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2004 International Symposium on System-on-Chip, 2004. Proceedings.最新文献

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A system-level multiprocessor system-on-chip modeling framework 一个系统级多处理器片上系统建模框架
Pub Date : 2004-11-16 DOI: 10.1109/ISSOC.2004.1411154
K. Virk, J. Madsen
We present a system-level modeling framework to model system-on-chips (SoC) consisting of heterogeneous multiprocessors and network-on-chip communication structures in order to enable the developers of today's SoC designs to take advantage of the flexibility and scalability of network-on-chip and rapidly explore high-level design alternatives to meet their system requirements. We present a modeling approach for developing high-level performance models for these SoC designs and outline how this system-level performance analysis capability can be integrated into an overall environment for efficient SoC design. We show how a hand-held multimedia terminal, consisting of JPEG, MP3 and GSM applications, can be modeled as a multiprocessor SoC in our framework.
我们提出了一个系统级建模框架,对由异构多处理器和片上网络通信结构组成的片上系统(SoC)进行建模,以便使当今SoC设计的开发人员能够利用片上网络的灵活性和可扩展性,并快速探索高级设计替代方案,以满足他们的系统需求。我们提出了一种建模方法,用于为这些SoC设计开发高级性能模型,并概述了如何将这种系统级性能分析能力集成到高效SoC设计的整体环境中。我们展示了一个由JPEG、MP3和GSM应用程序组成的手持多媒体终端如何在我们的框架中被建模为一个多处理器SoC。
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引用次数: 10
A high linearity analog front end for multiprocessor SOC integration 多处理器SOC集成的高线性模拟前端
Pub Date : 2004-11-16 DOI: 10.1109/ISSOC.2004.1411130
Yong Luo, Anatoly Moskalev, Laurence E. Bays, B. Petryna
This paper reports a high linearity low power analog front end (AFE) subsystem composed of a contact image sensor (CIS) input amplifier, a programmable gain amplifier (PGA), a 10-bit pipelined analog-to-digital converter (ADC) and a 10-bit offset calibration digital-to-analog converter (DAC). The AFE was integrated into a mixed-signal multiprocessor system-on-chip (SOC) by using conventional ASIC flow. This SOC is fabricated in 0.14 /spl mu/m CMOS process with 3.3 V/1.5 V power supplies. The AFE runs up to 20 Ms/s sampling rate, ATE measurement shows on-chip performance of /spl plusmn/0.8LSB DNL and /spl plusmn/0.9LSB INL with less than 38 mW power dissipation. Timing, functional and behavior models are developed to support ASIC design flow and tools.
本文报道了一种高线性度低功耗模拟前端子系统,该子系统由一个接触式图像传感器(CIS)输入放大器、一个可编程增益放大器(PGA)、一个10位流水线模数转换器(ADC)和一个10位偏移校准数模转换器(DAC)组成。采用传统的ASIC流程将AFE集成到混合信号多处理器片上系统(SOC)中。该SOC采用0.14 /spl μ m CMOS工艺,采用3.3 V/1.5 V电源。AFE最高可达20 Ms/s采样率,ATE测量显示片上性能为/spl plusmn/0.8LSB DNL和/spl plusmn/0.9LSB INL,功耗小于38 mW。时序,功能和行为模型的开发,以支持ASIC设计流程和工具。
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引用次数: 0
A low-noise fast-settling PLL frequency synthesizer for CDMA receivers 一种用于CDMA接收机的低噪声快速沉降锁相环频率合成器
Pub Date : 2004-11-16 DOI: 10.1109/ISSOC.2004.1411146
Shaojun Wu
A 1.8-2 GHz fully integrated CMOS phase-locked-loop (PLL) frequency synthesizer for CDMA receivers is presented. The design focuses on the voltage controlled oscillator (VCO) and loop bandwidth adaptation technique, which determine the out-of-band phase noise and the speed of the PLL frequency synthesizer, respectively. A low power low phase noise bond wire VCO is proposed. The inductance compensation control circuit combined with the switched-capacitor array is used to automatically compensate the bond wire inductance variation. A novel lock detector that adoptively controls the loop bandwidth is employed. Implemented in a 0.18 /spl mu/m CMOS technology and at a 1.8 V supply voltage, the PLL frequency synthesizer dissipates 24 mW and occupies a chip area of 2.6 mm/spl times/1.6 mm. The simulation results show that phase noise of the synthesizer is -122.6 dBc/Hz at 1 MHz offset frequency and the settling time is 70 /spl mu/s.
提出了一种用于CDMA接收机的1.8- 2ghz全集成CMOS锁相环频率合成器。设计重点是压控振荡器(VCO)和环路带宽自适应技术,它们分别决定锁相环频率合成器的带外相位噪声和速度。提出了一种低功率、低相位噪声的键合线压控振荡器。采用电感补偿控制电路与开关电容阵列相结合,对键合线电感变化进行自动补偿。采用了一种新颖的自适应控制环路带宽的锁检测器。该锁相环频率合成器采用0.18 /spl mu/m CMOS技术,在1.8 V电源电压下实现,功耗为24 mW,芯片面积为2.6 mm/spl倍/1.6 mm。仿真结果表明,在1 MHz偏置频率下,合成器的相位噪声为-122.6 dBc/Hz,稳定时间为70 /spl mu/s。
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引用次数: 12
Providing QoS to connection-less packet-switched NoC by implementing DiffServ functionalities 通过实现diffservice功能为无连接分组交换NoC提供QoS
Pub Date : 2004-11-16 DOI: 10.1109/ISSOC.2004.1411140
Mehmet Derin Harmanci, Nuria Pazos Escudero, Y. Leblebici, P. Ienne
QoS is not intrinsic in most current NoC solutions, although it is crucial for global predictability and design reuse. Therefore, the current work presents a novel approach that borrows several concepts of DiffServ technology from Internet networks and adapts them to NoCs. This novel implementation based on connection-less communication improves the compromise between guaranteeing different traffic requirements and resource utilization, which is not efficiently granted in connection-oriented techniques, and provides a better scalability than the previous ones.
QoS在大多数当前的NoC解决方案中不是固有的,尽管它对全局可预测性和设计重用至关重要。因此,目前的工作提出了一种新的方法,该方法借用了Internet网络中的DiffServ技术的几个概念,并将其适应于noc。这种基于无连接通信的新实现改善了在保证不同的流量需求和资源利用之间的折衷,这是面向连接的技术无法有效实现的,并且提供了比以前更好的可扩展性。
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引用次数: 22
Reduction of design complexity using virtual hardware platforms 使用虚拟硬件平台降低设计复杂性
Pub Date : 2004-11-16 DOI: 10.1109/ISSOC.2004.1411151
Tero Rissa, W. Luk
Summary form only given. Our work alms to accelerate FPGA application development by raising the level of abstraction and facilitating design reuse. We propose a solution based on network of nodes, communicating using a packet-based protocol. This network of nodes is known as customisable modular platform (CMP). A node is a computational unit, which can be hardware core running on an FPGA, or a thread running on a processor or a DSP. Hardware nodes can span over several FPGAs or there can be several nodes on a single FPGA. The packet-based communication protocol is implemented using an interchangeable interface. This interface provides a seamless data interchange between the nodes, independent of the implementation target architecture or abstraction. The communication packets of this protocol include control information and data, i.e. header and payload.
只提供摘要形式。我们的工作旨在通过提高抽象水平和促进设计重用来加速FPGA应用程序的开发。我们提出了一种基于节点网络的解决方案,使用基于分组的协议进行通信。这种节点网络被称为可定制模块化平台(CMP)。节点是一个计算单元,它可以是在FPGA上运行的硬件核心,也可以是在处理器或DSP上运行的线程。硬件节点可以跨越多个FPGA,也可以在单个FPGA上有多个节点。基于包的通信协议使用可互换的接口实现。该接口在节点之间提供了无缝的数据交换,独立于实现目标体系结构或抽象。该协议的通信包包括控制信息和数据,即报头和有效载荷。
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引用次数: 0
Spidergon: a novel on-chip communication network Spidergon:一种新型片上通信网络
Pub Date : 2004-11-16 DOI: 10.1109/ISSOC.2004.1411133
M. Coppola, R. Locatelli, G. Maruccia, L. Pieralisi, A. Scandurra
Summary form only given. The SoC (System on Chip) design demands for novel architectural and circuital solutions to cope with the global wires issue, pushing the on-chip communication as a crucial and precious resource. In the context of the communication centric paradigm and according to a layered based design, it is foreseen that current on-chip shared bus will be, at least partially, replaced by a micronetwork interconnection implementing a flexible packet-based communication (A. Jantsch and H. Tenhunen, "Networks on Chip", Kluwer Academic Publishers, 2003). We state that the availability of an efficient on-chip communication platform is one of the most important enabling factors for the development of efficient and cost effective multi processor SoC in the near and long-term future. This summary presents the low cost, high performance on-chip communication network, called Spidergon, developed by the AST (Advanced System Technology) of STMicroelectronics as the possible evolution of STBus technology.
只提供摘要形式。SoC(片上系统)设计需要新颖的架构和电路解决方案来应对全球布线问题,推动片上通信成为至关重要和宝贵的资源。在以通信为中心范式的背景下,根据分层设计,可以预见当前的片上共享总线将至少部分地被实现灵活的基于分组的通信的微网络互连所取代(a . Jantsch和H. Tenhunen,“片上网络”,Kluwer学术出版社,2003)。我们指出,在近期和长期的未来,高效的片上通信平台的可用性是开发高效且具有成本效益的多处理器SoC的最重要因素之一。本文概述了意法半导体(STMicroelectronics)先进系统技术公司(AST)开发的低成本、高性能的片上通信网络Spidergon,作为STBus技术可能的发展方向。
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引用次数: 209
A model for imaging system-on-chip manufacturing costs 成像系统芯片制造成本的模型
Pub Date : 2004-11-16 DOI: 10.1109/ISSOC.2004.1411145
C. C. Wells, E. Duncan, D. Renshaw
This work describes some of the issues faced when integrating a CMOS image sensor into a system-on-chip (SoC). A simple method is proposed for estimating the manufacturing costs of imaging SoCs at several silicon processes using readily available information sources. A low-cost imaging SoC with integral DSP is presented and its manufacturing cost calculated. The results indicated that for the example given, processes of 0.18 /spl mu/m or smaller only start to become more economical than older processes at $2.80 per unit for 500k units.
本文描述了将CMOS图像传感器集成到片上系统(SoC)时所面临的一些问题。本文提出了一种简单的方法,利用现成的信息源来估计几种硅工艺下成像soc的制造成本。提出了一种集成DSP的低成本成像SoC,并计算了其制造成本。结果表明,对于给出的例子,0.18 /spl mu/m或更小的工艺在50万单位时才开始比每单位2.80美元的旧工艺更经济。
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引用次数: 1
Crosstalk immune interconnect driver design 串扰免疫互连驱动设计
Pub Date : 2004-11-01 DOI: 10.1109/ISSOC.2004.1411168
R. Weerasekera, Lirong Zheng, D. Pamunuwa, H. Tenhunen
The effect of crosstalk noise becomes increasingly significant as geometries continue to shrink into the deep sub-micrometer regime and clock-frequency increases into the multi GHz domain. Dynamic delay caused by coupling capacitance between adjacent interconnections is a critical problem, as it cannot accurately be estimated in static timing analysis. This work presents a new driver circuit scheme called the crosstalk immune interconnect driver (XTIID), for capacitively coupled interconnects, which eliminates pattern-dependent coupling noise. Also, such an interconnect drive technology has the potential to facilitate the dynamic timing problem in deep submicrometer VLSI design.
随着几何形状继续缩小到深亚微米范围,时钟频率增加到多GHz域,串扰噪声的影响变得越来越显著。相邻互连间耦合电容引起的动态延迟是静态时序分析中无法准确估计的关键问题。本文提出了一种新的驱动电路方案,称为串扰免疫互连驱动器(XTIID),用于电容耦合互连,消除了模式依赖的耦合噪声。此外,这种互连驱动技术有可能促进深亚微米VLSI设计中的动态时序问题。
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引用次数: 4
Accepted papers by country 按国家分类的接受论文
Pub Date : 1900-01-01 DOI: 10.1109/issoc.2004.1411191
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引用次数: 0
期刊
2004 International Symposium on System-on-Chip, 2004. Proceedings.
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