Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889487
S. Kovár, Iva Kavankova, M. Renzler, Jan Valouch, T. Kadavy, D. Mair
The paper deals with the shielding enclosure design using evolutionary algorithms without predetermined conditions. The designed shield consists of an array of elements that rep-resent conductive or non-conductive parts. The expected output is to design a shield with sufficient balance between shielding effectiveness and transparency in systems that need an optical line of sight. The wide frequency transparent shielding design is a complex task that researchers so far mostly solved by composite polymers. The authors use a different approach using traditional conductive material and element folding technology. Element assembly is performed by an evolutionary algorithm that decides the properties of the material used and creates the optimal structure to achieve the desired results. The paper describes the design concept for planar shielding with metaheuristics and the preliminary results.
{"title":"Evolutionary Algorithms as a Tool for Shielding Design","authors":"S. Kovár, Iva Kavankova, M. Renzler, Jan Valouch, T. Kadavy, D. Mair","doi":"10.1109/EMCSI39492.2022.9889487","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889487","url":null,"abstract":"The paper deals with the shielding enclosure design using evolutionary algorithms without predetermined conditions. The designed shield consists of an array of elements that rep-resent conductive or non-conductive parts. The expected output is to design a shield with sufficient balance between shielding effectiveness and transparency in systems that need an optical line of sight. The wide frequency transparent shielding design is a complex task that researchers so far mostly solved by composite polymers. The authors use a different approach using traditional conductive material and element folding technology. Element assembly is performed by an evolutionary algorithm that decides the properties of the material used and creates the optimal structure to achieve the desired results. The paper describes the design concept for planar shielding with metaheuristics and the preliminary results.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"126 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127397087","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889338
Shengxuan Xia, James D. Hunter, Aaron Harmon, M. Hamdalla, Ahmed M. Hassan, C. Hwang, V. Khilkevich, D. Beetner
The radio frequency (RF) coupling to electronic devices impacts their EMC performance. The functionalities of a working electronic device may be disrupted when the electromagnetic (EM) coupling reaches a certain level. Studies of the EM coupling to printed circuit boards (PCBs) are therefore essential for RF susceptibility and EMC purposes. For decades, researchers focused on the analytical modeling of EM coupling to transmission lines. However, when it comes to more realistic PCBs the analysis usually still relies heavily on full-wave simulations because of the complexity of the structures and the lack of analytical solutions. Using a traditional full-wave modeling approach, however, could take hours to investigate the EM coupling from the external plane wave to the structure for one incident angle of arrival and polarization. In this paper, we present a methodology using reciprocity that allows for rapid estimation of the voltage induced in the terminations for multiple incident angles of the incoming plane wave and load values based on just one full-wave simulation. This reciprocity-based method is combined with a segmentation technique to enable the capability of studying the coupling to more realistic PCBs. For the cases studied here, estimates could be found in minutes using this approach rather than hours using a full-wave simulation. Estimates were within 2–3 dB of estimates using full-wave simulations for a simple trace structure. Accuracy was not as good for individual angles of arrival of an incident RF wave to a complicated structure including two integrated circuit (IC) packages connected by a trace, but statistical estimates of coupling were within 2–3 dB.
{"title":"A Fast Cascading Method for Predicting the Coupling from External Plane Waves to PCBs","authors":"Shengxuan Xia, James D. Hunter, Aaron Harmon, M. Hamdalla, Ahmed M. Hassan, C. Hwang, V. Khilkevich, D. Beetner","doi":"10.1109/EMCSI39492.2022.9889338","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889338","url":null,"abstract":"The radio frequency (RF) coupling to electronic devices impacts their EMC performance. The functionalities of a working electronic device may be disrupted when the electromagnetic (EM) coupling reaches a certain level. Studies of the EM coupling to printed circuit boards (PCBs) are therefore essential for RF susceptibility and EMC purposes. For decades, researchers focused on the analytical modeling of EM coupling to transmission lines. However, when it comes to more realistic PCBs the analysis usually still relies heavily on full-wave simulations because of the complexity of the structures and the lack of analytical solutions. Using a traditional full-wave modeling approach, however, could take hours to investigate the EM coupling from the external plane wave to the structure for one incident angle of arrival and polarization. In this paper, we present a methodology using reciprocity that allows for rapid estimation of the voltage induced in the terminations for multiple incident angles of the incoming plane wave and load values based on just one full-wave simulation. This reciprocity-based method is combined with a segmentation technique to enable the capability of studying the coupling to more realistic PCBs. For the cases studied here, estimates could be found in minutes using this approach rather than hours using a full-wave simulation. Estimates were within 2–3 dB of estimates using full-wave simulations for a simple trace structure. Accuracy was not as good for individual angles of arrival of an incident RF wave to a complicated structure including two integrated circuit (IC) packages connected by a trace, but statistical estimates of coupling were within 2–3 dB.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128788642","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889642
Jun-Bae Kim, Chang-Ki Kwon, Sangwook Park, Y. Sung, Jeong-Don Ihm, Wooyoung Kim, Jungho Jin, Sang-Jun Hwang, C. Yoo, J. Choi, Jingook Kim
For mobile DRAM, low EMI (Electro-Magnetic Interference) chip architecture is highly required. So, mobile DRAM's EMI characteristic using center-placed pads and edge-placed pads has been investigated. Our near-field scan measurement results show that the peak H-field magnitude of LPDDR5 using edge-placed pads is lower by 11.5 dB than that of the other one using center-placed pads. Furthermore, when comparing our measurement results to our simulation results showing that the power plane resonance of PoP (Package-on-Package) affects low frequency EMI radiation significantly, we have also noticed reasonable agreement on the peak H-field magnitude trend.
{"title":"A Low EMI characteristic of LPDDR5 SDRAM with Edge-placed PADs and Short Re-Distribution Lines","authors":"Jun-Bae Kim, Chang-Ki Kwon, Sangwook Park, Y. Sung, Jeong-Don Ihm, Wooyoung Kim, Jungho Jin, Sang-Jun Hwang, C. Yoo, J. Choi, Jingook Kim","doi":"10.1109/EMCSI39492.2022.9889642","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889642","url":null,"abstract":"For mobile DRAM, low EMI (Electro-Magnetic Interference) chip architecture is highly required. So, mobile DRAM's EMI characteristic using center-placed pads and edge-placed pads has been investigated. Our near-field scan measurement results show that the peak H-field magnitude of LPDDR5 using edge-placed pads is lower by 11.5 dB than that of the other one using center-placed pads. Furthermore, when comparing our measurement results to our simulation results showing that the power plane resonance of PoP (Package-on-Package) affects low frequency EMI radiation significantly, we have also noticed reasonable agreement on the peak H-field magnitude trend.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129851271","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889459
V. Havryliuk
The problem considered in the work is related to ensuring the electromagnetic compatibility of track circuits with a parallel traction network. To evaluate the influence of interference from the alternating current traction network on the operation of the track circuits a simplified model has been developed. The model is based on the well-known multiconductor transmission line method, however, its use for modeling a traction network is difficult due to the longitudinal structural inhomogeneity of the traction system. The simplification proposed in the work assumes that the track circuit equipment connected to the rails insignificantly influence on the distribution of currents in traction network conductors. These assumptions make it possible to neglect the equipment of track circuits at the first stage of modeling, which greatly simplifies the equivalent circuit of the traction network, and allows us to represent it in the form of several homogeneous sections of multiconductor transmission lines with rolling stock units between them. Simulation of induced alternating current interference in the rails of the track with direct current traction is carried out at the second stage, taking into account the design features and electrical parameters of track circuits, as well as specific values of rail-to-ground conductance and earth conductivity, using the values of the currents in the traction network conductors determined in the first stage.
{"title":"Model of the Influence of Interference of a 25 kV 50 Hz Traction Network on Parallel 50 Hz Track Circuits","authors":"V. Havryliuk","doi":"10.1109/EMCSI39492.2022.9889459","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889459","url":null,"abstract":"The problem considered in the work is related to ensuring the electromagnetic compatibility of track circuits with a parallel traction network. To evaluate the influence of interference from the alternating current traction network on the operation of the track circuits a simplified model has been developed. The model is based on the well-known multiconductor transmission line method, however, its use for modeling a traction network is difficult due to the longitudinal structural inhomogeneity of the traction system. The simplification proposed in the work assumes that the track circuit equipment connected to the rails insignificantly influence on the distribution of currents in traction network conductors. These assumptions make it possible to neglect the equipment of track circuits at the first stage of modeling, which greatly simplifies the equivalent circuit of the traction network, and allows us to represent it in the form of several homogeneous sections of multiconductor transmission lines with rolling stock units between them. Simulation of induced alternating current interference in the rails of the track with direct current traction is carried out at the second stage, taking into account the design features and electrical parameters of track circuits, as well as specific values of rail-to-ground conductance and earth conductivity, using the values of the currents in the traction network conductors determined in the first stage.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"90 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129027934","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889596
W. Elkman, C. Scoby, Umer Qureshi, Andrew Shirali
This paper describes the SEE (single event effects) design verification approach and proton beam verification test results for the Virgin Orbit LauncherOne (L1) two stage LOX/RP-1 launch system, capable of deploying payloads up to 300kg to 500km Sun Synchronous Orbit (SSO), and deploying payloads up to 500kg to 200km Low Earth Orbit (LEO). [9] Describes the EMI/EMC Control Program tailored from RTCA-DO-160F and MIL-STD-461F. [10] Reports the Electromagnetic Compatibility (EMC) verification procedures and results for LauncherOne,.
{"title":"Single Event Effects Test Verification for the Virgin Orbit LauncherOne Vehicle","authors":"W. Elkman, C. Scoby, Umer Qureshi, Andrew Shirali","doi":"10.1109/EMCSI39492.2022.9889596","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889596","url":null,"abstract":"This paper describes the SEE (single event effects) design verification approach and proton beam verification test results for the Virgin Orbit LauncherOne (L1) two stage LOX/RP-1 launch system, capable of deploying payloads up to 300kg to 500km Sun Synchronous Orbit (SSO), and deploying payloads up to 500kg to 200km Low Earth Orbit (LEO). [9] Describes the EMI/EMC Control Program tailored from RTCA-DO-160F and MIL-STD-461F. [10] Reports the Electromagnetic Compatibility (EMC) verification procedures and results for LauncherOne,.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127599339","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889558
Yuchu He, Neil Harris, Hanfeng Wang
Wireless earbud is the most sold wearable type in the consumer electronics market. As wireless earbuds offer more functionalities, the increased complexity and integration may introduce undesirable coupling between different components. One of the undesirable coupling is the magnetic coupling between the earbud main logic board (MLB) and the speaker coil. The low frequency current ripples on the MLB power rail may induce current with acoustic frequency components on the speak coil and lead to unpleasant audible noise. In this paper, the magnetic field generated by an earbud MLB is investigated through simulation with 3D FEM solvers and measurement with a low frequency H-field probe.
{"title":"Investigation of PCB generated Magnetic Field as an Acoustic Noise Source onWearable Devices","authors":"Yuchu He, Neil Harris, Hanfeng Wang","doi":"10.1109/EMCSI39492.2022.9889558","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889558","url":null,"abstract":"Wireless earbud is the most sold wearable type in the consumer electronics market. As wireless earbuds offer more functionalities, the increased complexity and integration may introduce undesirable coupling between different components. One of the undesirable coupling is the magnetic coupling between the earbud main logic board (MLB) and the speaker coil. The low frequency current ripples on the MLB power rail may induce current with acoustic frequency components on the speak coil and lead to unpleasant audible noise. In this paper, the magnetic field generated by an earbud MLB is investigated through simulation with 3D FEM solvers and measurement with a low frequency H-field probe.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"38 23","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120852293","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889495
N. Kuwabara, T. Matsushima, Y. Fukumoto
Common-mode choke coil (CMC) is used in vehicles and electronic devices to improve electromagnetic compatibility (EMC), and the analysis of the CMC effect is essential to improve the design quality of EMC. In this paper, the suppression effect of CMC for the common-mode (CM) signal converted from the differential-mode (DM) signal is analyzed using a chain-parameter matrix. The chain-parameter matrix of the CMC was obtained from the SPICE model and the measured data. And then, the amount of conversion level from DM signal to CM signal was calculated using the chain-parameter matrix of the signal source, the termination, the cable, and the CMC. The CM signal level was calculated for the shielded twisted pair cable with one pair considering imbalances of the signal source, the termination, the cable, and the CMC. The calculation value was compared to the measurement value due to confirm the validity of the method, and the calculated results were in close agreement with the measurement value. The investigation results showed that we should pay attention to the CMC imbalance when the cable is well balanced. In addition, the results suggested that the CMC should be prepared at both ends of the cable to reduce the current outside the shield.
{"title":"Analysis of CM-Signal Suppression Effect from DM Signal by Common-Mode Choke Coil Using Chain-Parameter Matrix","authors":"N. Kuwabara, T. Matsushima, Y. Fukumoto","doi":"10.1109/EMCSI39492.2022.9889495","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889495","url":null,"abstract":"Common-mode choke coil (CMC) is used in vehicles and electronic devices to improve electromagnetic compatibility (EMC), and the analysis of the CMC effect is essential to improve the design quality of EMC. In this paper, the suppression effect of CMC for the common-mode (CM) signal converted from the differential-mode (DM) signal is analyzed using a chain-parameter matrix. The chain-parameter matrix of the CMC was obtained from the SPICE model and the measured data. And then, the amount of conversion level from DM signal to CM signal was calculated using the chain-parameter matrix of the signal source, the termination, the cable, and the CMC. The CM signal level was calculated for the shielded twisted pair cable with one pair considering imbalances of the signal source, the termination, the cable, and the CMC. The calculation value was compared to the measurement value due to confirm the validity of the method, and the calculated results were in close agreement with the measurement value. The investigation results showed that we should pay attention to the CMC imbalance when the cable is well balanced. In addition, the results suggested that the CMC should be prepared at both ends of the cable to reduce the current outside the shield.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121519304","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889637
Meiqi Xia, Ran Guo, Jianfeng Zheng, Ji Chen
Tissue-reduced virtual family models are developed for the RF-induced heating assessment of passive implantable medical devices. The models are developed based on the Gaussian mixture model. The RF-induced heating of four representative passive device systems is evaluated inside the original human models, tissue-reduced human models, and the ASTM phantom at three landmark positions under a 1.5 T MRI system. From the results of these simulations, it is observed that the RF-induced heating from the tissue-reduced virtual family models is highly correlated to that obtained from the original human body models. It demonstrates the feasibility of using tissue-reduced models for the RF-induced heating testing of implantable medical devices.
针对无源植入式医疗器械的射频加热评估，建立了组织简化虚拟家庭模型。这些模型是在高斯混合模型的基础上建立的。在1.5 T MRI系统下，在原始人体模型、组织缩小人体模型和ASTM假体的三个标志性位置评估四种代表性无源装置系统的rf诱导加热。从这些模拟结果中可以观察到，从组织简化的虚拟家族模型中获得的射频诱导加热与从原始人体模型中获得的射频诱导加热高度相关。它证明了使用组织简化模型进行植入式医疗设备的射频诱导加热测试的可行性。
{"title":"RF-induced Heating Evaluation for Passive Device in Tissue-Reduced Virtual Family Models at 1.5 T","authors":"Meiqi Xia, Ran Guo, Jianfeng Zheng, Ji Chen","doi":"10.1109/EMCSI39492.2022.9889637","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889637","url":null,"abstract":"Tissue-reduced virtual family models are developed for the RF-induced heating assessment of passive implantable medical devices. The models are developed based on the Gaussian mixture model. The RF-induced heating of four representative passive device systems is evaluated inside the original human models, tissue-reduced human models, and the ASTM phantom at three landmark positions under a 1.5 T MRI system. From the results of these simulations, it is observed that the RF-induced heating from the tissue-reduced virtual family models is highly correlated to that obtained from the original human body models. It demonstrates the feasibility of using tissue-reduced models for the RF-induced heating testing of implantable medical devices.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124099566","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.10050219
Tao Wang
I/O pin counts have been able to increase significantly thanks to ball grid array (BGA) packages. This I/O pin counts increase brings challenges to break out signals and ensure sufficient shielding effectiveness (SE). Shielding can is often used to enhance the SE of the package but in many devices, conformal sputtering shielding is a better option. This paper presents a method to improve the SE by adding a VSS ground ring structure to the sputtering coat. The simulated results show the proposed structure provides 20 dB more SE compare to the structure without a VSS ground ring.
{"title":"Improve the Shielding Effectiveness of a BGA Package by Using VSS Ring Structure","authors":"Tao Wang","doi":"10.1109/EMCSI39492.2022.10050219","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.10050219","url":null,"abstract":"I/O pin counts have been able to increase significantly thanks to ball grid array (BGA) packages. This I/O pin counts increase brings challenges to break out signals and ensure sufficient shielding effectiveness (SE). Shielding can is often used to enhance the SE of the package but in many devices, conformal sputtering shielding is a better option. This paper presents a method to improve the SE by adding a VSS ground ring structure to the sputtering coat. The simulated results show the proposed structure provides 20 dB more SE compare to the structure without a VSS ground ring.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132492481","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889626
Vasiliki Gkatsi, R. Vogt-Ardatjew, F. Leferink
Due to the on-going changes in modern technologies, deeper investigation of the complex automotive electromagnetic environments is necessary. Since conventional standardized testing methods are lacking characteristics met in real automotive electromagnetic environments, a risk-based electromagnetic compatibility approach can conclude to detection of potential electromagnetic interference threats. A measurement of a real automotive electromagnetic environment is proposed and investigated using two different measurement methods addressing the temporal and spatial variations of the electromagnetic environment. This investigation reveals the complexity of real electromagnetic environments and the difficulty of them being sufficiently described to warrant electromagnetic compatibility due to continuously varying parameters over space, time, and frequency. The random-walk technique is applied and compared with a discrete static measuring technique of acquiring data. Examination of the collected data is made along with discussion on their possible application through statistical tools.
{"title":"On-Site Automotive Environment Measurements for a Risk-based EMC Approach","authors":"Vasiliki Gkatsi, R. Vogt-Ardatjew, F. Leferink","doi":"10.1109/EMCSI39492.2022.9889626","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889626","url":null,"abstract":"Due to the on-going changes in modern technologies, deeper investigation of the complex automotive electromagnetic environments is necessary. Since conventional standardized testing methods are lacking characteristics met in real automotive electromagnetic environments, a risk-based electromagnetic compatibility approach can conclude to detection of potential electromagnetic interference threats. A measurement of a real automotive electromagnetic environment is proposed and investigated using two different measurement methods addressing the temporal and spatial variations of the electromagnetic environment. This investigation reveals the complexity of real electromagnetic environments and the difficulty of them being sufficiently described to warrant electromagnetic compatibility due to continuously varying parameters over space, time, and frequency. The random-walk technique is applied and compared with a discrete static measuring technique of acquiring data. Examination of the collected data is made along with discussion on their possible application through statistical tools.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131244053","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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