首页 > 最新文献

2004 International Symposium on System-on-Chip, 2004. Proceedings.最新文献

英文 中文
A system-on-a-chip for audio encoding 用于音频编码的片上系统
Pub Date : 2004-11-16 DOI: 10.1109/ISSOC.2004.1411173
Jacob A. Bower
This project covers the development of a self-contained 'system-on-a-chip' (SoC) design which allows the lossy compression of digital audio data. Primarily, this is achieved by the creation of a general purpose extensible SoC framework, based around an off-the-shelf central processing unit (CPU) core. The framework allows extension of the CPU by adding custom instructions and data processors which are supported by a collection of customisable fractional arithmetic units. The goal of this design is to allow easy and rapid exploration of the hardware design space when running and accelerating the open-source 'Ogg Vorbis' audio encoding algorithm. By creating custom acceleration hardware using the framework, a speed increase of around 33%, compared to an unmodified refence encoder, is achieved in an FPGA prototype implementation. This project is the only work we are aware of so far that considers the use of 'Ogg Vorbis' for encoding in an embedded system.
该项目涵盖了一个独立的“片上系统”(SoC)设计的开发,该设计允许对数字音频数据进行有损压缩。首先,这是通过创建基于现成的中央处理单元(CPU)核心的通用可扩展SoC框架来实现的。该框架允许通过添加自定义指令和数据处理器来扩展CPU,这些指令和数据处理器由一组可定制的分数算术单元支持。本设计的目标是在运行和加速开源的“Ogg Vorbis”音频编码算法时,允许轻松快速地探索硬件设计空间。通过使用该框架创建自定义加速硬件,与未修改的参考编码器相比,在FPGA原型实现中实现了大约33%的速度提升。这个项目是迄今为止我们所知道的唯一一个考虑在嵌入式系统中使用“Ogg Vorbis”进行编码的工作。
{"title":"A system-on-a-chip for audio encoding","authors":"Jacob A. Bower","doi":"10.1109/ISSOC.2004.1411173","DOIUrl":"https://doi.org/10.1109/ISSOC.2004.1411173","url":null,"abstract":"This project covers the development of a self-contained 'system-on-a-chip' (SoC) design which allows the lossy compression of digital audio data. Primarily, this is achieved by the creation of a general purpose extensible SoC framework, based around an off-the-shelf central processing unit (CPU) core. The framework allows extension of the CPU by adding custom instructions and data processors which are supported by a collection of customisable fractional arithmetic units. The goal of this design is to allow easy and rapid exploration of the hardware design space when running and accelerating the open-source 'Ogg Vorbis' audio encoding algorithm. By creating custom acceleration hardware using the framework, a speed increase of around 33%, compared to an unmodified refence encoder, is achieved in an FPGA prototype implementation. This project is the only work we are aware of so far that considers the use of 'Ogg Vorbis' for encoding in an embedded system.","PeriodicalId":268122,"journal":{"name":"2004 International Symposium on System-on-Chip, 2004. Proceedings.","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114957485","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Optimizing a high performance 32-bit processor for programmable logic 优化可编程逻辑的高性能32位处理器
Pub Date : 2004-11-16 DOI: 10.1109/ISSOC.2004.1411131
P. Metzgen
Summary form only given. Altera's SOPC Builder Tool enables engineers to create tailor-made systems in an FPGA with a short development cycle; one of the most popular components in SOPC Builder is Altera's NIOS II processor. As well as ease of use and flexibility, the NIOS II family of processors offers up to 200 DMIPs of performance and can cost as little as 35 cents worth of programmable logic. This high level of performance has been achieved by tailoring the processor architecture to fully exploit the FPGA resources used. Logic, registers, memory, and multipliers have different relative costs in an FPGA when compared to an ASIC; in an FPGA, registers and memories are relatively cheap, whereas logic and in particular, the implementation of multiplexers can be of relatively high cost. These cost differences have an influence on how engineers should design for FPGAs, and defined the design of NIOS II at the architectural level. This paper presents some novel techniques for implementing multiplexers and barrel-shifters efficiently, using the NIOS II processor as an example. These techniques are useful for improving FPGA designs in general, and have typically lead to area reductions and performance improvements of 20%.
只提供摘要形式。Altera的SOPC Builder Tool使工程师能够在FPGA中以较短的开发周期创建量身定制的系统;SOPC Builder中最受欢迎的组件之一是Altera的NIOS II处理器。除了易用性和灵活性外,NIOS II系列处理器还提供高达200 DMIPs的性能,而可编程逻辑的成本仅为35美分。这种高水平的性能是通过定制处理器架构来充分利用所使用的FPGA资源来实现的。与ASIC相比,FPGA中的逻辑、寄存器、内存和乘法器具有不同的相对成本;在FPGA中,寄存器和存储器相对便宜,而逻辑,特别是多路复用器的实现成本相对较高。这些成本差异影响了工程师应该如何设计fpga,并在架构层面定义了NIOS II的设计。本文以NIOS II处理器为例,介绍了一些有效实现多路复用器和桶移器的新技术。这些技术对于改进FPGA设计非常有用,通常可以减少20%的面积并提高20%的性能。
{"title":"Optimizing a high performance 32-bit processor for programmable logic","authors":"P. Metzgen","doi":"10.1109/ISSOC.2004.1411131","DOIUrl":"https://doi.org/10.1109/ISSOC.2004.1411131","url":null,"abstract":"Summary form only given. Altera's SOPC Builder Tool enables engineers to create tailor-made systems in an FPGA with a short development cycle; one of the most popular components in SOPC Builder is Altera's NIOS II processor. As well as ease of use and flexibility, the NIOS II family of processors offers up to 200 DMIPs of performance and can cost as little as 35 cents worth of programmable logic. This high level of performance has been achieved by tailoring the processor architecture to fully exploit the FPGA resources used. Logic, registers, memory, and multipliers have different relative costs in an FPGA when compared to an ASIC; in an FPGA, registers and memories are relatively cheap, whereas logic and in particular, the implementation of multiplexers can be of relatively high cost. These cost differences have an influence on how engineers should design for FPGAs, and defined the design of NIOS II at the architectural level. This paper presents some novel techniques for implementing multiplexers and barrel-shifters efficiently, using the NIOS II processor as an example. These techniques are useful for improving FPGA designs in general, and have typically lead to area reductions and performance improvements of 20%.","PeriodicalId":268122,"journal":{"name":"2004 International Symposium on System-on-Chip, 2004. Proceedings.","volume":"169 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128270129","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
Efficient tile-aware bounding-box overlap test for tile-based rendering 有效的基于贴图渲染的贴图感知边界盒重叠测试
Pub Date : 2004-11-16 DOI: 10.1109/ISSOC.2004.1411177
Iosif Antochi, B. Juurlink, S. Vassiliadis, P. Liuha
Tile-based rendering appears to be a promising technique for low-cost, low-power 3D graphics platforms. This technique decomposes a scene into tiles and renders the tiles independently. It requires, however, that the primitives are sorted into bins that correspond to the tiles, which can be very time-consuming and may require a lot of memory bandwidth. The most often used test to determine if a primitive and a tile overlap is the bounding box test. This test checks if the 2D axis aligned bounding box of the primitive overlaps the tile and comprises four comparisons in the worst case. In this paper, we show that the efficiency of the bounding box test can be improved significantly by adaptively varying the order in which the comparisons are performed, depending on the position of the current tile. Experimental results obtained using several 3D graphics workloads show that the dynamic bounding box test reduces the average number of comparisons per primitive by 26% on average compared to the best performing static version in which the order of the comparisons is fixed.
对于低成本、低功耗的3D图形平台来说,基于tile的渲染似乎是一种很有前途的技术。这种技术将场景分解为多个贴图,并独立渲染这些贴图。但是,它要求将原语分类到与tile对应的bin中,这可能非常耗时,并且可能需要大量内存带宽。确定原语和贴图是否重叠最常用的测试是边界框测试。该测试检查原语的2D轴对齐边界框是否与tile重叠,并在最坏的情况下进行四次比较。在本文中,我们表明,根据当前贴图的位置,通过自适应地改变执行比较的顺序,可以显著提高边界盒测试的效率。使用几种3D图形工作负载获得的实验结果表明,与性能最好的静态版本(比较顺序固定)相比,动态边界盒测试将每个原语的平均比较次数平均减少了26%。
{"title":"Efficient tile-aware bounding-box overlap test for tile-based rendering","authors":"Iosif Antochi, B. Juurlink, S. Vassiliadis, P. Liuha","doi":"10.1109/ISSOC.2004.1411177","DOIUrl":"https://doi.org/10.1109/ISSOC.2004.1411177","url":null,"abstract":"Tile-based rendering appears to be a promising technique for low-cost, low-power 3D graphics platforms. This technique decomposes a scene into tiles and renders the tiles independently. It requires, however, that the primitives are sorted into bins that correspond to the tiles, which can be very time-consuming and may require a lot of memory bandwidth. The most often used test to determine if a primitive and a tile overlap is the bounding box test. This test checks if the 2D axis aligned bounding box of the primitive overlaps the tile and comprises four comparisons in the worst case. In this paper, we show that the efficiency of the bounding box test can be improved significantly by adaptively varying the order in which the comparisons are performed, depending on the position of the current tile. Experimental results obtained using several 3D graphics workloads show that the dynamic bounding box test reduces the average number of comparisons per primitive by 26% on average compared to the best performing static version in which the order of the comparisons is fixed.","PeriodicalId":268122,"journal":{"name":"2004 International Symposium on System-on-Chip, 2004. Proceedings.","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125069367","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Development of NSoC program in Taiwan 台湾NSoC计画的发展
Pub Date : 2004-11-16 DOI: 10.1109/ISSOC.2004.1411171
Chun-Yen Chang
Summary form only given. Over the past 20 years, Taiwan's private and public sectors have joined hands to establish a highly efficient electronics manufacturing environment with global logistics capabilities. The semiconductor industry enjoys a worldwide reputation as one of the most dynamic locations for electronics innovation and service provision. To continue her crucial role in the worldwide semiconductor industry, yet evolve from a capital intensive to knowledge intensive industry, Taiwan has set up a National SoC Program (NSoC) to coordinate efforts from private and public sectors. In this presentation, we outline the theme, the approaches, and the achievement of the 1st phase NSoC program, from 2003 to 2005. In addition, the planning for the 2nd phase is revealed.
只提供摘要形式。在过去的20年里,台湾的私营和公共部门携手建立了一个具有全球物流能力的高效电子制造环境。半导体行业在全球享有盛誉,是电子创新和服务提供最具活力的地区之一。为了继续在全球半导体产业中发挥关键作用,同时从资本密集型产业向知识密集型产业发展,台湾设立了国家SoC计划(NSoC),以协调私营和公共部门的努力。在本报告中,我们概述了2003年至2005年第一阶段NSoC计划的主题、方法和成就。此外,还公布了二期工程的规划方案。
{"title":"Development of NSoC program in Taiwan","authors":"Chun-Yen Chang","doi":"10.1109/ISSOC.2004.1411171","DOIUrl":"https://doi.org/10.1109/ISSOC.2004.1411171","url":null,"abstract":"Summary form only given. Over the past 20 years, Taiwan's private and public sectors have joined hands to establish a highly efficient electronics manufacturing environment with global logistics capabilities. The semiconductor industry enjoys a worldwide reputation as one of the most dynamic locations for electronics innovation and service provision. To continue her crucial role in the worldwide semiconductor industry, yet evolve from a capital intensive to knowledge intensive industry, Taiwan has set up a National SoC Program (NSoC) to coordinate efforts from private and public sectors. In this presentation, we outline the theme, the approaches, and the achievement of the 1st phase NSoC program, from 2003 to 2005. In addition, the planning for the 2nd phase is revealed.","PeriodicalId":268122,"journal":{"name":"2004 International Symposium on System-on-Chip, 2004. Proceedings.","volume":"78 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114172529","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Refinement of on-chip communication channels 改进片上通信通道
Pub Date : 2004-11-16 DOI: 10.1109/ISSOC.2004.1411184
J. Plosila, P. Liljeberg, J. Isoaho
We present a formal systematic approach to model and stepwise refine on-chip communication channels. The approach is based on the formal framework of action systems. We show how an abstract channel, modeled as a remote procedure, is first refined into an intermediate form and then further into a concrete implementable model based on boolean communication variables.
我们提出了一种正式的系统方法来建模和逐步完善片上通信通道。该方法以行动系统的正式框架为基础。我们将展示如何首先将建模为远程过程的抽象通道细化为中间形式,然后进一步细化为基于布尔通信变量的具体可实现模型。
{"title":"Refinement of on-chip communication channels","authors":"J. Plosila, P. Liljeberg, J. Isoaho","doi":"10.1109/ISSOC.2004.1411184","DOIUrl":"https://doi.org/10.1109/ISSOC.2004.1411184","url":null,"abstract":"We present a formal systematic approach to model and stepwise refine on-chip communication channels. The approach is based on the formal framework of action systems. We show how an abstract channel, modeled as a remote procedure, is first refined into an intermediate form and then further into a concrete implementable model based on boolean communication variables.","PeriodicalId":268122,"journal":{"name":"2004 International Symposium on System-on-Chip, 2004. Proceedings.","volume":"156 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123532432","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
An in-circuit debug environment for multiprocessor SOCs based on a HDL RISC soft-core 基于HDL - RISC软核的多处理器soc的在线调试环境
Pub Date : 2004-11-16 DOI: 10.1109/ISSOC.2004.1411183
R. Pelliconi, F. Campi, L. Salsa, C. Mucci, S. Macchiavelli
A fundamental feature common to all SOC projects is the inclusion of one or more embedded microprocessors in the design space. As the complexity of algorithms mapped on embedded processors and their interaction with the surrounding SOC resources increase, the availability of reliable software verification means becomes a serious design issue, especially when more than one processor is included in the design. Many existing processor-debugger interfaces are based on specific technology or architectural features such as JTAG interfaces or scan-chains. On the other hand, embedded microprocessor cores are often HDL suites, quite parametric and technology independent, and need to be reused in a very different design environment. In this paper, an in-circuit software debug environment is presented, that can be utilized for single- or multi-processor SOCs. The described methodology, only based on VHDL blocks and software routines, is independent from the chosen technology support, and processor memory or bus architecture configuration.
所有SOC项目的一个基本特征是在设计空间中包含一个或多个嵌入式微处理器。随着映射到嵌入式处理器上的算法的复杂性及其与周围SOC资源的交互增加,可靠的软件验证手段的可用性成为一个严重的设计问题,特别是当设计中包含多个处理器时。许多现有的处理器调试器接口都基于特定的技术或体系结构特性,如JTAG接口或扫描链。另一方面,嵌入式微处理器内核通常是HDL套件,非常参数化和技术独立,并且需要在非常不同的设计环境中重用。本文提出了一种可用于单处理器或多处理器soc的在线软件调试环境。所描述的方法仅基于VHDL模块和软件例程,与所选择的技术支持、处理器内存或总线体系结构配置无关。
{"title":"An in-circuit debug environment for multiprocessor SOCs based on a HDL RISC soft-core","authors":"R. Pelliconi, F. Campi, L. Salsa, C. Mucci, S. Macchiavelli","doi":"10.1109/ISSOC.2004.1411183","DOIUrl":"https://doi.org/10.1109/ISSOC.2004.1411183","url":null,"abstract":"A fundamental feature common to all SOC projects is the inclusion of one or more embedded microprocessors in the design space. As the complexity of algorithms mapped on embedded processors and their interaction with the surrounding SOC resources increase, the availability of reliable software verification means becomes a serious design issue, especially when more than one processor is included in the design. Many existing processor-debugger interfaces are based on specific technology or architectural features such as JTAG interfaces or scan-chains. On the other hand, embedded microprocessor cores are often HDL suites, quite parametric and technology independent, and need to be reused in a very different design environment. In this paper, an in-circuit software debug environment is presented, that can be utilized for single- or multi-processor SOCs. The described methodology, only based on VHDL blocks and software routines, is independent from the chosen technology support, and processor memory or bus architecture configuration.","PeriodicalId":268122,"journal":{"name":"2004 International Symposium on System-on-Chip, 2004. Proceedings.","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124985985","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Comparison of hardware IP components for system-on-chip 片上系统的硬件IP组件比较
Pub Date : 2004-11-16 DOI: 10.1109/ISSOC.2004.1411149
E. Salminen, Kimmo Kuusilinna, T. Hämäläinen
This work presents a brief comparison of both academic and commercial intellectual property (IP) components. The aim is to gain insight to contemporary IP components regarding their application domains and cost in terms of area and energy. It has been estimated that in the future the maximum size of components must be in the range of 50-100 kilogates. According to this study, contemporary IP components mostly conform to this size limit. Selecting the most appropriate IP candidates is crucial for successful SoC design. However, IP comparison and selection is hard since even basic information is often missing.
这项工作提出了学术和商业知识产权(IP)组件的简要比较。目的是深入了解当代IP组件的应用领域和面积和能源方面的成本。据估计,将来部件的最大尺寸必须在50-100公斤的范围内。根据本研究,当代IP组件大多符合此尺寸限制。选择最合适的候选IP对于成功的SoC设计至关重要。然而,由于缺乏基本信息,IP比较和选择非常困难。
{"title":"Comparison of hardware IP components for system-on-chip","authors":"E. Salminen, Kimmo Kuusilinna, T. Hämäläinen","doi":"10.1109/ISSOC.2004.1411149","DOIUrl":"https://doi.org/10.1109/ISSOC.2004.1411149","url":null,"abstract":"This work presents a brief comparison of both academic and commercial intellectual property (IP) components. The aim is to gain insight to contemporary IP components regarding their application domains and cost in terms of area and energy. It has been estimated that in the future the maximum size of components must be in the range of 50-100 kilogates. According to this study, contemporary IP components mostly conform to this size limit. Selecting the most appropriate IP candidates is crucial for successful SoC design. However, IP comparison and selection is hard since even basic information is often missing.","PeriodicalId":268122,"journal":{"name":"2004 International Symposium on System-on-Chip, 2004. Proceedings.","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131201949","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
SoC-Mobinet: broadband transceiver design challenges SoC-Mobinet:宽带收发器设计挑战
Pub Date : 2004-11-16 DOI: 10.1109/ISSOC.2004.1411157
F. Dielacher
Summary form only given. Decreasing feature size and increasing system complexity enables to map complex systems onto one die (SoC - system on chip) or into one package (SiP - system in package). This reduces development, production and packaging costs of the integrated circuit, increases integration density of the customer products by consuming less board space and optimizes the bill of material by reducing the number of external components. This paper looks at the design challenges posed by broadband transceiver design, including hardware/software reuse, validation and verification effort, and platform design, using the context of the SoC-Mobinet research project.
只提供摘要形式。减小特征尺寸和增加系统复杂性可以将复杂系统映射到一个芯片(SoC -片上系统)或一个封装(SiP -包中系统)。这降低了集成电路的开发、生产和封装成本,通过消耗更少的电路板空间来提高客户产品的集成密度,并通过减少外部元件的数量来优化物料清单。本文着眼于宽带收发器设计带来的设计挑战,包括硬件/软件重用,验证和验证工作,以及平台设计,使用SoC-Mobinet研究项目的背景。
{"title":"SoC-Mobinet: broadband transceiver design challenges","authors":"F. Dielacher","doi":"10.1109/ISSOC.2004.1411157","DOIUrl":"https://doi.org/10.1109/ISSOC.2004.1411157","url":null,"abstract":"Summary form only given. Decreasing feature size and increasing system complexity enables to map complex systems onto one die (SoC - system on chip) or into one package (SiP - system in package). This reduces development, production and packaging costs of the integrated circuit, increases integration density of the customer products by consuming less board space and optimizes the bill of material by reducing the number of external components. This paper looks at the design challenges posed by broadband transceiver design, including hardware/software reuse, validation and verification effort, and platform design, using the context of the SoC-Mobinet research project.","PeriodicalId":268122,"journal":{"name":"2004 International Symposium on System-on-Chip, 2004. Proceedings.","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133135203","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Application specific instruction-set processors (ASIP's) for wireless communications: design, cost, and energy efficiency vs. flexibility 用于无线通信的特定于应用程序的指令集处理器(ASIP):设计、成本和能效与灵活性
Pub Date : 2004-11-16 DOI: 10.1109/ISSOC.2004.1411050
H. Meyr
Summary form only given. The next generation of wireless communication systems will be cognitive to efficiently use the available bandwidth. For a given criterion, these systems will adaptively select the transmission method, protocol and the services which are optimal at any given time. Sophisticated signal processing algorithms of ultra high complexity must be executed to perform this adaptation. To meet conflicting goals such as energy efficiency and flexibility together with cost, time-to-market and reusability constraints a radically different, truly innovative architectural approach is necessary for SoCs applied to wireless communications. These future SoCs can be viewed as heterogeneous multiprocessor systems (MP-SoC). They will contain an increasing number of application specific instruction-set processors (ASIPs) combined with complex memory hierarchies and on-chip communication networks (NoC). The success of the proposed MP-SoC is ultimately linked to the availability of an equally innovative system-level design (SLD) methodology together with the corresponding SLD tool suite. In this presentation, we address this innovative SLD design flow in the context of wireless communications. The focus of this presentation is primarily on one crucial aspect of this process: the spatial mapping of application tasks onto ASIPs.
只提供摘要形式。下一代无线通信系统将是认知的,以有效地利用可用的带宽。对于给定的标准,这些系统将在任何给定的时间自适应地选择最优的传输方式、协议和服务。必须执行超高复杂度的复杂信号处理算法来执行这种自适应。为了满足诸如能源效率和灵活性以及成本、上市时间和可重用性限制等相互冲突的目标,应用于无线通信的soc需要一种完全不同的、真正创新的体系结构方法。这些未来的soc可以看作是异构多处理器系统(MP-SoC)。它们将包含越来越多的特定应用指令集处理器(asip),并结合复杂的内存层次结构和片上通信网络(NoC)。提议的MP-SoC的成功最终与同样创新的系统级设计(SLD)方法以及相应的SLD工具套件的可用性有关。在本次演讲中,我们将在无线通信的背景下讨论这种创新的SLD设计流程。本演讲的重点主要放在这个过程的一个关键方面:应用程序任务到api的空间映射。
{"title":"Application specific instruction-set processors (ASIP's) for wireless communications: design, cost, and energy efficiency vs. flexibility","authors":"H. Meyr","doi":"10.1109/ISSOC.2004.1411050","DOIUrl":"https://doi.org/10.1109/ISSOC.2004.1411050","url":null,"abstract":"Summary form only given. The next generation of wireless communication systems will be cognitive to efficiently use the available bandwidth. For a given criterion, these systems will adaptively select the transmission method, protocol and the services which are optimal at any given time. Sophisticated signal processing algorithms of ultra high complexity must be executed to perform this adaptation. To meet conflicting goals such as energy efficiency and flexibility together with cost, time-to-market and reusability constraints a radically different, truly innovative architectural approach is necessary for SoCs applied to wireless communications. These future SoCs can be viewed as heterogeneous multiprocessor systems (MP-SoC). They will contain an increasing number of application specific instruction-set processors (ASIPs) combined with complex memory hierarchies and on-chip communication networks (NoC). The success of the proposed MP-SoC is ultimately linked to the availability of an equally innovative system-level design (SLD) methodology together with the corresponding SLD tool suite. In this presentation, we address this innovative SLD design flow in the context of wireless communications. The focus of this presentation is primarily on one crucial aspect of this process: the spatial mapping of application tasks onto ASIPs.","PeriodicalId":268122,"journal":{"name":"2004 International Symposium on System-on-Chip, 2004. Proceedings.","volume":"111 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124733974","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Estimation of a maximum bound of uncertain parameter fluctuations with applications to analogue IP-cores 不确定参数波动的最大界估计与模拟ip核的应用
Pub Date : 2004-11-16 DOI: 10.1109/ISSOC.2004.1411176
H. Kadim
In analogue circuits, parameter fluctuations trigger variations in functional behaviour. However, such fluctuations may not result in faulty behaviour and, hence, the circuit may still function satisfactorily. Therefore, it is necessary to estimate a maximum bound of fluctuations that retains satisfactory functional behaviour. A method is presented which integrates design and test and is based on analytical modelling equations to estimate the sensitivity and determine the reliability of analogue circuits in the presence of parameter fluctuations. The proposed method enables two outcomes to be satisfied: (i) during the design process, the designer will need to consider the extent to which changes in circuit parameters will affect behaviour in order to determine the robustness of the design and the range of signatures within the bound which prove satisfactory behaviour; (ii) during operation, parameter fluctuations outside a predefined bound can be used to generate a warning condition.
在模拟电路中,参数波动触发功能行为的变化。然而,这种波动可能不会导致故障行为,因此,电路仍然可以令人满意地工作。因此,有必要估计一个保持令人满意的泛函行为的波动的最大界。提出了一种基于解析建模方程的设计与测试相结合的模拟电路参数波动灵敏度估计和可靠性确定方法。建议的方法能够满足两个结果:(i)在设计过程中,设计师需要考虑电路参数变化对行为的影响程度,以确定设计的稳健性和证明令人满意的行为的范围内的签名范围;(ii)在运行期间,参数波动超出预定范围,可用于产生警告条件。
{"title":"Estimation of a maximum bound of uncertain parameter fluctuations with applications to analogue IP-cores","authors":"H. Kadim","doi":"10.1109/ISSOC.2004.1411176","DOIUrl":"https://doi.org/10.1109/ISSOC.2004.1411176","url":null,"abstract":"In analogue circuits, parameter fluctuations trigger variations in functional behaviour. However, such fluctuations may not result in faulty behaviour and, hence, the circuit may still function satisfactorily. Therefore, it is necessary to estimate a maximum bound of fluctuations that retains satisfactory functional behaviour. A method is presented which integrates design and test and is based on analytical modelling equations to estimate the sensitivity and determine the reliability of analogue circuits in the presence of parameter fluctuations. The proposed method enables two outcomes to be satisfied: (i) during the design process, the designer will need to consider the extent to which changes in circuit parameters will affect behaviour in order to determine the robustness of the design and the range of signatures within the bound which prove satisfactory behaviour; (ii) during operation, parameter fluctuations outside a predefined bound can be used to generate a warning condition.","PeriodicalId":268122,"journal":{"name":"2004 International Symposium on System-on-Chip, 2004. Proceedings.","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124510582","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
期刊
2004 International Symposium on System-on-Chip, 2004. Proceedings.
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1