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Wireless 6G Connectivity for Massive Number of Devices and Critical Services 为大量设备和关键服务提供无线 6G 连接
IF 20.6 1区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-11-05 DOI: 10.1109/jproc.2024.3484529
Anders E. Kalor, Giuseppe Durisi, Sinem Coleri, Stefan Parkvall, Wei Yu, Andreas Mueller, Petar Popovski
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引用次数: 0
TechRxiv TechRxiv
IF 23.2 1区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-29 DOI: 10.1109/JPROC.2024.3481751
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引用次数: 0
The Road to 6G: Driving the Next Wave of Connectivity—Part I 通往 6G:推动下一波连接浪潮--第一部分
IF 23.2 1区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-29 DOI: 10.1109/JPROC.2024.3475891
Mohamed-Slim Alouini;Emil Björnson;Meixia Tao;Yasamin Mostofi
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引用次数: 0
Future Special Issues/Special Sections of the Proceedings 论文集》未来的特刊/专栏
IF 23.2 1区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-29 DOI: 10.1109/JPROC.2024.3477809
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引用次数: 0
Proceedings of the IEEE Publication Information 电气和电子工程师学会论文集》出版信息
IF 23.2 1区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-29 DOI: 10.1109/JPROC.2024.3477794
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引用次数: 0
IEEE Connects You to a Universe of Information IEEE 将您与信息世界连接起来
IF 23.2 1区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-29 DOI: 10.1109/JPROC.2024.3481749
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引用次数: 0
IEEE Membership IEEE 会员
IF 23.2 1区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-29 DOI: 10.1109/JPROC.2024.3477798
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引用次数: 0
Proceedings of the IEEE: Stay Informed. Become Inspired. 电气和电子工程师学会论文集》:保持信息灵通。激发灵感。
IF 23.2 1区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-29 DOI: 10.1109/JPROC.2024.3477800
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引用次数: 0
A Review of Multimaterial Additively Manufactured Electronics and 4-D Printing/Origami Shape-Memory Devices: Design, Fabrication, and Implementation 多材料增材制造电子器件和四维打印/原形记忆器件综述:设计、制造和实现
IF 23.2 1区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-23 DOI: 10.1109/JPROC.2024.3471849
Yang Yang;Zhiwei Yin;Xuyi Zhu;Hani Al Jamal;Xiaojing Lv;Kexin Hu;Marvin Joshi;Nathan Wille;Mengze Li;Bing Zhang;Zhen Luo;Shlomo Magdassi;Manos Tentzeris
Emerging additive manufacturing (AM) technologies, specifically additively manufactured electronics (AME), 4-D printing, and origami, are reshaping the design capabilities and functionalities of contemporary electronic devices. Cutting-edge 3-D/4-D printing technologies facilitate the prototyping and realization of complex electronic functions that are challenging to conventional methods. This article provides a comprehensive overview of the evolving techniques in AME, 4-D printing, and origami, employing multimaterials (conductive and dielectric materials) and shape-memory materials (SMMs) to fabricate functional electronic components and devices. Additionally, the overview delves into the state-of-the-art AME and 4-D-printed electronic components across diverse fields, including biomedical electronics, space engineering, and the advancements in the next-generation wireless communications and sensing.
新兴的增材制造(AM)技术,特别是增材制造电子设备(AME)、四维打印和折纸,正在重塑当代电子设备的设计能力和功能。尖端的三维/四维打印技术为复杂电子功能的原型设计和实现提供了便利,而这些功能对传统方法来说具有挑战性。本文全面概述了不断发展的 AME、4-D 打印和折纸技术,这些技术采用多材料(导电和介电材料)和形状记忆材料 (SMM) 制造功能电子元件和设备。此外,该概览还深入探讨了最先进的 AME 和 4-D 印刷电子元件,涉及多个领域,包括生物医学电子学、空间工程以及下一代无线通信和传感技术的发展。
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引用次数: 0
The Road to Next-Generation Multiple Access: A 50-Year Tutorial Review 通往下一代多址接入之路:50 年教程回顾
IF 23.2 1区 计算机科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-10-22 DOI: 10.1109/JPROC.2024.3476675
Yuanwei Liu;Chongjun Ouyang;Zhiguo Ding;Robert Schober
The evolution of wireless communications has been significantly influenced by remarkable advancements in multiple access (MA) technologies over the past five decades, shaping the landscape of modern connectivity. Within this context, a comprehensive tutorial review is presented, focusing on representative MA techniques developed over the past 50 years. The following areas are explored: 1) the foundational principles and information-theoretic capacity limits of power-domain nonorthogonal multiple access (NOMA) are characterized, along with its extension to multiple-input multiple-output (MIMO)-NOMA; 2) several MA transmission schemes exploiting the spatial domain are investigated, encompassing both conventional space-division multiple access (SDMA)/MIMO-NOMA systems and near-field MA systems utilizing spherical-wave propagation models; 3) application of NOMA to integrated sensing and communications (ISAC) systems is studied. This includes an introduction to typical NOMA-based downlink (DL)/uplink (UL) ISAC frameworks, followed by an evaluation of their performance limits using a mutual information (MI)-based analytical framework; and 4) major issues and research opportunities associated with the integration of MA with other emerging technologies are identified to facilitate MA in the next-generation networks, i.e., next-generation multiple access (NGMA). Throughout this article, promising directions are highlighted to inspire future research endeavors in the realm of MA and NGMA.
在过去的50年里,无线通信的发展受到了多址(MA)技术的显著进步的显著影响,塑造了现代连接的格局。在此背景下,本文提出了一份全面的教程综述,重点介绍了过去50年来发展起来的具有代表性的MA技术。研究了功率域非正交多址(NOMA)的基本原理和信息论容量限制,并将其扩展到多输入多输出(MIMO)-NOMA;2)研究了几种利用空间域的毫米波传输方案,包括传统的空分多址(SDMA)/MIMO-NOMA系统和利用球波传播模型的近场毫米波传输系统;3)研究了NOMA在集成传感与通信(ISAC)系统中的应用。这包括介绍典型的基于noma的下行链路(DL)/上行链路(UL) ISAC框架,然后使用基于互信息(MI)的分析框架评估其性能限制;4)确定了与MA与其他新兴技术集成相关的主要问题和研究机会,以促进下一代网络中的MA,即下一代多址(NGMA)。在这篇文章中,强调了有希望的方向,以激励未来在MA和NGMA领域的研究努力。
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引用次数: 0
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