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2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)最新文献

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Physics-Based Modeling for Determining Transient Current Flow In Multi-layer PCB PI Designs 多层PCB PI设计中瞬态电流的物理建模
Yifan Ding, M. Doyle, S. Connor, D. Becker, J. Drewniak
A physics-based modeling methodology for determining the transient current flow path in multi-layer PI designs is given in this paper using a commercial board with a complicated structure as an example. Board structure analysis is done first to provide a physical basis of post-layout analytical and equivalent circuit modeling. A match of the PDN impedance between commercial tool simulation, post-layout analytical calculation, and the physics-based equivalent circuit modeling was achieved to support the model for the transient simulation. By analyzing the current response in all the vias, a clear representation of transient current flow across all via segments can be given layer-by-layer. The maximum current density in vertical vias can also be extracted in this process, providing a reference for preventing transient overcurrent design.
本文以具有复杂结构的商业电路板为例,给出了一种确定多层PI设计中瞬态电流流路的物理建模方法。首先进行电路板结构分析,为布局后的分析和等效电路建模提供物理基础。在商用工具仿真、布局后分析计算和基于物理的等效电路建模之间实现了PDN阻抗的匹配,为瞬态仿真模型提供了支持。通过分析所有通孔中的电流响应,可以逐层给出所有通孔段的瞬态电流的清晰表示。在此过程中还可以提取出垂直过孔的最大电流密度,为防止瞬态过流设计提供参考。
{"title":"Physics-Based Modeling for Determining Transient Current Flow In Multi-layer PCB PI Designs","authors":"Yifan Ding, M. Doyle, S. Connor, D. Becker, J. Drewniak","doi":"10.1109/EMCSI39492.2022.9889600","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889600","url":null,"abstract":"A physics-based modeling methodology for determining the transient current flow path in multi-layer PI designs is given in this paper using a commercial board with a complicated structure as an example. Board structure analysis is done first to provide a physical basis of post-layout analytical and equivalent circuit modeling. A match of the PDN impedance between commercial tool simulation, post-layout analytical calculation, and the physics-based equivalent circuit modeling was achieved to support the model for the transient simulation. By analyzing the current response in all the vias, a clear representation of transient current flow across all via segments can be given layer-by-layer. The maximum current density in vertical vias can also be extracted in this process, providing a reference for preventing transient overcurrent design.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129971429","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Development and Evaluation of a CNN-LSTM Architecture based Neural Network for Time Optimization during EMI Measurements 基于CNN-LSTM结构的电磁干扰测量时间优化神经网络的开发与评价
Hussam Elias, Ninovic Perez, H. Hirsch
In this paper, an approach is proposed to find the worst-case positions during the final measurement phase on critical frequencies in electromagnetic interference (EMI) measurements according to 47 CFR § 15.209 by using a developed measurement software and deep neural networks (DNN). Firstly, because of its advantage of incomplete connection, relatively simple model structure and strong data features extraction, a dimensional convolution neural network (1D CNN) was present to predict the positions that meet the maximum radiation emission level. Secondly, a hybrid deep learning neural network framework, that combines CNN with long short term memory(LSTM) was adopted to forecast the worst-case of the high variance emission levels. The DNNs were trained using real EMI measurements for different equipment under test (EUT) in a Semi Anechoic Chamber (SAC) by Cetecom GmbH in Essen, Germany. By predicting the position azimuth of the turntable and the height of the antenna, the required time to carry out the final measurement phase is effectively reduced.
本文提出了一种利用已开发的测量软件和深度神经网络(DNN),根据47 CFR§15.209的规定,在电磁干扰(EMI)测量中,在最后测量阶段的关键频率上找到最坏情况位置的方法。首先,利用一维卷积神经网络(1D CNN)不完全连接、模型结构相对简单、数据特征提取能力强的优点,对满足最大辐射发射水平的位置进行预测;其次,采用CNN与长短期记忆(LSTM)相结合的混合深度学习神经网络框架对高方差发射水平的最坏情况进行预测;dnn在德国埃森的Cetecom GmbH公司的半消声室(SAC)中使用不同被测设备(EUT)的真实EMI测量进行训练。通过预测转台的位置方位和天线的高度,有效地减少了进行最终测量阶段所需的时间。
{"title":"Development and Evaluation of a CNN-LSTM Architecture based Neural Network for Time Optimization during EMI Measurements","authors":"Hussam Elias, Ninovic Perez, H. Hirsch","doi":"10.1109/EMCSI39492.2022.9889470","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889470","url":null,"abstract":"In this paper, an approach is proposed to find the worst-case positions during the final measurement phase on critical frequencies in electromagnetic interference (EMI) measurements according to 47 CFR § 15.209 by using a developed measurement software and deep neural networks (DNN). Firstly, because of its advantage of incomplete connection, relatively simple model structure and strong data features extraction, a dimensional convolution neural network (1D CNN) was present to predict the positions that meet the maximum radiation emission level. Secondly, a hybrid deep learning neural network framework, that combines CNN with long short term memory(LSTM) was adopted to forecast the worst-case of the high variance emission levels. The DNNs were trained using real EMI measurements for different equipment under test (EUT) in a Semi Anechoic Chamber (SAC) by Cetecom GmbH in Essen, Germany. By predicting the position azimuth of the turntable and the height of the antenna, the required time to carry out the final measurement phase is effectively reduced.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116694307","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Study for Improving Signal-to-Noise Ratio Measurement Method in Side-Channel Information Leakage of Cryptographic Hardware 改进加密硬件侧信道信息泄漏信噪比测量方法的研究
K. Iokibe, Masaki Himuro, Y. Toyota
Once the signal-tu-noise ratio (SNR) of the side- channel (SC) leakage trace is known, the intensity of the SC information leakage source inside the integrated circuit (IC) can be identified from measurements carried out outside the IC, SNR observation of SC leakage can also make it possible to set quantitative design targets to achieve the demanded leakage intensity. We discuss an improved method for identifying the SNR of SC leakage traces composed of multiple transient responses of IC switching current. The IC switching current repeatedly occurs as the IC runs the cryptographic operation since the cryptographic algorithm repeats a set of sub-operations. The method was applied to simulated and measured leakage traces to eliminate the effect of transient IC switching current caused before the target sub-operation was processed. As a result, a transient component more extensive than the signal component of side-channel analysis was identified in the decoupling capacitor configuration, where the convergence of the transient response is slow. In addition, the correlation coefficients obtained by the correlation power analysis, a major side-channel analysis method, were plotted as a function of SNR, and the plot of the simulated traces agreed with the theoretical curve. On the other hand, some errors remained in the plot of the measured traces.
一旦知道了侧通道(SC)泄漏道的信噪比(SNR),就可以从集成电路(IC)外部进行的测量中识别出集成电路(IC)内部SC信息泄漏源的强度,对SC泄漏的信噪比观察也可以使设定定量设计目标成为可能,以达到所需的泄漏强度。讨论了一种识别由多个IC开关电流瞬态响应组成的SC漏迹信噪比的改进方法。由于加密算法重复一组子操作,因此当IC运行加密操作时,IC开关电流重复发生。将该方法应用于模拟和测量漏迹,以消除目标子操作处理前瞬态IC开关电流的影响。因此,在去耦电容配置中,发现了比侧信道分析的信号分量更广泛的瞬态分量,其中瞬态响应的收敛速度较慢。此外,利用相关功率分析(一种主要的旁信道分析方法)得到的相关系数作为信噪比的函数进行了绘制,模拟走线图与理论曲线吻合。另一方面,测迹图中也存在一定的误差。
{"title":"A Study for Improving Signal-to-Noise Ratio Measurement Method in Side-Channel Information Leakage of Cryptographic Hardware","authors":"K. Iokibe, Masaki Himuro, Y. Toyota","doi":"10.1109/EMCSI39492.2022.9889660","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889660","url":null,"abstract":"Once the signal-tu-noise ratio (SNR) of the side- channel (SC) leakage trace is known, the intensity of the SC information leakage source inside the integrated circuit (IC) can be identified from measurements carried out outside the IC, SNR observation of SC leakage can also make it possible to set quantitative design targets to achieve the demanded leakage intensity. We discuss an improved method for identifying the SNR of SC leakage traces composed of multiple transient responses of IC switching current. The IC switching current repeatedly occurs as the IC runs the cryptographic operation since the cryptographic algorithm repeats a set of sub-operations. The method was applied to simulated and measured leakage traces to eliminate the effect of transient IC switching current caused before the target sub-operation was processed. As a result, a transient component more extensive than the signal component of side-channel analysis was identified in the decoupling capacitor configuration, where the convergence of the transient response is slow. In addition, the correlation coefficients obtained by the correlation power analysis, a major side-channel analysis method, were plotted as a function of SNR, and the plot of the simulated traces agreed with the theoretical curve. On the other hand, some errors remained in the plot of the measured traces.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117041426","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
On Measuring the Response to Differential Mode Noise of Common Mode Chokes 共模扼流圈对差模噪声响应的测量
Á. Ojeda-Rodríguez, C. Dominguez-Palacios, J. Bernal-Méndez, M. A. Martín-Prats
This work analyzes different techniques to measure the attenuation of differential mode noise provided by common mode chokes. The proposed setups are alternatives to the direct and symmetrical setups described in CISPR-17, which are also investigated in this work. This study is based on a modal analysis of a high-frequency circuit model of the common mode choke that allows for obtaining analytical expressions for the insertion loss of the common mode choke when excited in different setups in terms of the admittances of the modes excited in each setup. This provides additional insight to understand which modes are excited in each setup. We demonstrate that the setups are equivalent at low frequencies and we identify the key differences between them at high frequencies, in particular regarding their different frequencies of resonance. To validate our analysis, we have measured and characterized different commercial common mode chokes, and we have verified that in all the cases the measured transmission coefficients exhibit the behaviour predicted by the theoretical analysis.
本文分析了测量共模扼流圈所提供的差模噪声衰减的不同技术。建议的设置是CISPR-17中描述的直接和对称设置的替代方案,也在本工作中进行了研究。本研究基于对共模扼流圈高频电路模型的模态分析,该模型允许根据每种设置中激励模式的导纳,获得在不同设置中激励时共模扼流圈插入损耗的解析表达式。这为了解每个设置中激发的模式提供了额外的见解。我们证明了这些装置在低频时是等效的,我们确定了它们在高频时的关键区别,特别是关于它们不同的共振频率。为了验证我们的分析,我们对不同的商用共模扼流圈进行了测量和表征,并验证了在所有情况下测量的透射系数都表现出理论分析预测的行为。
{"title":"On Measuring the Response to Differential Mode Noise of Common Mode Chokes","authors":"Á. Ojeda-Rodríguez, C. Dominguez-Palacios, J. Bernal-Méndez, M. A. Martín-Prats","doi":"10.1109/EMCSI39492.2022.9889618","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889618","url":null,"abstract":"This work analyzes different techniques to measure the attenuation of differential mode noise provided by common mode chokes. The proposed setups are alternatives to the direct and symmetrical setups described in CISPR-17, which are also investigated in this work. This study is based on a modal analysis of a high-frequency circuit model of the common mode choke that allows for obtaining analytical expressions for the insertion loss of the common mode choke when excited in different setups in terms of the admittances of the modes excited in each setup. This provides additional insight to understand which modes are excited in each setup. We demonstrate that the setups are equivalent at low frequencies and we identify the key differences between them at high frequencies, in particular regarding their different frequencies of resonance. To validate our analysis, we have measured and characterized different commercial common mode chokes, and we have verified that in all the cases the measured transmission coefficients exhibit the behaviour predicted by the theoretical analysis.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"89 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116184836","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Evaluation of Nonlinear ARX System Identification Technique on Modeling Crosstalk 非线性ARX系统识别技术对串扰建模的评价
M. I. Sudrajat, M. A. Wibisono, H. Loschi, N. Moonen, F. Leferink
Estimating crosstalk appropriately is very important in the process of mitigating electromagnetic interference. This study evaluates a black-box modeling technique named nonlinear autoregressive with exogenous inputs (NARX) on crosstalk modeling application, especially crosstalk due to random pulse width modulation. The model is developed using the input and output data from the measurement as regressor inputs. For validation, the mean squared error of this model is calculated by comparing the model output with the real measurement output. For evaluation, the model performance also was compared to a Spice-based SACAMOS model. Although less flexible than the Spice model, NARX model can represent the signal on the victim cable well with a small mean squared error value.
在减轻电磁干扰的过程中,适当地估计串扰是非常重要的。本研究评估了外源输入非线性自回归(NARX)黑箱建模技术在串扰建模中的应用,特别是随机脉宽调制的串扰。该模型是使用测量的输入和输出数据作为回归输入来开发的。为了验证,通过将模型输出与实际测量输出进行比较,计算该模型的均方误差。为了评估,还将模型性能与基于spice的SACAMOS模型进行了比较。虽然不如Spice模型灵活,但NARX模型可以很好地表示受害电缆上的信号,且均方误差值很小。
{"title":"Evaluation of Nonlinear ARX System Identification Technique on Modeling Crosstalk","authors":"M. I. Sudrajat, M. A. Wibisono, H. Loschi, N. Moonen, F. Leferink","doi":"10.1109/EMCSI39492.2022.9889401","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889401","url":null,"abstract":"Estimating crosstalk appropriately is very important in the process of mitigating electromagnetic interference. This study evaluates a black-box modeling technique named nonlinear autoregressive with exogenous inputs (NARX) on crosstalk modeling application, especially crosstalk due to random pulse width modulation. The model is developed using the input and output data from the measurement as regressor inputs. For validation, the mean squared error of this model is calculated by comparing the model output with the real measurement output. For evaluation, the model performance also was compared to a Spice-based SACAMOS model. Although less flexible than the Spice model, NARX model can represent the signal on the victim cable well with a small mean squared error value.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121983915","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Parameter Estimation of Silicon Metal Grid using Supervised Learning 基于监督学习的金属硅网格参数估计
Allan Sánchez-Masís, Sameer Shekhar, Christian Chaves Bejarano, Mauricio Aguilar Salas
Silicon industry needs reduced design time to cater to broad annual product portfolio. Therefore, avoiding complex simulations during product design has immense value. To that end this paper presents machine learning based parameter estimation method for silicon metal grid based on past data. Regression results from employed machine learning algorithms and dependency on data standardization is discussed. Over 40% reduction in root mean square error of grid resistance is reported which is crucial for obtaining accurate transient and AC simulation result.
硅工业需要减少设计时间,以满足广泛的年度产品组合。因此,在产品设计过程中避免复杂的模拟具有巨大的价值。为此,本文提出了基于机器学习的金属硅网格参数估计方法。讨论了机器学习算法的回归结果和对数据标准化的依赖。电网电阻均方根误差减小40%以上,这对获得准确的暂态和交流仿真结果至关重要。
{"title":"Parameter Estimation of Silicon Metal Grid using Supervised Learning","authors":"Allan Sánchez-Masís, Sameer Shekhar, Christian Chaves Bejarano, Mauricio Aguilar Salas","doi":"10.1109/EMCSI39492.2022.10050255","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.10050255","url":null,"abstract":"Silicon industry needs reduced design time to cater to broad annual product portfolio. Therefore, avoiding complex simulations during product design has immense value. To that end this paper presents machine learning based parameter estimation method for silicon metal grid based on past data. Regression results from employed machine learning algorithms and dependency on data standardization is discussed. Over 40% reduction in root mean square error of grid resistance is reported which is crucial for obtaining accurate transient and AC simulation result.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122767867","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Simultaneous Design of Circular Pad and Double Side Compensation Network for Dynamic Wireless Power Transfer 动态无线电力传输中圆形垫和双面补偿网络的同步设计
E. N. Esfahani, Indranil Bhattacharya, Webster Adepoju
The wide-scale adoption of electric vehicles may have the capability of efficient and fast charging while the car is in motion or dynamic wireless power transfer (DWPT) technology. Magnetic pad and compensation topology are two major factors affecting the amount of power transfer and efficiency of dynamic wireless power transfer. This article presents an iterative approach to designing magnetic pads and optimization of a double-side LLC compensation network. The optimization of coil pad was performed using a parametric sweep. Finite-element modeling in ANSYS Maxwell 3D was developed to achieve a desired value of self and mutual inductance of the coils. The effect of coil misalignment was also analyzed. A case study of a 3-kW dynamic wireless power transfer system was simulated under different loads using MATLAB/Simulink to verify the features of the proposed system. The system showed DC-DC efficiency as high as 97.80% with constant voltage output.
电动汽车的广泛采用可能具有在行驶中高效快速充电的能力或动态无线电力传输(DWPT)技术。磁垫和补偿拓扑是影响动态无线电力传输量和效率的两个主要因素。本文提出了一种设计磁垫的迭代方法和优化双侧LLC补偿网络的方法。采用参数扫描法对线圈垫进行了优化。在ANSYS Maxwell 3D中进行有限元建模,以实现线圈的自感和互感的理想值。分析了线圈不对中对系统的影响。以3kw动态无线电力传输系统为例,利用MATLAB/Simulink对不同负载下的动态无线电力传输系统进行了仿真,验证了所提系统的特性。在恒压输出下,系统的DC-DC效率高达97.80%。
{"title":"Simultaneous Design of Circular Pad and Double Side Compensation Network for Dynamic Wireless Power Transfer","authors":"E. N. Esfahani, Indranil Bhattacharya, Webster Adepoju","doi":"10.1109/EMCSI39492.2022.9889510","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889510","url":null,"abstract":"The wide-scale adoption of electric vehicles may have the capability of efficient and fast charging while the car is in motion or dynamic wireless power transfer (DWPT) technology. Magnetic pad and compensation topology are two major factors affecting the amount of power transfer and efficiency of dynamic wireless power transfer. This article presents an iterative approach to designing magnetic pads and optimization of a double-side LLC compensation network. The optimization of coil pad was performed using a parametric sweep. Finite-element modeling in ANSYS Maxwell 3D was developed to achieve a desired value of self and mutual inductance of the coils. The effect of coil misalignment was also analyzed. A case study of a 3-kW dynamic wireless power transfer system was simulated under different loads using MATLAB/Simulink to verify the features of the proposed system. The system showed DC-DC efficiency as high as 97.80% with constant voltage output.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"151 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116532300","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
The Technological Arms Race in Hardware Security 硬件安全领域的技术军备竞赛
Shahin Tajik, P. Schaumont
For many years there has been an arms race between designers and adversaries of secure hardware. Improvements in the strategies for attack spur new defense techniques, and better defenses lead to improved attacks. In this contribution, first, we examine the technological dimensions of this arms race. While defenders benefit from increased circuit density and decreasing feature size, attackers benefit from novel side-channel attack vectors based on optical and electromagnetic interactions with their target. Second, we analyze the feasibility and applicability of various side-channel attacks on primary units of cryptographic hardware. We also discuss the required time, cost, and expertise to mount these attacks. We then examine how well modern defense methods are capable of thwarting modern attack methods.
多年来,安全硬件的设计者和对手之间一直在进行军备竞赛。攻击策略的改进刺激了新的防御技术,更好的防御导致了更好的攻击。在这篇文章中,我们首先审查了这场军备竞赛的技术层面。防御者受益于电路密度的增加和特征尺寸的减小,而攻击者则受益于基于与目标的光和电磁相互作用的新型侧信道攻击向量。其次,我们分析了各种侧信道攻击对加密硬件主要单元的可行性和适用性。我们还讨论了发起这些攻击所需的时间、成本和专业知识。然后,我们检查现代防御方法如何能够很好地挫败现代攻击方法。
{"title":"The Technological Arms Race in Hardware Security","authors":"Shahin Tajik, P. Schaumont","doi":"10.1109/EMCSI39492.2022.9889394","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889394","url":null,"abstract":"For many years there has been an arms race between designers and adversaries of secure hardware. Improvements in the strategies for attack spur new defense techniques, and better defenses lead to improved attacks. In this contribution, first, we examine the technological dimensions of this arms race. While defenders benefit from increased circuit density and decreasing feature size, attackers benefit from novel side-channel attack vectors based on optical and electromagnetic interactions with their target. Second, we analyze the feasibility and applicability of various side-channel attacks on primary units of cryptographic hardware. We also discuss the required time, cost, and expertise to mount these attacks. We then examine how well modern defense methods are capable of thwarting modern attack methods.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"R-34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126541916","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
In-situ qualification of semi-rigid and flexible RF gaskets 半刚性和柔性射频垫片的现场鉴定
S. Bauer, Christian Türk, K. Roppert
This work presents a possibility of in-situ characterization of RF gaskets based on the occurrence of nonlinear transitions resulting from aging and corrosion of used gaskets over time due to, e.g., thermal stress or moisture.
这项工作提出了一种射频衬垫的原位表征的可能性,这种表征是基于使用过的衬垫随着时间的老化和腐蚀所导致的非线性转变的发生,例如,热应力或湿度。
{"title":"In-situ qualification of semi-rigid and flexible RF gaskets","authors":"S. Bauer, Christian Türk, K. Roppert","doi":"10.1109/EMCSI39492.2022.10050236","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.10050236","url":null,"abstract":"This work presents a possibility of in-situ characterization of RF gaskets based on the occurrence of nonlinear transitions resulting from aging and corrosion of used gaskets over time due to, e.g., thermal stress or moisture.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"346 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122282845","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Practical Simulation Flow for Singing Capacitor Based Acoustic Noise Analysis 基于唱歌电容噪声分析的实用仿真流程
Xin Yan, Songping Wu, Ming-Feng Xue, C. Leung, D. Beetner, Jianmin Zhang
Multilayer ceramic capacitors (MLCCs) are widely used in modern electronics. Due to the piezoelectric effect of the ceramic material, however, MLCCs subjected to electrical noise may vibrate and generate acoustic noise, as ‘singing’. Acoustic noise can be annoying for users, especially within mobile devices, so it becomes important to perform acoustic noise analysis before a product is released. In this paper, a practical simulation flow for singing capacitor based acoustic noise is presented. The simulation flow and analysis method are developed on Ansys Sherlock and Mechanical. In Ansys Sherlock, local library and Approved Vendor List (AVL) files were used to build the model efficiently. After the PCB and all parts were set correctly, the model was imported to Ansys Mechanical for further modal analysis and harmonic analysis. Using the proposed simulation flow the simulation model could be easily created, and the inherent vibration properties and frequency response of the structure could be estimated.
多层陶瓷电容器(mlcc)在现代电子产品中应用广泛。然而,由于陶瓷材料的压电效应,受到电噪声的mlcc可能会振动并产生声噪声,就像“唱歌”一样。噪音对用户来说很烦人,尤其是在移动设备上,所以在产品发布之前进行噪音分析变得很重要。本文给出了一种实用的基于声噪声的歌唱电容仿真流程。在Ansys Sherlock和Mechanical软件上开发了仿真流程和分析方法。在Ansys Sherlock中,利用本地库和AVL (Approved Vendor List)文件高效地构建模型。在PCB和各部件设置正确后,将模型导入Ansys机械进行进一步的模态分析和谐波分析。利用所提出的仿真流程可以方便地建立仿真模型,并可以估计结构的固有振动特性和频率响应。
{"title":"A Practical Simulation Flow for Singing Capacitor Based Acoustic Noise Analysis","authors":"Xin Yan, Songping Wu, Ming-Feng Xue, C. Leung, D. Beetner, Jianmin Zhang","doi":"10.1109/EMCSI39492.2022.9889341","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889341","url":null,"abstract":"Multilayer ceramic capacitors (MLCCs) are widely used in modern electronics. Due to the piezoelectric effect of the ceramic material, however, MLCCs subjected to electrical noise may vibrate and generate acoustic noise, as ‘singing’. Acoustic noise can be annoying for users, especially within mobile devices, so it becomes important to perform acoustic noise analysis before a product is released. In this paper, a practical simulation flow for singing capacitor based acoustic noise is presented. The simulation flow and analysis method are developed on Ansys Sherlock and Mechanical. In Ansys Sherlock, local library and Approved Vendor List (AVL) files were used to build the model efficiently. After the PCB and all parts were set correctly, the model was imported to Ansys Mechanical for further modal analysis and harmonic analysis. Using the proposed simulation flow the simulation model could be easily created, and the inherent vibration properties and frequency response of the structure could be estimated.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131980795","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
期刊
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)
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