Pub Date : 2008-03-16DOI: 10.1109/STHERM.2008.4509358
J. C. Howes, D. Levett, S. T. Wilson, J. Marsala, D. Saums
The use of a vaporizable dielectric fluid is proposed and demonstrated in a proof-of-concept electrical drive system utilizing medium-range 1200 VAC 450 A IGBT devices. Comparative empirical data is shown for a drive system utilizing production components for a traditional air-cooled extruded aluminum heat sink thermal solution for each IGBT module, versus several water-cooled liquid cold plate solutions and a single-cabinet 750 kW, 1,000-horsepower drive system utilizing low-flow, pumped liquid multiphase cooling. Positive and negative attributes of each thermal solution are described.
提出了一种可蒸发的介电流体的使用，并在使用中程1200 VAC 450 a IGBT设备的概念验证电驱动系统中进行了演示。对比经验数据显示了采用传统风冷挤压铝散热器散热解决方案的驱动系统，与几种水冷液体冷板解决方案和采用低流量泵送液体多相冷却的单机柜750千瓦，1000马力驱动系统的驱动系统。描述了每种热溶液的正、负属性。
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Pub Date : 2008-03-16DOI: 10.1109/STHERM.2008.4509372
S. N. Paisner, T. D. Fornes, N. D. Huffman, K. Gilbert
New developments in the electronics industry have resulted in higher power chips. Unfortunately as these devices run at higher power, they dramatically increase the heat produced. New thermal management materials that exceed the performance of current commercially available greases, gels and adhesives were developed to meet these higher thermal loads. These materials were created using a dense particle packing theory. Rather than use empirical scattershot approaches, this new method uses a mathematical tool to optimize formulations. This theory not only helped produce new thermal materials but also dramatically reduced developmental time.
{"title":"Mathematical Methods for the Rapid Development of New High Performance Thermal Interface Materials","authors":"S. N. Paisner, T. D. Fornes, N. D. Huffman, K. Gilbert","doi":"10.1109/STHERM.2008.4509372","DOIUrl":"https://doi.org/10.1109/STHERM.2008.4509372","url":null,"abstract":"New developments in the electronics industry have resulted in higher power chips. Unfortunately as these devices run at higher power, they dramatically increase the heat produced. New thermal management materials that exceed the performance of current commercially available greases, gels and adhesives were developed to meet these higher thermal loads. These materials were created using a dense particle packing theory. Rather than use empirical scattershot approaches, this new method uses a mathematical tool to optimize formulations. This theory not only helped produce new thermal materials but also dramatically reduced developmental time.","PeriodicalId":285718,"journal":{"name":"2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-03-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115896661","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2008-03-16DOI: 10.1109/STHERM.2008.4509380
W. Bilski, G. Baldassarre, M. Connors, J. Toth, K. Wert
Electronic thermal packaging design continues to look for novel solutions for enhancing the performance of microelectronic cooling solutions. Driven by increasing thermal performance requirements, particularly in densely packaged militarized electronic systems and other high density or extreme use products, thermal designers are showing that to achieve the necessary cooling, combinations of existing technologies may offer further enhancement than has already been demonstrated. This paper discusses the performance characteristics of a single phase, pumped liquid cooling system (LCS) employed in cooling microprocessors and considers the effects of including solid state cooling (a.k.a thermoelectric cooling) in conjunction with the pumped liquid system. The thermal performance of a baseline LCS without TEC is compared to the performance of a LCS with a TEC combined with two alternative "flux transformer" heat spreaders. The two alternative flux transformers included a solid copper plate and vapor chamber heat pipe. Each "flux transformer" was sandwiched between the concentrated thermal load of the microprocessor and the TEC. The paper discusses the predicted thermal performance for the various systems as well as presenting experimental results. In demonstration, the experimental results show that the addition of TEC's coupled with the vapor chamber heat pipe "flux transformer" provided the most favorable improvement in system performance over the power dissipation range tested. As the TEC electrical power was increased, the temperature gradient across the TEC's increased reducing their coefficient of performance. Eventually, the combined TEC and vapor chamber heat pipe flux transformer solution matched, and then exceeded the heat sink temperature achievable with a conventional single phase pumped liquid cooling system. For microprocessor and ASIC heat dissipations of up to 175 watts, this particular pumped liquid system incorporating TEC's coupled with a vapor chamber heat pipe flux transformer can significantly reduce processor temperatures.
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