Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889600
Yifan Ding, M. Doyle, S. Connor, D. Becker, J. Drewniak
A physics-based modeling methodology for determining the transient current flow path in multi-layer PI designs is given in this paper using a commercial board with a complicated structure as an example. Board structure analysis is done first to provide a physical basis of post-layout analytical and equivalent circuit modeling. A match of the PDN impedance between commercial tool simulation, post-layout analytical calculation, and the physics-based equivalent circuit modeling was achieved to support the model for the transient simulation. By analyzing the current response in all the vias, a clear representation of transient current flow across all via segments can be given layer-by-layer. The maximum current density in vertical vias can also be extracted in this process, providing a reference for preventing transient overcurrent design.
{"title":"Physics-Based Modeling for Determining Transient Current Flow In Multi-layer PCB PI Designs","authors":"Yifan Ding, M. Doyle, S. Connor, D. Becker, J. Drewniak","doi":"10.1109/EMCSI39492.2022.9889600","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889600","url":null,"abstract":"A physics-based modeling methodology for determining the transient current flow path in multi-layer PI designs is given in this paper using a commercial board with a complicated structure as an example. Board structure analysis is done first to provide a physical basis of post-layout analytical and equivalent circuit modeling. A match of the PDN impedance between commercial tool simulation, post-layout analytical calculation, and the physics-based equivalent circuit modeling was achieved to support the model for the transient simulation. By analyzing the current response in all the vias, a clear representation of transient current flow across all via segments can be given layer-by-layer. The maximum current density in vertical vias can also be extracted in this process, providing a reference for preventing transient overcurrent design.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129971429","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889470
Hussam Elias, Ninovic Perez, H. Hirsch
In this paper, an approach is proposed to find the worst-case positions during the final measurement phase on critical frequencies in electromagnetic interference (EMI) measurements according to 47 CFR § 15.209 by using a developed measurement software and deep neural networks (DNN). Firstly, because of its advantage of incomplete connection, relatively simple model structure and strong data features extraction, a dimensional convolution neural network (1D CNN) was present to predict the positions that meet the maximum radiation emission level. Secondly, a hybrid deep learning neural network framework, that combines CNN with long short term memory(LSTM) was adopted to forecast the worst-case of the high variance emission levels. The DNNs were trained using real EMI measurements for different equipment under test (EUT) in a Semi Anechoic Chamber (SAC) by Cetecom GmbH in Essen, Germany. By predicting the position azimuth of the turntable and the height of the antenna, the required time to carry out the final measurement phase is effectively reduced.
{"title":"Development and Evaluation of a CNN-LSTM Architecture based Neural Network for Time Optimization during EMI Measurements","authors":"Hussam Elias, Ninovic Perez, H. Hirsch","doi":"10.1109/EMCSI39492.2022.9889470","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889470","url":null,"abstract":"In this paper, an approach is proposed to find the worst-case positions during the final measurement phase on critical frequencies in electromagnetic interference (EMI) measurements according to 47 CFR § 15.209 by using a developed measurement software and deep neural networks (DNN). Firstly, because of its advantage of incomplete connection, relatively simple model structure and strong data features extraction, a dimensional convolution neural network (1D CNN) was present to predict the positions that meet the maximum radiation emission level. Secondly, a hybrid deep learning neural network framework, that combines CNN with long short term memory(LSTM) was adopted to forecast the worst-case of the high variance emission levels. The DNNs were trained using real EMI measurements for different equipment under test (EUT) in a Semi Anechoic Chamber (SAC) by Cetecom GmbH in Essen, Germany. By predicting the position azimuth of the turntable and the height of the antenna, the required time to carry out the final measurement phase is effectively reduced.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116694307","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889660
K. Iokibe, Masaki Himuro, Y. Toyota
Once the signal-tu-noise ratio (SNR) of the side- channel (SC) leakage trace is known, the intensity of the SC information leakage source inside the integrated circuit (IC) can be identified from measurements carried out outside the IC, SNR observation of SC leakage can also make it possible to set quantitative design targets to achieve the demanded leakage intensity. We discuss an improved method for identifying the SNR of SC leakage traces composed of multiple transient responses of IC switching current. The IC switching current repeatedly occurs as the IC runs the cryptographic operation since the cryptographic algorithm repeats a set of sub-operations. The method was applied to simulated and measured leakage traces to eliminate the effect of transient IC switching current caused before the target sub-operation was processed. As a result, a transient component more extensive than the signal component of side-channel analysis was identified in the decoupling capacitor configuration, where the convergence of the transient response is slow. In addition, the correlation coefficients obtained by the correlation power analysis, a major side-channel analysis method, were plotted as a function of SNR, and the plot of the simulated traces agreed with the theoretical curve. On the other hand, some errors remained in the plot of the measured traces.
{"title":"A Study for Improving Signal-to-Noise Ratio Measurement Method in Side-Channel Information Leakage of Cryptographic Hardware","authors":"K. Iokibe, Masaki Himuro, Y. Toyota","doi":"10.1109/EMCSI39492.2022.9889660","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889660","url":null,"abstract":"Once the signal-tu-noise ratio (SNR) of the side- channel (SC) leakage trace is known, the intensity of the SC information leakage source inside the integrated circuit (IC) can be identified from measurements carried out outside the IC, SNR observation of SC leakage can also make it possible to set quantitative design targets to achieve the demanded leakage intensity. We discuss an improved method for identifying the SNR of SC leakage traces composed of multiple transient responses of IC switching current. The IC switching current repeatedly occurs as the IC runs the cryptographic operation since the cryptographic algorithm repeats a set of sub-operations. The method was applied to simulated and measured leakage traces to eliminate the effect of transient IC switching current caused before the target sub-operation was processed. As a result, a transient component more extensive than the signal component of side-channel analysis was identified in the decoupling capacitor configuration, where the convergence of the transient response is slow. In addition, the correlation coefficients obtained by the correlation power analysis, a major side-channel analysis method, were plotted as a function of SNR, and the plot of the simulated traces agreed with the theoretical curve. On the other hand, some errors remained in the plot of the measured traces.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117041426","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889618
Á. Ojeda-Rodríguez, C. Dominguez-Palacios, J. Bernal-Méndez, M. A. Martín-Prats
This work analyzes different techniques to measure the attenuation of differential mode noise provided by common mode chokes. The proposed setups are alternatives to the direct and symmetrical setups described in CISPR-17, which are also investigated in this work. This study is based on a modal analysis of a high-frequency circuit model of the common mode choke that allows for obtaining analytical expressions for the insertion loss of the common mode choke when excited in different setups in terms of the admittances of the modes excited in each setup. This provides additional insight to understand which modes are excited in each setup. We demonstrate that the setups are equivalent at low frequencies and we identify the key differences between them at high frequencies, in particular regarding their different frequencies of resonance. To validate our analysis, we have measured and characterized different commercial common mode chokes, and we have verified that in all the cases the measured transmission coefficients exhibit the behaviour predicted by the theoretical analysis.
{"title":"On Measuring the Response to Differential Mode Noise of Common Mode Chokes","authors":"Á. Ojeda-Rodríguez, C. Dominguez-Palacios, J. Bernal-Méndez, M. A. Martín-Prats","doi":"10.1109/EMCSI39492.2022.9889618","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889618","url":null,"abstract":"This work analyzes different techniques to measure the attenuation of differential mode noise provided by common mode chokes. The proposed setups are alternatives to the direct and symmetrical setups described in CISPR-17, which are also investigated in this work. This study is based on a modal analysis of a high-frequency circuit model of the common mode choke that allows for obtaining analytical expressions for the insertion loss of the common mode choke when excited in different setups in terms of the admittances of the modes excited in each setup. This provides additional insight to understand which modes are excited in each setup. We demonstrate that the setups are equivalent at low frequencies and we identify the key differences between them at high frequencies, in particular regarding their different frequencies of resonance. To validate our analysis, we have measured and characterized different commercial common mode chokes, and we have verified that in all the cases the measured transmission coefficients exhibit the behaviour predicted by the theoretical analysis.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"89 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116184836","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889401
M. I. Sudrajat, M. A. Wibisono, H. Loschi, N. Moonen, F. Leferink
Estimating crosstalk appropriately is very important in the process of mitigating electromagnetic interference. This study evaluates a black-box modeling technique named nonlinear autoregressive with exogenous inputs (NARX) on crosstalk modeling application, especially crosstalk due to random pulse width modulation. The model is developed using the input and output data from the measurement as regressor inputs. For validation, the mean squared error of this model is calculated by comparing the model output with the real measurement output. For evaluation, the model performance also was compared to a Spice-based SACAMOS model. Although less flexible than the Spice model, NARX model can represent the signal on the victim cable well with a small mean squared error value.
{"title":"Evaluation of Nonlinear ARX System Identification Technique on Modeling Crosstalk","authors":"M. I. Sudrajat, M. A. Wibisono, H. Loschi, N. Moonen, F. Leferink","doi":"10.1109/EMCSI39492.2022.9889401","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889401","url":null,"abstract":"Estimating crosstalk appropriately is very important in the process of mitigating electromagnetic interference. This study evaluates a black-box modeling technique named nonlinear autoregressive with exogenous inputs (NARX) on crosstalk modeling application, especially crosstalk due to random pulse width modulation. The model is developed using the input and output data from the measurement as regressor inputs. For validation, the mean squared error of this model is calculated by comparing the model output with the real measurement output. For evaluation, the model performance also was compared to a Spice-based SACAMOS model. Although less flexible than the Spice model, NARX model can represent the signal on the victim cable well with a small mean squared error value.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121983915","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.10050255
Allan Sánchez-Masís, Sameer Shekhar, Christian Chaves Bejarano, Mauricio Aguilar Salas
Silicon industry needs reduced design time to cater to broad annual product portfolio. Therefore, avoiding complex simulations during product design has immense value. To that end this paper presents machine learning based parameter estimation method for silicon metal grid based on past data. Regression results from employed machine learning algorithms and dependency on data standardization is discussed. Over 40% reduction in root mean square error of grid resistance is reported which is crucial for obtaining accurate transient and AC simulation result.
{"title":"Parameter Estimation of Silicon Metal Grid using Supervised Learning","authors":"Allan Sánchez-Masís, Sameer Shekhar, Christian Chaves Bejarano, Mauricio Aguilar Salas","doi":"10.1109/EMCSI39492.2022.10050255","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.10050255","url":null,"abstract":"Silicon industry needs reduced design time to cater to broad annual product portfolio. Therefore, avoiding complex simulations during product design has immense value. To that end this paper presents machine learning based parameter estimation method for silicon metal grid based on past data. Regression results from employed machine learning algorithms and dependency on data standardization is discussed. Over 40% reduction in root mean square error of grid resistance is reported which is crucial for obtaining accurate transient and AC simulation result.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122767867","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889510
E. N. Esfahani, Indranil Bhattacharya, Webster Adepoju
The wide-scale adoption of electric vehicles may have the capability of efficient and fast charging while the car is in motion or dynamic wireless power transfer (DWPT) technology. Magnetic pad and compensation topology are two major factors affecting the amount of power transfer and efficiency of dynamic wireless power transfer. This article presents an iterative approach to designing magnetic pads and optimization of a double-side LLC compensation network. The optimization of coil pad was performed using a parametric sweep. Finite-element modeling in ANSYS Maxwell 3D was developed to achieve a desired value of self and mutual inductance of the coils. The effect of coil misalignment was also analyzed. A case study of a 3-kW dynamic wireless power transfer system was simulated under different loads using MATLAB/Simulink to verify the features of the proposed system. The system showed DC-DC efficiency as high as 97.80% with constant voltage output.
{"title":"Simultaneous Design of Circular Pad and Double Side Compensation Network for Dynamic Wireless Power Transfer","authors":"E. N. Esfahani, Indranil Bhattacharya, Webster Adepoju","doi":"10.1109/EMCSI39492.2022.9889510","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889510","url":null,"abstract":"The wide-scale adoption of electric vehicles may have the capability of efficient and fast charging while the car is in motion or dynamic wireless power transfer (DWPT) technology. Magnetic pad and compensation topology are two major factors affecting the amount of power transfer and efficiency of dynamic wireless power transfer. This article presents an iterative approach to designing magnetic pads and optimization of a double-side LLC compensation network. The optimization of coil pad was performed using a parametric sweep. Finite-element modeling in ANSYS Maxwell 3D was developed to achieve a desired value of self and mutual inductance of the coils. The effect of coil misalignment was also analyzed. A case study of a 3-kW dynamic wireless power transfer system was simulated under different loads using MATLAB/Simulink to verify the features of the proposed system. The system showed DC-DC efficiency as high as 97.80% with constant voltage output.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"151 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116532300","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889394
Shahin Tajik, P. Schaumont
For many years there has been an arms race between designers and adversaries of secure hardware. Improvements in the strategies for attack spur new defense techniques, and better defenses lead to improved attacks. In this contribution, first, we examine the technological dimensions of this arms race. While defenders benefit from increased circuit density and decreasing feature size, attackers benefit from novel side-channel attack vectors based on optical and electromagnetic interactions with their target. Second, we analyze the feasibility and applicability of various side-channel attacks on primary units of cryptographic hardware. We also discuss the required time, cost, and expertise to mount these attacks. We then examine how well modern defense methods are capable of thwarting modern attack methods.
{"title":"The Technological Arms Race in Hardware Security","authors":"Shahin Tajik, P. Schaumont","doi":"10.1109/EMCSI39492.2022.9889394","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889394","url":null,"abstract":"For many years there has been an arms race between designers and adversaries of secure hardware. Improvements in the strategies for attack spur new defense techniques, and better defenses lead to improved attacks. In this contribution, first, we examine the technological dimensions of this arms race. While defenders benefit from increased circuit density and decreasing feature size, attackers benefit from novel side-channel attack vectors based on optical and electromagnetic interactions with their target. Second, we analyze the feasibility and applicability of various side-channel attacks on primary units of cryptographic hardware. We also discuss the required time, cost, and expertise to mount these attacks. We then examine how well modern defense methods are capable of thwarting modern attack methods.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"R-34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126541916","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.10050236
S. Bauer, Christian Türk, K. Roppert
This work presents a possibility of in-situ characterization of RF gaskets based on the occurrence of nonlinear transitions resulting from aging and corrosion of used gaskets over time due to, e.g., thermal stress or moisture.
{"title":"In-situ qualification of semi-rigid and flexible RF gaskets","authors":"S. Bauer, Christian Türk, K. Roppert","doi":"10.1109/EMCSI39492.2022.10050236","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.10050236","url":null,"abstract":"This work presents a possibility of in-situ characterization of RF gaskets based on the occurrence of nonlinear transitions resulting from aging and corrosion of used gaskets over time due to, e.g., thermal stress or moisture.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"346 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122282845","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2022-08-01DOI: 10.1109/EMCSI39492.2022.9889341
Xin Yan, Songping Wu, Ming-Feng Xue, C. Leung, D. Beetner, Jianmin Zhang
Multilayer ceramic capacitors (MLCCs) are widely used in modern electronics. Due to the piezoelectric effect of the ceramic material, however, MLCCs subjected to electrical noise may vibrate and generate acoustic noise, as ‘singing’. Acoustic noise can be annoying for users, especially within mobile devices, so it becomes important to perform acoustic noise analysis before a product is released. In this paper, a practical simulation flow for singing capacitor based acoustic noise is presented. The simulation flow and analysis method are developed on Ansys Sherlock and Mechanical. In Ansys Sherlock, local library and Approved Vendor List (AVL) files were used to build the model efficiently. After the PCB and all parts were set correctly, the model was imported to Ansys Mechanical for further modal analysis and harmonic analysis. Using the proposed simulation flow the simulation model could be easily created, and the inherent vibration properties and frequency response of the structure could be estimated.
{"title":"A Practical Simulation Flow for Singing Capacitor Based Acoustic Noise Analysis","authors":"Xin Yan, Songping Wu, Ming-Feng Xue, C. Leung, D. Beetner, Jianmin Zhang","doi":"10.1109/EMCSI39492.2022.9889341","DOIUrl":"https://doi.org/10.1109/EMCSI39492.2022.9889341","url":null,"abstract":"Multilayer ceramic capacitors (MLCCs) are widely used in modern electronics. Due to the piezoelectric effect of the ceramic material, however, MLCCs subjected to electrical noise may vibrate and generate acoustic noise, as ‘singing’. Acoustic noise can be annoying for users, especially within mobile devices, so it becomes important to perform acoustic noise analysis before a product is released. In this paper, a practical simulation flow for singing capacitor based acoustic noise is presented. The simulation flow and analysis method are developed on Ansys Sherlock and Mechanical. In Ansys Sherlock, local library and Approved Vendor List (AVL) files were used to build the model efficiently. After the PCB and all parts were set correctly, the model was imported to Ansys Mechanical for further modal analysis and harmonic analysis. Using the proposed simulation flow the simulation model could be easily created, and the inherent vibration properties and frequency response of the structure could be estimated.","PeriodicalId":250856,"journal":{"name":"2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131980795","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}