Pub Date : 1996-10-14DOI: 10.1109/IEMT.1996.559789
B. Vaidhyanathan, H.H. Li, Shan Sun
During the past few years, we have been witnessing the increasing use of artificial neural network and fuzzy logic approaches to semiconductor equipment and manufacturing process control. However, there is a lack of objective evaluation of these new techniques to the existing statistically based, or PID control techniques. In this paper, we would like to review, survey, and perform comparisons of the effectiveness of these proposed techniques. We first will address the attractive features of each technique, their design procedures, applicability to various different control problems, and their limitations. Then, we will propose a general guideline for practioners and design engineers to select an appropriate design technique. We will also address the major theoretical challenges in this field.
{"title":"Comparison of statistical and neural-fuzzy approaches to process control applications","authors":"B. Vaidhyanathan, H.H. Li, Shan Sun","doi":"10.1109/IEMT.1996.559789","DOIUrl":"https://doi.org/10.1109/IEMT.1996.559789","url":null,"abstract":"During the past few years, we have been witnessing the increasing use of artificial neural network and fuzzy logic approaches to semiconductor equipment and manufacturing process control. However, there is a lack of objective evaluation of these new techniques to the existing statistically based, or PID control techniques. In this paper, we would like to review, survey, and perform comparisons of the effectiveness of these proposed techniques. We first will address the attractive features of each technique, their design procedures, applicability to various different control problems, and their limitations. Then, we will propose a general guideline for practioners and design engineers to select an appropriate design technique. We will also address the major theoretical challenges in this field.","PeriodicalId":177653,"journal":{"name":"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125810956","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1996-08-01DOI: 10.1109/IEMT.1996.559725
T. Śleboda
With the growth of electroless depositions, the need to understand the formaldehyde-based electroless plating process in multi-layer board (MLB) applications is becoming increasingly important. The purpose of this work is to understand the conditions that insure reliable, crack-free electroless copper in plated through-holes (PTHs). This is accomplished by correlating multiple processing and plating variables to PTH cracking in actual MLBs. A design of experiment (DOE) and statistical analysis was employed to understand the most important processing and plating conditions on PTH cracking. It was found that cracking is not only affected by plating thickness and PTH diameter, but also by plating bath variables such as formaldehyde (HCHO) concentration. These results indicate that a strict adherence to plating bath concentrations had the largest effect on insuring crack-free PTHs. In addition, the microstructure of the electroless copper foils in this experiment was analyzed and correlated to cracking. It was found that the copper from the PTHs with more cracking had voids in the microstructure, believed to originate from hydrogen evolution, increased dimpling and less plastic deformation in the region of the fracture surface from elevated temperature (250/spl deg/C) tensile testing.
{"title":"A study of plated through-hole reliability of formaldehyde-based electroless copper depositions","authors":"T. Śleboda","doi":"10.1109/IEMT.1996.559725","DOIUrl":"https://doi.org/10.1109/IEMT.1996.559725","url":null,"abstract":"With the growth of electroless depositions, the need to understand the formaldehyde-based electroless plating process in multi-layer board (MLB) applications is becoming increasingly important. The purpose of this work is to understand the conditions that insure reliable, crack-free electroless copper in plated through-holes (PTHs). This is accomplished by correlating multiple processing and plating variables to PTH cracking in actual MLBs. A design of experiment (DOE) and statistical analysis was employed to understand the most important processing and plating conditions on PTH cracking. It was found that cracking is not only affected by plating thickness and PTH diameter, but also by plating bath variables such as formaldehyde (HCHO) concentration. These results indicate that a strict adherence to plating bath concentrations had the largest effect on insuring crack-free PTHs. In addition, the microstructure of the electroless copper foils in this experiment was analyzed and correlated to cracking. It was found that the copper from the PTHs with more cracking had voids in the microstructure, believed to originate from hydrogen evolution, increased dimpling and less plastic deformation in the region of the fracture surface from elevated temperature (250/spl deg/C) tensile testing.","PeriodicalId":177653,"journal":{"name":"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134230096","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/IEMT.1996.559721
G. Love, G. Maher, N. Long
We present the results of alpha-site testing of a pad printer for thick film technology, including uniformity, reproducibility, physical and electrical characterization of conductor and resistor patterns in single-layer (hybrid) configurations and in multi-layer co-fired designs.
{"title":"Pad printer","authors":"G. Love, G. Maher, N. Long","doi":"10.1109/IEMT.1996.559721","DOIUrl":"https://doi.org/10.1109/IEMT.1996.559721","url":null,"abstract":"We present the results of alpha-site testing of a pad printer for thick film technology, including uniformity, reproducibility, physical and electrical characterization of conductor and resistor patterns in single-layer (hybrid) configurations and in multi-layer co-fired designs.","PeriodicalId":177653,"journal":{"name":"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium","volume":"420 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124208552","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/IEMT.1996.559783
L. Goenka, A. Achari
For pt.I see L.N. Goenka and A. Achari, Eighteenth IEEE/CHMT Symposium, Austin, Texas (1995). Miniaturization and clever assembly of electronic components are bringing new challenges to their functional reliability. Manufacturing process improvements by a thorough understanding of the chemistry of solder reflow are important to interconnect reliability. One area of concern is the formation of voids in solder bumps during the solder reflow process. This can result in premature solder-joint failure under the application environment. In this study, a three-dimensional model which predicts the motion and coalescence of bubbles within a solder bump during reflow has been developed. The model assumes a recirculatory flow within the bump that is generated by a combination of buoyancy and thermocapillary effects. The results show that large voids are formed as a result of the coalescence of numerous smaller bubbles. This model is based upon an earlier study which utilized a two-dimensional analysis, but did not show the formation of large voids within the joint as observed in cross-sectional results. Additional refinements to the present model include incorporation of the "added-mass" effect in the bubble-motion calculations, as well as the inclusion of thermocapillary effects. A cross-sectional analysis of solder bumps is presented in support of this work.
{"title":"Void formation in flip chip solder bumps. II","authors":"L. Goenka, A. Achari","doi":"10.1109/IEMT.1996.559783","DOIUrl":"https://doi.org/10.1109/IEMT.1996.559783","url":null,"abstract":"For pt.I see L.N. Goenka and A. Achari, Eighteenth IEEE/CHMT Symposium, Austin, Texas (1995). Miniaturization and clever assembly of electronic components are bringing new challenges to their functional reliability. Manufacturing process improvements by a thorough understanding of the chemistry of solder reflow are important to interconnect reliability. One area of concern is the formation of voids in solder bumps during the solder reflow process. This can result in premature solder-joint failure under the application environment. In this study, a three-dimensional model which predicts the motion and coalescence of bubbles within a solder bump during reflow has been developed. The model assumes a recirculatory flow within the bump that is generated by a combination of buoyancy and thermocapillary effects. The results show that large voids are formed as a result of the coalescence of numerous smaller bubbles. This model is based upon an earlier study which utilized a two-dimensional analysis, but did not show the formation of large voids within the joint as observed in cross-sectional results. Additional refinements to the present model include incorporation of the \"added-mass\" effect in the bubble-motion calculations, as well as the inclusion of thermocapillary effects. A cross-sectional analysis of solder bumps is presented in support of this work.","PeriodicalId":177653,"journal":{"name":"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116266089","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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