emerging interest applicable in the areas of electronics, computing, energy harvesting, sensing, optoelectronics, and biomedicine. ZnO has a direct and wide bandgap and high exciton binding energy. It is nontoxic, earth-abundant, and biocompatible. However, the growth and characterization of high-quality ZnO has been a challenge and bottleneck in its development. Efforts have been made to synthesize device-quality zinc oxide and unleash its potential for multiple advanced applications. ZnO could be grown as thin films, nanostructures, or bulk, and its properties could be optimized by tuning the growth techniques, conditions, and doping. Zinc oxide could be a suitable material for next generation devices including spintronics, sensors, solar cells, light-emitting diodes, thermoelectrics, etc. It is important and urgent to collate recent advances in this material, which would strategically help in further research and developments in ZnO. This paper provides a coherent review of developments in ZnO growth, leading to its advancing applications. Recent developments in growth technologies that address native defects, current challenges in zinc oxide, and its emerging applications are reviewed and discussed in this article.
氧化锌是一种突破性的多功能材料,可应用于电子、计算、能量收集、传感、光电和生物医学等领域。氧化锌具有直接宽带隙和高激子结合能。它无毒、富集于地球并且具有生物相容性。然而,高质量氧化锌的生长和表征一直是其发展的挑战和瓶颈。人们一直在努力合成设备级氧化锌,并释放其在多种先进应用中的潜力。氧化锌可生长为薄膜、纳米结构或块状,其特性可通过调整生长技术、条件和掺杂进行优化。氧化锌可能是下一代设备的合适材料,包括自旋电子学、传感器、太阳能电池、发光二极管、热电等。整理这种材料的最新进展既重要又紧迫,这将在战略上有助于氧化锌的进一步研究和发展。本文对氧化锌的生长进展进行了连贯的回顾,从而推动其应用的发展。本文回顾并讨论了解决原生缺陷的生长技术的最新发展、氧化锌当前面临的挑战及其新兴应用。
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引用次数: 1
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