Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889603
Wei Zhang, Rui Mi, V. Khilkevich
This paper explores the possibility to create 3D printed multilayer electromagnetic absorbers. The proposed design is similar to the thin-film filters used in optics and consists of interleaving high and low permittivity layers. Based on transmission line theory, the multilayer absorber can be designed in a circuit simulator. Analytical equations, circuit simulations, and measurements are used to analyze and validate the designed absorber. Multilayer absorbers based on 3D printed material can be an inexpensive option for engineering usage with great design flexibility and fast fabrication.
{"title":"3D Printed Multilayer Microwave Absorber","authors":"Wei Zhang, Rui Mi, V. Khilkevich","doi":"10.1109/EMCSI39492.2022.9889603","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889603","url":null,"abstract":"This paper explores the possibility to create 3D printed multilayer electromagnetic absorbers. The proposed design is similar to the thin-film filters used in optics and consists of interleaving high and low permittivity layers. Based on transmission line theory, the multilayer absorber can be designed in a circuit simulator. Analytical equations, circuit simulations, and measurements are used to analyze and validate the designed absorber. Multilayer absorbers based on 3D printed material can be an inexpensive option for engineering usage with great design flexibility and fast fabrication.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123551652","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889513
Yang Wu, Wenwu Wang, Y. Ye, Yinglei Ren, M. Leddige, X. Ye
Differential stripline traces often need to be routed close to switching voltage regulators and their power delivery network for today's high-density designs. To study the risk of the noise coupling, this paper offers a comprehensive discussion on noise coupling mechanisms. It classifies noise sources, analyzes coupling mechanisms of each source and states possible impacts. The coupling mechanisms are explained and verified by simulation data, measurement results and a new proposed fitting model.
{"title":"Analysis of Noise Coupling from Switching Voltage Regulator and Power Distribution Network to Differential Stripline Traces","authors":"Yang Wu, Wenwu Wang, Y. Ye, Yinglei Ren, M. Leddige, X. Ye","doi":"10.1109/EMCSI39492.2022.9889513","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889513","url":null,"abstract":"Differential stripline traces often need to be routed close to switching voltage regulators and their power delivery network for today's high-density designs. To study the risk of the noise coupling, this paper offers a comprehensive discussion on noise coupling mechanisms. It classifies noise sources, analyzes coupling mechanisms of each source and states possible impacts. The coupling mechanisms are explained and verified by simulation data, measurement results and a new proposed fitting model.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129806509","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889355
Kaisheng Hu
PCB material parameters (Dk, Df and surface roughness) are key factors for signal integrity analysis. By using the parameters within vendor's datasheets directly, simulation result always have big offset compared with lab measurement result due to different production variations. To improve the accuracy of simulation and guarantee a design to be successful for the first-time, one test coupon board is designed, fabricated, and measured. PCB laminate parameters are extracted based on lab measurements instead of datasheet values. With the extracted parameters and same stack up under same factory production process, high-speed channel simulation can predict transmission line & RF transition's performance on real PCB products with reliable simulation accuracy up to 50 GHz.
{"title":"PCB parameter extraction for signal integrity modeling","authors":"Kaisheng Hu","doi":"10.1109/EMCSI39492.2022.9889355","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889355","url":null,"abstract":"PCB material parameters (Dk, Df and surface roughness) are key factors for signal integrity analysis. By using the parameters within vendor's datasheets directly, simulation result always have big offset compared with lab measurement result due to different production variations. To improve the accuracy of simulation and guarantee a design to be successful for the first-time, one test coupon board is designed, fabricated, and measured. PCB laminate parameters are extracted based on lab measurements instead of datasheet values. With the extracted parameters and same stack up under same factory production process, high-speed channel simulation can predict transmission line & RF transition's performance on real PCB products with reliable simulation accuracy up to 50 GHz.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131471757","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889623
R. Achatz, Charles Dietlein, Michael Cotton
This paper describes a new National Telecommunications and Information Administration (NTIA) effort focused on the development of methods to determine appropriate interference protection criteria (IPC) as a means to resolve contention around spectrum sharing proposals being considered by NTIA and Federal Communications Commission (FCC).
{"title":"Interference Protection Criteria for Realistic Channel Conditions","authors":"R. Achatz, Charles Dietlein, Michael Cotton","doi":"10.1109/EMCSI39492.2022.9889623","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889623","url":null,"abstract":"This paper describes a new National Telecommunications and Information Administration (NTIA) effort focused on the development of methods to determine appropriate interference protection criteria (IPC) as a means to resolve contention around spectrum sharing proposals being considered by NTIA and Federal Communications Commission (FCC).","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"92 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123778255","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.10050217
Julia Sunderland, J. Sootsman
Electrically conductive silicones are advanced elastomeric solutions for shielding, grounding, and bonding of electronic components such as automotive, communication and consumer electronics. The tunability of the electrical and mechanical performance of these silicone composites offers unique solutions to demanding electronic applications. Dispensable silicones allow for application onto challenging module geometries and greater module design freedom. A novel heat curable adhesive presented herein was analyzed and evaluated for electrical, mechanical, and thermal aging stability performance.
{"title":"Electrically Conductive Silicones as Elastomeric Solutions for EMI Applications","authors":"Julia Sunderland, J. Sootsman","doi":"10.1109/EMCSI39492.2022.10050217","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.10050217","url":null,"abstract":"Electrically conductive silicones are advanced elastomeric solutions for shielding, grounding, and bonding of electronic components such as automotive, communication and consumer electronics. The tunability of the electrical and mechanical performance of these silicone composites offers unique solutions to demanding electronic applications. Dispensable silicones allow for application onto challenging module geometries and greater module design freedom. A novel heat curable adhesive presented herein was analyzed and evaluated for electrical, mechanical, and thermal aging stability performance.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127546054","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.10050247
Jinho Kim, S. Moon, Jihyun Lee, Seonha Lee, Hyun-Wook Lim
In this work, the eight cases of independently designed flexible printed circuit (FPC) for a large-size and high-resolution liquid crystal display (LCD) TV module were analyzed in a perspective of signal integrity (SI) by comparing the eye-opening simulation results from the measured channel models. Although the case of two-layer FPC with a ground plane has advantages in terms of impedance matching and crosstalk mitigation, the case of single-layer FPC was found to have better SI performance than the two-layer FPC as long as crosstalk is properly suppressed by optimizing the layout design even if the impedance matching is not perfectly satisfied.
{"title":"FPC Design Guidelines for Enabling High-Speed Intra-Panel Interface in Large-Size LCD TVs","authors":"Jinho Kim, S. Moon, Jihyun Lee, Seonha Lee, Hyun-Wook Lim","doi":"10.1109/EMCSI39492.2022.10050247","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.10050247","url":null,"abstract":"In this work, the eight cases of independently designed flexible printed circuit (FPC) for a large-size and high-resolution liquid crystal display (LCD) TV module were analyzed in a perspective of signal integrity (SI) by comparing the eye-opening simulation results from the measured channel models. Although the case of two-layer FPC with a ground plane has advantages in terms of impedance matching and crosstalk mitigation, the case of single-layer FPC was found to have better SI performance than the two-layer FPC as long as crosstalk is properly suppressed by optimizing the layout design even if the impedance matching is not perfectly satisfied.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"141 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127554467","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
As the signaling speeds continue to increase, main-taining Signal Integrity (SI) for the complete customer design space is a huge challenge. These constraints, along with the limitations of traditional methods of design space inclusion and channel behavior prediction pose significant risk to system design. Specific focus is needed on design space utilization techniques used for factoring in platform variability. Interfaces like PCIe Gen5/Gen6/Gen4 etc. exhibit higher order behaviors that current prediction algorithm like Response Surface Method (RSM) simply cannot model. This leads to inaccurate system behavior understanding and results in unreliable platform design recommendations. To minimize design risk and achieve highly reliable scaling of Platform Design Guide (PDG) solution, this paper discusses the implementation of an Artificial Intelligence (AI) based methodology to cover complete design space and predict higher order system behaviors with high accuracy. The goal is to achieve a model with at least 90 % R square and maximum 5% of result range Root Mean Square Error (RMSE). Current SI method of Design of Experiments (DOE) creation and results prediction consists of creating a combined RSM type DOE table and fitting it with second order RSM modelling in JMP as shown in Fig.2(a). It has limitations since RSM uses only three variable levels therefore doesn’t cover the entire design space. It can only model up to second order system behavior. These issues can be addressed using proposed AI based methodology which effectively captures the complete design variance using space filling algorithm shown in Fig.2(b). Paired with this, various AI based algorithms are explored for advanced SI results prediction. These techniques have been encapsulated into an AI based tool which supports automatic DOE creation and predicts the system behavior post simulation in a SINGLE ITERATION. This helps reduce manual interventions and improve efficiency along with highly desirable R square and RMSE values.
随着信号传输速度的不断提高，维护整个客户设计空间的信号完整性(SI)是一个巨大的挑战。这些约束，以及传统设计空间包容和渠道行为预测方法的局限性，给系统设计带来了重大风险。需要特别关注用于考虑平台可变性的设计空间利用技术。像PCIe Gen5/Gen6/Gen4等接口表现出更高阶的行为，而当前的预测算法(如响应面法(RSM))根本无法建模。这将导致不准确的系统行为理解，并导致不可靠的平台设计建议。为了最大限度地降低设计风险并实现平台设计指南(PDG)解决方案的高可靠扩展，本文讨论了基于人工智能(AI)的方法的实现，以覆盖完整的设计空间并高精度地预测高阶系统行为。目标是实现一个至少具有90% R平方和最大5%结果范围均方根误差(RMSE)的模型。目前的SI实验设计(Design of Experiments, DOE)创建和结果预测方法是创建一个组合的RSM型DOE表，并在JMP中使用二阶RSM建模进行拟合，如图2(a)所示。它有局限性，因为RSM只使用三个可变级别，因此不能覆盖整个设计空间。它只能模拟到二阶系统的行为。这些问题可以使用提出的基于人工智能的方法来解决，该方法使用图2(b)所示的空间填充算法有效地捕获完整的设计方差。与此相结合，探索了各种基于AI的高级SI结果预测算法。这些技术已被封装到一个基于AI的工具中，该工具支持自动创建DOE，并在一次迭代中预测系统模拟后的行为。这有助于减少人工干预，并提高效率以及非常理想的R平方和RMSE值。
{"title":"Artificial Intelligence based advanced Signal Integrity prediction","authors":"Prerna, Nithya Ramalingam, Zaman Zaid Mulla, Archana Ganeshan, Ranjul Balakrishnan, Anoop Karunan","doi":"10.1109/EMCSI39492.2022.10050221","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.10050221","url":null,"abstract":"As the signaling speeds continue to increase, main-taining Signal Integrity (SI) for the complete customer design space is a huge challenge. These constraints, along with the limitations of traditional methods of design space inclusion and channel behavior prediction pose significant risk to system design. Specific focus is needed on design space utilization techniques used for factoring in platform variability. Interfaces like PCIe Gen5/Gen6/Gen4 etc. exhibit higher order behaviors that current prediction algorithm like Response Surface Method (RSM) simply cannot model. This leads to inaccurate system behavior understanding and results in unreliable platform design recommendations. To minimize design risk and achieve highly reliable scaling of Platform Design Guide (PDG) solution, this paper discusses the implementation of an Artificial Intelligence (AI) based methodology to cover complete design space and predict higher order system behaviors with high accuracy. The goal is to achieve a model with at least 90 % R square and maximum 5% of result range Root Mean Square Error (RMSE). Current SI method of Design of Experiments (DOE) creation and results prediction consists of creating a combined RSM type DOE table and fitting it with second order RSM modelling in JMP as shown in Fig.2(a). It has limitations since RSM uses only three variable levels therefore doesn’t cover the entire design space. It can only model up to second order system behavior. These issues can be addressed using proposed AI based methodology which effectively captures the complete design variance using space filling algorithm shown in Fig.2(b). Paired with this, various AI based algorithms are explored for advanced SI results prediction. These techniques have been encapsulated into an AI based tool which supports automatic DOE creation and predicts the system behavior post simulation in a SINGLE ITERATION. This helps reduce manual interventions and improve efficiency along with highly desirable R square and RMSE values.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132662108","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889506
R. Johnk, J. Lemmon
This paper examines the estimation of the local mean voltage of a radio signal in a Rayleigh fast-fading environment. We focus on the statistical uncertainties of local voltage averages obtained by both integrating the voltage envelope of a specified spatial interval and averaging over a set of discrete spatial samples. We derive new analytical expressions of the variances of both discrete and continuous averaging for selected spatial intervals. We also give recommendations for averaging intervals and sample spacing to achieve a ±1 dB spreading factor. We provide important new results for the variance of discrete averaging with new insight gained on separations required for uncorrelated samples. One significant finding of this work is that criteria in the published literature are incorrect and underestimate the variance. We support these findings with an experimental validation of our variance expressions using laboratory fading simulator measurements and sample statistics.
{"title":"Estimating the Local Mean Voltage of a Radio Signal in a Mobile Channel","authors":"R. Johnk, J. Lemmon","doi":"10.1109/EMCSI39492.2022.9889506","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889506","url":null,"abstract":"This paper examines the estimation of the local mean voltage of a radio signal in a Rayleigh fast-fading environment. We focus on the statistical uncertainties of local voltage averages obtained by both integrating the voltage envelope of a specified spatial interval and averaging over a set of discrete spatial samples. We derive new analytical expressions of the variances of both discrete and continuous averaging for selected spatial intervals. We also give recommendations for averaging intervals and sample spacing to achieve a ±1 dB spreading factor. We provide important new results for the variance of discrete averaging with new insight gained on separations required for uncorrelated samples. One significant finding of this work is that criteria in the published literature are incorrect and underestimate the variance. We support these findings with an experimental validation of our variance expressions using laboratory fading simulator measurements and sample statistics.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130697367","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889417
J. G. Kraemer
This paper examines the possibility of replacing the DO-160 chattering relay susceptibility test with MIL-STD-461G CS115. The background of both tests is presented along with the results of a comprehensive test campaign involving 12 different aerospace representative cables. Conclusions and recommendations centered on using CS115 as a replacement for the chattering relay test are presented.
{"title":"The Prospects of Replacing Chattering Relay Susceptibility Test with MIL-STD-461G CS115","authors":"J. G. Kraemer","doi":"10.1109/EMCSI39492.2022.9889417","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889417","url":null,"abstract":"This paper examines the possibility of replacing the DO-160 chattering relay susceptibility test with MIL-STD-461G CS115. The background of both tests is presented along with the results of a comprehensive test campaign involving 12 different aerospace representative cables. Conclusions and recommendations centered on using CS115 as a replacement for the chattering relay test are presented.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131281754","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889371
Á. Ojeda-Rodríguez, C. Dominguez-Palacios, J. Bernal-Méndez, M. A. Martín-Prats
This work proposes a quick and simple method to obtain the parameters of a circuit model of a common mode choke with nanocrystalline core. Common mode chokes with nanocrystalline cores, unlike chokes with cores made of ferrite or iron powder, exhibit a strong dependence with the frequency of its magnetic permeability, which makes it difficult to find a simple circuit model able to account for the response of the choke to both common mode and differential mode signals in a wide frequency range. We propose a circuit model along with a simple method to obtain the parameters of the model, and we demonstrate that the circuit model of the choke accounts for the response of the choke within a frequency range that encompasses the frequencies where most electromagnetic compatibility regulations limit the conducted emissions of electronic devices. To validate the proposed model, different commercial common mode chokes have been measured and the predicted performance of the model has been compared with the measured responses. We have checked that in most cases the proposed approach yields accurate models of nanocrystalline common mode chokes up to 50 MHz.
{"title":"Simple and Accurate Characterization of Nanocrystalline Common Mode Chokes","authors":"Á. Ojeda-Rodríguez, C. Dominguez-Palacios, J. Bernal-Méndez, M. A. Martín-Prats","doi":"10.1109/EMCSI39492.2022.9889371","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889371","url":null,"abstract":"This work proposes a quick and simple method to obtain the parameters of a circuit model of a common mode choke with nanocrystalline core. Common mode chokes with nanocrystalline cores, unlike chokes with cores made of ferrite or iron powder, exhibit a strong dependence with the frequency of its magnetic permeability, which makes it difficult to find a simple circuit model able to account for the response of the choke to both common mode and differential mode signals in a wide frequency range. We propose a circuit model along with a simple method to obtain the parameters of the model, and we demonstrate that the circuit model of the choke accounts for the response of the choke within a frequency range that encompasses the frequencies where most electromagnetic compatibility regulations limit the conducted emissions of electronic devices. To validate the proposed model, different commercial common mode chokes have been measured and the predicted performance of the model has been compared with the measured responses. We have checked that in most cases the proposed approach yields accurate models of nanocrystalline common mode chokes up to 50 MHz.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128466623","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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