Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743671
V. Bande, S. Pop, D. Pitica
In the dams monitoring procedure there are several important aspects that must be taken into consideration when the specialists must give a detail report regarding the construction behavior during the operation. One of the above physical phenomena that must be followed is the inclination of the concrete blocks during the freezing / unfreezing intervals or maximal / minimal loads (from the lake's water volume perspective) periods. That can be made using a dedicated sensor, a linear optical sensor with a large number of pixels that basically calculates the position of a wire, by its shadow position, by projecting it on the optical sensor using an area of powerful LEDs. The paper wants to identify the best method for the wire's position determination using the TSL1410R optical sensor from two points of view: the speed of the wire's position determination and the stability of the obtained results.
{"title":"Comparative analysis of the measurement methods for the wire's position using the TSL1410R optical sensor","authors":"V. Bande, S. Pop, D. Pitica","doi":"10.1109/SIITME.2013.6743671","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743671","url":null,"abstract":"In the dams monitoring procedure there are several important aspects that must be taken into consideration when the specialists must give a detail report regarding the construction behavior during the operation. One of the above physical phenomena that must be followed is the inclination of the concrete blocks during the freezing / unfreezing intervals or maximal / minimal loads (from the lake's water volume perspective) periods. That can be made using a dedicated sensor, a linear optical sensor with a large number of pixels that basically calculates the position of a wire, by its shadow position, by projecting it on the optical sensor using an area of powerful LEDs. The paper wants to identify the best method for the wire's position determination using the TSL1410R optical sensor from two points of view: the speed of the wire's position determination and the stability of the obtained results.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123536968","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743653
D. Visan, I. Lita, I. B. Cioc
In this paper is presented an angular positioning system based on stepper motors and remotely controlled using a wireless communication link. The wireless control system is intended to be used in a wide range of applications including the robotic arm positioning, automatic orientation of photovoltaic panels, video cameras or antennas. The proposed design is compose by two modules (transmission/reception) which can communicate wireless in 2.4 GHz frequency bandwidth using direct sequence spread spectrum transmission technique (DSSS) for achieving high immunity to noises and jamming. Both modules are implemented around two PIC 16F887 microcontrollers. The radio system is based on dedicated module XTR VF 2.4 LP which is connected to the microcontroller using serial peripheral interface bus (SPI). The system uses two stepper motors for obtaining two degree of freedom in angular positioning. The accuracy of the stepper motors is of 0.9 degrees. The user interface of the system consists in a display and a small size keyboard for introducing the positioning parameters. Compared with other implementations, the novelty of the proposed system consists in a reliable hardware design, based on performing communication modules and versatile microcontrollers running complex software application that allows accurate control, without operation errors.
{"title":"Wireless control system for angular positioning applications","authors":"D. Visan, I. Lita, I. B. Cioc","doi":"10.1109/SIITME.2013.6743653","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743653","url":null,"abstract":"In this paper is presented an angular positioning system based on stepper motors and remotely controlled using a wireless communication link. The wireless control system is intended to be used in a wide range of applications including the robotic arm positioning, automatic orientation of photovoltaic panels, video cameras or antennas. The proposed design is compose by two modules (transmission/reception) which can communicate wireless in 2.4 GHz frequency bandwidth using direct sequence spread spectrum transmission technique (DSSS) for achieving high immunity to noises and jamming. Both modules are implemented around two PIC 16F887 microcontrollers. The radio system is based on dedicated module XTR VF 2.4 LP which is connected to the microcontroller using serial peripheral interface bus (SPI). The system uses two stepper motors for obtaining two degree of freedom in angular positioning. The accuracy of the stepper motors is of 0.9 degrees. The user interface of the system consists in a display and a small size keyboard for introducing the positioning parameters. Compared with other implementations, the novelty of the proposed system consists in a reliable hardware design, based on performing communication modules and versatile microcontrollers running complex software application that allows accurate control, without operation errors.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115311516","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743647
O. Krammer
In this paper, a new method for calculating the amount of solder paste required for Pin-in-paste technology is presented and compared to a widely used explicit expression from literature. The optimal shape of the solder profile for through-hole components is calculated with Surface Evolver, and the necessary volume is determined based on the profile calculation. The boundary conditions of the Surface Evolver calculations are the following: the solder wets until the edge of the solder pads and the contact angle is equal to the wetting angle. In the experiment, the volume is determined for different through-hole diameters and for various widths of solder pads (annular rings). The plated-hole diameter was increased from +100 μm to +750 μm compared to the diameter of a component lead, while the width of the solder ring was investigated in the range of 100 μm to 400 μm. The determined volumes were then compared to volumes calculated based on the literature expression; and a correction factor was defined.
{"title":"New method for calculating the necessary amount of solder paste for Pin-in-paste technology","authors":"O. Krammer","doi":"10.1109/SIITME.2013.6743647","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743647","url":null,"abstract":"In this paper, a new method for calculating the amount of solder paste required for Pin-in-paste technology is presented and compared to a widely used explicit expression from literature. The optimal shape of the solder profile for through-hole components is calculated with Surface Evolver, and the necessary volume is determined based on the profile calculation. The boundary conditions of the Surface Evolver calculations are the following: the solder wets until the edge of the solder pads and the contact angle is equal to the wetting angle. In the experiment, the volume is determined for different through-hole diameters and for various widths of solder pads (annular rings). The plated-hole diameter was increased from +100 μm to +750 μm compared to the diameter of a component lead, while the width of the solder ring was investigated in the range of 100 μm to 400 μm. The determined volumes were then compared to volumes calculated based on the literature expression; and a correction factor was defined.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"111 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114902025","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743666
B. Mihailescu, I. Plotog, P. Svasta, C. Marghescu
This paper presents results obtained by simulating the electromagnetic field generated by an inductive planar structure with different parameters using FR4 substrate. The characterization/simulations of these passive devices were conducted using finite element software named Ansys HFSS. The key modeling considerations taken into account are: ground return path, skin depth, and dielectric stack-up simplification and via field simplification. The results were used to assess the possible usefulness of such structure for medical applications that use pulsed electromagnetic field therapy.
{"title":"Modeling and simulation of inductive structures for non-invasive medical uses","authors":"B. Mihailescu, I. Plotog, P. Svasta, C. Marghescu","doi":"10.1109/SIITME.2013.6743666","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743666","url":null,"abstract":"This paper presents results obtained by simulating the electromagnetic field generated by an inductive planar structure with different parameters using FR4 substrate. The characterization/simulations of these passive devices were conducted using finite element software named Ansys HFSS. The key modeling considerations taken into account are: ground return path, skin depth, and dielectric stack-up simplification and via field simplification. The results were used to assess the possible usefulness of such structure for medical applications that use pulsed electromagnetic field therapy.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124778703","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743641
A. Géczy, T. Garami, B. Kovács, D. Nagy, L. Gál, M. Ruszinkó, I. Hajdu
The paper presents soldering tests on biodegradable printed circuit boards (PCB) focusing on different alternative base materials. The aim of the work was to investigate and optimize different low-temperature soldering profiles on cellulose-acetate (CA) and polylactide (PLA) biopolymer-based PCBs with the application of special lead-free solder alloy suited for the temperatures. The investigations were focused on the minimization of the heating effect on the heat-sensitive biopolymers, where on the other hand, sufficient thermal energy is required to melt the solder alloys. The soldering profiles were created with a custom vapour phase soldering (VPS) approach where the heat transfer is controlled with an adaptive height-setting, temperature tracking sample holder. The profiles were evaluated according to their heating factor values. The soldered joints were evaluated with X-Ray microscopy and Shear Tests. The deformation of the PCB tracks was also investigated. The preliminary results reveal the priority of CA for further experiments.
{"title":"Soldering tests with biodegradable printed circuit boards","authors":"A. Géczy, T. Garami, B. Kovács, D. Nagy, L. Gál, M. Ruszinkó, I. Hajdu","doi":"10.1109/SIITME.2013.6743641","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743641","url":null,"abstract":"The paper presents soldering tests on biodegradable printed circuit boards (PCB) focusing on different alternative base materials. The aim of the work was to investigate and optimize different low-temperature soldering profiles on cellulose-acetate (CA) and polylactide (PLA) biopolymer-based PCBs with the application of special lead-free solder alloy suited for the temperatures. The investigations were focused on the minimization of the heating effect on the heat-sensitive biopolymers, where on the other hand, sufficient thermal energy is required to melt the solder alloys. The soldering profiles were created with a custom vapour phase soldering (VPS) approach where the heat transfer is controlled with an adaptive height-setting, temperature tracking sample holder. The profiles were evaluated according to their heating factor values. The soldered joints were evaluated with X-Ray microscopy and Shear Tests. The deformation of the PCB tracks was also investigated. The preliminary results reveal the priority of CA for further experiments.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"79 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122603975","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743664
I. B. Cioc, I. Lita, D. Visan
This paper presents an application for simulation and generation of signals from semiconductor radiation detectors which can be used in testing and calibrating of the processing circuitry within radiation measurement apparatus. The proposed application acts as a virtual semiconductor radiation sensor, generating the specific pulse signals delivered by the sensor processing circuitry in case of a radiation probe at the input. Signals generated by the virtual radiation sensor can be used in developing and testing phases of the signal processing circuitry and algorithms in a safe mode, without the need of any radiation source to be present at the input. For better accuracy of developing process, the simulator of the semiconductor radiation sensor can work with both simulated signal patterns and real signals acquired previously from different radiation sources.
{"title":"Simulator for signals from semiconductor radiation sensors used in testing of radiation measurement apparatus","authors":"I. B. Cioc, I. Lita, D. Visan","doi":"10.1109/SIITME.2013.6743664","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743664","url":null,"abstract":"This paper presents an application for simulation and generation of signals from semiconductor radiation detectors which can be used in testing and calibrating of the processing circuitry within radiation measurement apparatus. The proposed application acts as a virtual semiconductor radiation sensor, generating the specific pulse signals delivered by the sensor processing circuitry in case of a radiation probe at the input. Signals generated by the virtual radiation sensor can be used in developing and testing phases of the signal processing circuitry and algorithms in a safe mode, without the need of any radiation source to be present at the input. For better accuracy of developing process, the simulator of the semiconductor radiation sensor can work with both simulated signal patterns and real signals acquired previously from different radiation sources.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128373584","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743687
M. Placek, P. Mach
Self-healing capacitors fabricated of metalized polypropylene film as the dielectric material are widely used in power electronics. Self-healing process makes elimination of local defects in these capacitors possible and extends the life-time of them. It was shown that the measuring of capacitor V/A characteristic nonlinearity is usable and effective tool for monitoring of capacitor quality. Six capacitors of this type were aged in an oven at the temperature of 90 °C for 1000 hours under normal ambient conditions and changes caused by ageing were monitored with the nonlinearity measurement. It was found that nonlinearity of capacitor grows with the time of ageing.
{"title":"Monitoring of metalized film capacitors degradation with impedance nonlinearity measurement","authors":"M. Placek, P. Mach","doi":"10.1109/SIITME.2013.6743687","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743687","url":null,"abstract":"Self-healing capacitors fabricated of metalized polypropylene film as the dielectric material are widely used in power electronics. Self-healing process makes elimination of local defects in these capacitors possible and extends the life-time of them. It was shown that the measuring of capacitor V/A characteristic nonlinearity is usable and effective tool for monitoring of capacitor quality. Six capacitors of this type were aged in an oven at the temperature of 90 °C for 1000 hours under normal ambient conditions and changes caused by ageing were monitored with the nonlinearity measurement. It was found that nonlinearity of capacitor grows with the time of ageing.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121560719","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743689
Flavius Opritoiu, Andreea Bozesan, M. Vladutiu
A pseudo random test strategy for the AES is presented in this paper, suitable for fault tolerant cryptographic designs. The proposed solution is capable of assessing the integrity of a crypto-chip in a non-concurrent, autonomous manner. The error detection strategy relies on iterated execution of the crypto-system's components in order to reduce the complexity of the test architecture and the test length. Alternative verification structures are considered with respect to uniform pseudo random stimulation of the datapath and the key scheduler. Furthermore, the proposed test method offers a good trade-off between the length of the test process and the storage requirements for the correct responses. The article investigates the integration of the proposed error detection technique into fault tolerant designs. The presented test architecture entails reduced area overhead.
{"title":"Pseudo random self-test architecture for Advanced Encryption Standard","authors":"Flavius Opritoiu, Andreea Bozesan, M. Vladutiu","doi":"10.1109/SIITME.2013.6743689","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743689","url":null,"abstract":"A pseudo random test strategy for the AES is presented in this paper, suitable for fault tolerant cryptographic designs. The proposed solution is capable of assessing the integrity of a crypto-chip in a non-concurrent, autonomous manner. The error detection strategy relies on iterated execution of the crypto-system's components in order to reduce the complexity of the test architecture and the test length. Alternative verification structures are considered with respect to uniform pseudo random stimulation of the datapath and the key scheduler. Furthermore, the proposed test method offers a good trade-off between the length of the test process and the storage requirements for the correct responses. The article investigates the integration of the proposed error detection technique into fault tolerant designs. The presented test architecture entails reduced area overhead.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123828834","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743643
C. Ionescu, N. Codreanu, P. Svasta, D. Bonfert
This paper continues the study in the field of microheaters on flexible substrates. The idea of using flexible substrates comes together with the need for low manufacturing costs, having in mind the applications of sensors for home usage and other possible applications as monitors for buildings or basements where possible toxic gases can be accumulated, for instance mathane, carbon monoxide or carbon dioxide. In the current paper we propose the use of poly(3,4-ethylenedioxythiophene) doped with polystyrenesulfonic acid (PEDOT:PSS) as active heating element. The data from literature and our previous experiments have proven that this material can be used as resistive material having the possibility to operate within the desired range of temperatures for sensor applications, between 80 and 100 °C. The test samples with different patterns will be prepared by ink-jetting, with silver ink used as terminations.
{"title":"Optimal microheater Patterns with PEDOT:PSS conductors for flexible sensor applications","authors":"C. Ionescu, N. Codreanu, P. Svasta, D. Bonfert","doi":"10.1109/SIITME.2013.6743643","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743643","url":null,"abstract":"This paper continues the study in the field of microheaters on flexible substrates. The idea of using flexible substrates comes together with the need for low manufacturing costs, having in mind the applications of sensors for home usage and other possible applications as monitors for buildings or basements where possible toxic gases can be accumulated, for instance mathane, carbon monoxide or carbon dioxide. In the current paper we propose the use of poly(3,4-ethylenedioxythiophene) doped with polystyrenesulfonic acid (PEDOT:PSS) as active heating element. The data from literature and our previous experiments have proven that this material can be used as resistive material having the possibility to operate within the desired range of temperatures for sensor applications, between 80 and 100 °C. The test samples with different patterns will be prepared by ink-jetting, with silver ink used as terminations.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127647667","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2013-10-01DOI: 10.1109/SIITME.2013.6743680
R. Szabó, A. Gontean
This paper presents a new approach for programming acquisition cards. We know that an acquisition card which can be connected to the PC sometimes can be really expensive. Very often an engineer needs to generate signals or to make an acquisition of signals. To buy an acquisition card or a signal generator and an oscilloscope can be really expensive. Fortunately for us the PC has many acquisition cards that are already built in, but many of us don't know that they have it. One acquisition card which can be programmed is the LPT or the parallel printer port. With this port we can generate and make an acquisition of digital signals. We can say that we have a built-in digital signal generator and logic analyzer (digital signal oscilloscope) system on 8 channels.
{"title":"Programmable interface for a signal generator and logic analyzer system","authors":"R. Szabó, A. Gontean","doi":"10.1109/SIITME.2013.6743680","DOIUrl":"https://doi.org/10.1109/SIITME.2013.6743680","url":null,"abstract":"This paper presents a new approach for programming acquisition cards. We know that an acquisition card which can be connected to the PC sometimes can be really expensive. Very often an engineer needs to generate signals or to make an acquisition of signals. To buy an acquisition card or a signal generator and an oscilloscope can be really expensive. Fortunately for us the PC has many acquisition cards that are already built in, but many of us don't know that they have it. One acquisition card which can be programmed is the LPT or the parallel printer port. With this port we can generate and make an acquisition of digital signals. We can say that we have a built-in digital signal generator and logic analyzer (digital signal oscilloscope) system on 8 channels.","PeriodicalId":267846,"journal":{"name":"2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129421222","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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