Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743686
T. Garami, O. Krammer
In this paper, the effect of the various thickness of the solder joint between the SMD (Surface Mound Device) chip resistor and the PCB (Printed Circuit Board) pad on the mechanical strength was investigated with FEM (Finite Element Method) simulation. The mechanical effect was studied for different solder alloys too; lead-free and lead-bearing alloys were compared together. A FEM program was used to calculate and simulate the response for the mechanical loading. The solder joint of a 0603 (1.6 × 0.8 mm) size SMD resistor was investigated while the mentioned thickness was increased from 12 μm up to 130 μm. The simulation used non-linear material parameters for the solder joint. In the finite element analysis, we examined the stress response that was induced by shear load. The solution of the Anand model showed that a thicker solder joint results in a less mechanical stress.
{"title":"Investigating the mechanical effect of the solder joint thickness with simulation","authors":"T. Garami, O. Krammer","doi":"10.1109/SIITME.2013.6743686","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743686","url":null,"abstract":"In this paper, the effect of the various thickness of the solder joint between the SMD (Surface Mound Device) chip resistor and the PCB (Printed Circuit Board) pad on the mechanical strength was investigated with FEM (Finite Element Method) simulation. The mechanical effect was studied for different solder alloys too; lead-free and lead-bearing alloys were compared together. A FEM program was used to calculate and simulate the response for the mechanical loading. The solder joint of a 0603 (1.6 × 0.8 mm) size SMD resistor was investigated while the mentioned thickness was increased from 12 μm up to 130 μm. The simulation used non-linear material parameters for the solder joint. In the finite element analysis, we examined the stress response that was induced by shear load. The solution of the Anand model showed that a thicker solder joint results in a less mechanical stress.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"57 12","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114050875","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/SIITME.2013.6743642
I. Tavman, A. Turgut, N. Horny, M. Chirtoc
Polymer composites with high thermal conductivity are used more frequently in thermal management of electronic packaging systems. In this study, conductive polymer composites were prepared by melt mixing of ethylene-vinyl acetate (EVA) copolymer with graphite at different volumetric concentrations up to 29.3%. Two kinds of graphite were used as reinforcement to prepare composites: untreated natural graphite (UG) having particle sizes ranging from 20 μm to 25 μm and expanded graphite (EG) having originally particle sizes ranging from 5 to 6 μm in length. Upon mixing at high shear forces EG exfoliates in thin sheets of a few nanometers in thickness. Due to this high aspect ratio of graphite sheets, nanocomposites filled with expanded graphite have a lower percolation threshold for electrical conductivity, about (5 to 6) vol.% compared to the composites filled with untreated graphite (UG) which have a percolation threshold of (15 to 17) vol.%. Thermal diffusivity of the samples was measured by photothermal radiometry. At similar concentrations, thermal diffusivity values for the nano-composites, EG-filled EVA, were significantly higher than those composites filled with UG.
{"title":"Polymer matrix composites reinforced with expanded and unexpended graphite Particles for electronic packaging applications","authors":"I. Tavman, A. Turgut, N. Horny, M. Chirtoc","doi":"10.1109/SIITME.2013.6743642","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743642","url":null,"abstract":"Polymer composites with high thermal conductivity are used more frequently in thermal management of electronic packaging systems. In this study, conductive polymer composites were prepared by melt mixing of ethylene-vinyl acetate (EVA) copolymer with graphite at different volumetric concentrations up to 29.3%. Two kinds of graphite were used as reinforcement to prepare composites: untreated natural graphite (UG) having particle sizes ranging from 20 μm to 25 μm and expanded graphite (EG) having originally particle sizes ranging from 5 to 6 μm in length. Upon mixing at high shear forces EG exfoliates in thin sheets of a few nanometers in thickness. Due to this high aspect ratio of graphite sheets, nanocomposites filled with expanded graphite have a lower percolation threshold for electrical conductivity, about (5 to 6) vol.% compared to the composites filled with untreated graphite (UG) which have a percolation threshold of (15 to 17) vol.%. Thermal diffusivity of the samples was measured by photothermal radiometry. At similar concentrations, thermal diffusivity values for the nano-composites, EG-filled EVA, were significantly higher than those composites filled with UG.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"160 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116157287","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：