2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)最新文献
Pub Date : 2013-06-16DOI: 10.1109/TRANSDUCERS.2013.6626945
Shu-Wei Tung, Che-Hsi Kuo, Li-Sheng Hsu, Y. Yang
This work presents the fabrication of barbed microtip arrays which utilizes the techniques of silicon wet etching. The KOH anisotropic wet etching was employed to form standard pyramidal microtip arrays, and HF/HNO3 isotropic etching was used to create barbs on those microtips. Experimental results show that the forces for detaching the barbed microtip arrays from a human skin, a PDMS polymer, and a PVC film are larger than the forces for the microtip arrays without barbs. The proposed barbed microtip arrays can be employed as the dry electroencephalogram (EEG) electrodes.
{"title":"Fabricating barbed microtip arrays by low-cost silicon wet etching techniques","authors":"Shu-Wei Tung, Che-Hsi Kuo, Li-Sheng Hsu, Y. Yang","doi":"10.1109/TRANSDUCERS.2013.6626945","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2013.6626945","url":null,"abstract":"This work presents the fabrication of barbed microtip arrays which utilizes the techniques of silicon wet etching. The KOH anisotropic wet etching was employed to form standard pyramidal microtip arrays, and HF/HNO3 isotropic etching was used to create barbs on those microtips. Experimental results show that the forces for detaching the barbed microtip arrays from a human skin, a PDMS polymer, and a PVC film are larger than the forces for the microtip arrays without barbs. The proposed barbed microtip arrays can be employed as the dry electroencephalogram (EEG) electrodes.","PeriodicalId":202479,"journal":{"name":"2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-06-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130492996","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-06-16DOI: 10.1109/TRANSDUCERS.2013.6627159
D. Čiplys, R. Rimeika, A. Sereika
The acoustoelectric interaction of leaky surface acoustic wave (LSAW) on 36° rotated Y-cut X-propagation lithium tantalate was studied and the thin film conductivity sensor was implemented on this base. The technique of slow evaporation of thin copper film on the wave propagation surface with simultaneous measurements of the wave amplitude and phase was used. The observed strong response of the LSAW to the film conductivity is explained by the acoustoelectric attenuation and velocity change. The sheet conductivity extracted from the changes in wave amplitude and phase was compared with the results of DC resistance measurements. The potential of LSAWs in LiTaO3 for contactless monitoring of changes in thin film conductivity has been demonstrated.
{"title":"Thin film conductivity sensor based on acoustoelectric interaction in 36° YX lithium tantalate","authors":"D. Čiplys, R. Rimeika, A. Sereika","doi":"10.1109/TRANSDUCERS.2013.6627159","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2013.6627159","url":null,"abstract":"The acoustoelectric interaction of leaky surface acoustic wave (LSAW) on 36° rotated Y-cut X-propagation lithium tantalate was studied and the thin film conductivity sensor was implemented on this base. The technique of slow evaporation of thin copper film on the wave propagation surface with simultaneous measurements of the wave amplitude and phase was used. The observed strong response of the LSAW to the film conductivity is explained by the acoustoelectric attenuation and velocity change. The sheet conductivity extracted from the changes in wave amplitude and phase was compared with the results of DC resistance measurements. The potential of LSAWs in LiTaO3 for contactless monitoring of changes in thin film conductivity has been demonstrated.","PeriodicalId":202479,"journal":{"name":"2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-06-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126668403","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-06-16DOI: 10.1109/TRANSDUCERS.2013.6626840
Yu-Chia Liu, M. Tsai, Sheng-Shian Li, W. Fang
The integration of a CMOS multi-channel readout circuit and tri-axis capacitive accelerometers on a single chip has been demonstrated in this work. The tri-axis mechanical structure together with the monolithic tri-axis multiplexed accelerometer interface circuit is proposed and demonstrated for the first time. Such a system exhibits the following features: (1) the smallest chip size is realized by a timing-based readout circuit; (2) the signal-to-noise ratio (SNR) is enhanced by a fully differential sensing mechanism; and (3) the stacking of the pure oxide layers, serving as the mechanical structures, enhances temperature stability. As a result, the sensing system not only reduces the total chip size but significantly improves the overall system performance.
{"title":"A fully-differential, multiplex-sensing interface circuit monolithically integrated with tri-axis pure oxide capacitive CMOS-MEMS accelerometers","authors":"Yu-Chia Liu, M. Tsai, Sheng-Shian Li, W. Fang","doi":"10.1109/TRANSDUCERS.2013.6626840","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2013.6626840","url":null,"abstract":"The integration of a CMOS multi-channel readout circuit and tri-axis capacitive accelerometers on a single chip has been demonstrated in this work. The tri-axis mechanical structure together with the monolithic tri-axis multiplexed accelerometer interface circuit is proposed and demonstrated for the first time. Such a system exhibits the following features: (1) the smallest chip size is realized by a timing-based readout circuit; (2) the signal-to-noise ratio (SNR) is enhanced by a fully differential sensing mechanism; and (3) the stacking of the pure oxide layers, serving as the mechanical structures, enhances temperature stability. As a result, the sensing system not only reduces the total chip size but significantly improves the overall system performance.","PeriodicalId":202479,"journal":{"name":"2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)","volume":"116 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-06-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129037569","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-06-16DOI: 10.1109/TRANSDUCERS.2013.6626815
S. Rahiminejad, A. A. Brazález, H. Raza, E. Pucci, S. Haasl, P. Kildal, P. Enoksson
Two gap waveguide technologies, groove and ridge, are presented here for F-band applications. Three different groove gap waveguide devices and four different ridge gap waveguide devices have been fabricated. All of them were micromachined to achieve the feature size required for the frequency band and fabricated in a single process using SOI wafers. The two types provide a more robust coupling to standard waveguides and high frequency probes. Measurements for most of the devices are shown in this paper, showing robust measurements and good agreement with simulations. More measurements need to be done but the initial ones show the promise both in the manufacturing technique and the coupling.
{"title":"100 GHz SOI gap waveguides","authors":"S. Rahiminejad, A. A. Brazález, H. Raza, E. Pucci, S. Haasl, P. Kildal, P. Enoksson","doi":"10.1109/TRANSDUCERS.2013.6626815","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2013.6626815","url":null,"abstract":"Two gap waveguide technologies, groove and ridge, are presented here for F-band applications. Three different groove gap waveguide devices and four different ridge gap waveguide devices have been fabricated. All of them were micromachined to achieve the feature size required for the frequency band and fabricated in a single process using SOI wafers. The two types provide a more robust coupling to standard waveguides and high frequency probes. Measurements for most of the devices are shown in this paper, showing robust measurements and good agreement with simulations. More measurements need to be done but the initial ones show the promise both in the manufacturing technique and the coupling.","PeriodicalId":202479,"journal":{"name":"2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-06-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123952181","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-06-16DOI: 10.1109/TRANSDUCERS.2013.6626842
V. Hong, B. J. Lee, D. L. Christensen, D. Heinz, E. Ng, C. Ahn, Y. Yang, T. Kenny
We present the first ultra-miniature (<;1 mm2) capacitive accelerometers built in the epitaxial polysilicon encapsulation (`epi-seal') process. Lateral (X/Y-axis) and out-of-plane (Z-axis) accelerometers were fabricated using a variant of the epi-seal process that utilizes a separate electrode defined in the encapsulation layer. Sensitivities of up to 10.2 fF/g and 0.24 fF/g were achieved for lateral and out-of-plane accelerometers respectively. Resolution down to 0.47 mg/rt-Hz is realized, approaching the theoretical Brownian limit for a combined accelerometer and off-the-shelf capacitance-measuring chip (AD7746) system. This enables singlechip integration of accelerometers, gyroscopes, pressure sensors, thermometers, and clocks all in an established commercial manufacturing process.
{"title":"X-Y and Z-axis capacitive accelerometers packaged in an ultra-clean hermetic environment","authors":"V. Hong, B. J. Lee, D. L. Christensen, D. Heinz, E. Ng, C. Ahn, Y. Yang, T. Kenny","doi":"10.1109/TRANSDUCERS.2013.6626842","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2013.6626842","url":null,"abstract":"We present the first ultra-miniature (<;1 mm2) capacitive accelerometers built in the epitaxial polysilicon encapsulation (`epi-seal') process. Lateral (X/Y-axis) and out-of-plane (Z-axis) accelerometers were fabricated using a variant of the epi-seal process that utilizes a separate electrode defined in the encapsulation layer. Sensitivities of up to 10.2 fF/g and 0.24 fF/g were achieved for lateral and out-of-plane accelerometers respectively. Resolution down to 0.47 mg/rt-Hz is realized, approaching the theoretical Brownian limit for a combined accelerometer and off-the-shelf capacitance-measuring chip (AD7746) system. This enables singlechip integration of accelerometers, gyroscopes, pressure sensors, thermometers, and clocks all in an established commercial manufacturing process.","PeriodicalId":202479,"journal":{"name":"2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-06-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116293468","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-06-16DOI: 10.1109/TRANSDUCERS.2013.6626712
N. Kitamura, J. Chim, N. Miki
This paper describes electro tactile display with micro-needle electrodes that stimulate tactile receptors using electric stimulation. The needle length was designed to have approximately the same length as the stratum corneum so as not to injure nerve area. This device allowed subjects to feel tactile sensation with lower voltage than a flat electrode array with good repeatability. In addition, the tactile sensation was created in the vicinity of the needles, i.e., tactile display with a high spatial resolution was achieved.
{"title":"Micro-needle electrode array for electro tactile display","authors":"N. Kitamura, J. Chim, N. Miki","doi":"10.1109/TRANSDUCERS.2013.6626712","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2013.6626712","url":null,"abstract":"This paper describes electro tactile display with micro-needle electrodes that stimulate tactile receptors using electric stimulation. The needle length was designed to have approximately the same length as the stratum corneum so as not to injure nerve area. This device allowed subjects to feel tactile sensation with lower voltage than a flat electrode array with good repeatability. In addition, the tactile sensation was created in the vicinity of the needles, i.e., tactile display with a high spatial resolution was achieved.","PeriodicalId":202479,"journal":{"name":"2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-06-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116468521","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-06-16DOI: 10.1109/TRANSDUCERS.2013.6626854
E. Sage, O. Martin, C. Dupré, T. Ernst, G. Billiot, L. Duraffourg, É. Colinet, S. Hentz
This paper reports the design, fabrication and characterization of NEMS resonator arrays along with their associated readout scheme enabling the probing of all the resonators within an array. The successful monitoring of arrays of 20 NEMS in both air and vacuum is presented and the significant advantage these arrays provide over individual resonators for mass and gas sensing is discussed. Arrays of 20, 49 and 100 resonators have been designed and characterized in terms of Signal to Background Ratio (SBR) of the NEMS frequency response and Allan Deviation (ADEV) for the frequency stability of the resonators. While probing an array in closed loop, mass additions onto the NEMS were simulated by electrostatically-induced frequency shifts. These shifts were applied simultaneously on the entire array to demonstrate the ability of this system to track the complete array in real time. On the other hand, a noise reduction at short integration times by a factor close to √N, where N is the number of resonators, has been obtained by averaging all the resonators' signal. The ability to control arrays of NEMS with a simplified routing and a reduced number of electrical connections is demonstrated and the great potential of NEMS arrays for gas and mass sensing applications is highlighted.
{"title":"Frequency-addressed NEMS arrays for mass and gas sensing applications","authors":"E. Sage, O. Martin, C. Dupré, T. Ernst, G. Billiot, L. Duraffourg, É. Colinet, S. Hentz","doi":"10.1109/TRANSDUCERS.2013.6626854","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2013.6626854","url":null,"abstract":"This paper reports the design, fabrication and characterization of NEMS resonator arrays along with their associated readout scheme enabling the probing of all the resonators within an array. The successful monitoring of arrays of 20 NEMS in both air and vacuum is presented and the significant advantage these arrays provide over individual resonators for mass and gas sensing is discussed. Arrays of 20, 49 and 100 resonators have been designed and characterized in terms of Signal to Background Ratio (SBR) of the NEMS frequency response and Allan Deviation (ADEV) for the frequency stability of the resonators. While probing an array in closed loop, mass additions onto the NEMS were simulated by electrostatically-induced frequency shifts. These shifts were applied simultaneously on the entire array to demonstrate the ability of this system to track the complete array in real time. On the other hand, a noise reduction at short integration times by a factor close to √N, where N is the number of resonators, has been obtained by averaging all the resonators' signal. The ability to control arrays of NEMS with a simplified routing and a reduced number of electrical connections is demonstrated and the great potential of NEMS arrays for gas and mass sensing applications is highlighted.","PeriodicalId":202479,"journal":{"name":"2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-06-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116485859","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-06-16DOI: 10.1109/TRANSDUCERS.2013.6626893
F. Santagata, I. Zaccaria, R. Poelma, J. Creemer, G. Zhang, P. Sarro
In this paper we present a new sealing technique for thin-film encapsulation of MEMS components without unwanted deposition on the device surface. The capping layer contains an array of bimorph cantilevers placed on top of the access holes acting as thermally-actuated valves that close the access holes during the sealing step. Microcavities were designed and fabricated to validate the concept. Both high and low-temperature encapsulation schemes have been implemented. Bimorph cantilevers made of LPCVD SiO and SiN are used for the high temperature micropackages whereas PECVD SiN and Aluminum are used for low temperature micropackages. The micropackages are successful encapsulated and no deposition is observed inside the micropackages.
{"title":"A new self-sealing thin-film encapsulation process for MEMS","authors":"F. Santagata, I. Zaccaria, R. Poelma, J. Creemer, G. Zhang, P. Sarro","doi":"10.1109/TRANSDUCERS.2013.6626893","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2013.6626893","url":null,"abstract":"In this paper we present a new sealing technique for thin-film encapsulation of MEMS components without unwanted deposition on the device surface. The capping layer contains an array of bimorph cantilevers placed on top of the access holes acting as thermally-actuated valves that close the access holes during the sealing step. Microcavities were designed and fabricated to validate the concept. Both high and low-temperature encapsulation schemes have been implemented. Bimorph cantilevers made of LPCVD SiO and SiN are used for the high temperature micropackages whereas PECVD SiN and Aluminum are used for low temperature micropackages. The micropackages are successful encapsulated and no deposition is observed inside the micropackages.","PeriodicalId":202479,"journal":{"name":"2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-06-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121643062","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-06-16DOI: 10.1109/TRANSDUCERS.2013.6626869
A. Sorger, C. Auerswald, A. Shaporin, M. Freitag, M. Dienel, J. Mehner
This paper reports on the development of a capacitive MEMS acceleration sensor applicable for acoustic emission testing. As a key feature, the sensor consists of two resonators with different resonance frequencies (90 kHz and 110 kHz) and an opposing electrode arrangement improving the rejection of disturbing low-frequency mechanical vibrations. In order to characterize the frequency response of the sensor a test bench was developed which allows to mechanically excite the sensor up to frequencies of 250 kHz using a piezoelectric shaker. The applicability of the sensor to acoustic emission testing is demonstrated by applying it to experimental tests such as wave speed measurement and source localization.
{"title":"Design, modeling, fabrication and characterization of a MEMS acceleration sensor for acoustic emission testing","authors":"A. Sorger, C. Auerswald, A. Shaporin, M. Freitag, M. Dienel, J. Mehner","doi":"10.1109/TRANSDUCERS.2013.6626869","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2013.6626869","url":null,"abstract":"This paper reports on the development of a capacitive MEMS acceleration sensor applicable for acoustic emission testing. As a key feature, the sensor consists of two resonators with different resonance frequencies (90 kHz and 110 kHz) and an opposing electrode arrangement improving the rejection of disturbing low-frequency mechanical vibrations. In order to characterize the frequency response of the sensor a test bench was developed which allows to mechanically excite the sensor up to frequencies of 250 kHz using a piezoelectric shaker. The applicability of the sensor to acoustic emission testing is demonstrated by applying it to experimental tests such as wave speed measurement and source localization.","PeriodicalId":202479,"journal":{"name":"2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-06-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114801954","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-06-16DOI: 10.1109/TRANSDUCERS.2013.6627224
V. Castro-López, Jorge Elizalde, M. Pacek, E. Hijona, L. Bujanda
The prevalence of autoimmune diseases affect millions of patients worldwide and its incidence has increased over the years. Here we report on the use of a microfluidic device and homemade portable integrated real-time PCR (qPCR) device for the quantification of tumor necrosis factor-α (TNF-α) at the point-of-care (POC). Our device is a disposable cyclic polyolefin (COP)-based microfluidic chip, and the assay is a magnetic bead-based proximity ligation assay. The data presented herein show on-chip TNF-α quantification within the clinically relevant range of 5-100 pg/ml in both buffer and human plasma. Further development could lead to a potential method for monitoring anti-inflammatory therapy.
{"title":"A microfluidic magnetic bead-based proximity ligation assay device for the quantification of TNF-α in human plasma","authors":"V. Castro-López, Jorge Elizalde, M. Pacek, E. Hijona, L. Bujanda","doi":"10.1109/TRANSDUCERS.2013.6627224","DOIUrl":"https://doi.org/10.1109/TRANSDUCERS.2013.6627224","url":null,"abstract":"The prevalence of autoimmune diseases affect millions of patients worldwide and its incidence has increased over the years. Here we report on the use of a microfluidic device and homemade portable integrated real-time PCR (qPCR) device for the quantification of tumor necrosis factor-α (TNF-α) at the point-of-care (POC). Our device is a disposable cyclic polyolefin (COP)-based microfluidic chip, and the assay is a magnetic bead-based proximity ligation assay. The data presented herein show on-chip TNF-α quantification within the clinically relevant range of 5-100 pg/ml in both buffer and human plasma. Further development could lead to a potential method for monitoring anti-inflammatory therapy.","PeriodicalId":202479,"journal":{"name":"2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)","volume":"68 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-06-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114826312","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII)
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