Pub Date : 2004-09-27DOI: 10.1109/AGEC.2004.1290866
M. Poh
Continuous and rapid technological advancement has dramatically improved the way we live. It also means that electronic products are being discarded faster than ever before. The increasing amount of electronic trash is definitely a growing pollution problem as more electronics join the league of waste stream in coming years. With every printing products sold, many more ink cartridges are produced. Ink cartridges are one of Hewlett Packard's key products. Because its large scale volume the impact that the product has on the environment requires attention. Product take back of used cartridges is necessary to provide our customers with an environmentally responsible end-of-life solution and also enables us to reduce our plastic waste. This paper presents the results on recycled glass reinforced Polyethylene Terephthalate (PET) usage in printer part. The recycled glass filled PET is compounded by Lavergne Group, Montreal, Canada. The stream of recycled PET feedstock is from 75% purified water bottle flake grade and 25% purified used ink cartridges from Hewlett Packard. Both are reprocessed to use on HP's printer model. Experimental studies were carried out to investigate the mechanical and thermal properties of the recycled glass-filled material. The experimental data obtained is then measured against comparable industrial data available on glass-filled PET product. Printer parts were subsequently molded and undergone product functional qualifications. Thermal analysis technique was applied to understand the findings from the qualification. The obtained thermograms from Differential Scanning Calorimetry provided quantitative and qualitative information about the physical and phase changes that involve endothermic or exothermic processes. These data will be extensively discussed in this paper. This study is a concerted industrial effort from several parties working on waste reduction opportunities. Not only will produce certain cost savings, it will also reflect our environmental pursuit towards the successful marriage of waste reduction without compromising quality and functionality.
{"title":"Thermal and mechanical analysis of recycled glass filled PET for printer part","authors":"M. Poh","doi":"10.1109/AGEC.2004.1290866","DOIUrl":"https://doi.org/10.1109/AGEC.2004.1290866","url":null,"abstract":"Continuous and rapid technological advancement has dramatically improved the way we live. It also means that electronic products are being discarded faster than ever before. The increasing amount of electronic trash is definitely a growing pollution problem as more electronics join the league of waste stream in coming years. With every printing products sold, many more ink cartridges are produced. Ink cartridges are one of Hewlett Packard's key products. Because its large scale volume the impact that the product has on the environment requires attention. Product take back of used cartridges is necessary to provide our customers with an environmentally responsible end-of-life solution and also enables us to reduce our plastic waste. This paper presents the results on recycled glass reinforced Polyethylene Terephthalate (PET) usage in printer part. The recycled glass filled PET is compounded by Lavergne Group, Montreal, Canada. The stream of recycled PET feedstock is from 75% purified water bottle flake grade and 25% purified used ink cartridges from Hewlett Packard. Both are reprocessed to use on HP's printer model. Experimental studies were carried out to investigate the mechanical and thermal properties of the recycled glass-filled material. The experimental data obtained is then measured against comparable industrial data available on glass-filled PET product. Printer parts were subsequently molded and undergone product functional qualifications. Thermal analysis technique was applied to understand the findings from the qualification. The obtained thermograms from Differential Scanning Calorimetry provided quantitative and qualitative information about the physical and phase changes that involve endothermic or exothermic processes. These data will be extensively discussed in this paper. This study is a concerted industrial effort from several parties working on waste reduction opportunities. Not only will produce certain cost savings, it will also reflect our environmental pursuit towards the successful marriage of waste reduction without compromising quality and functionality.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132898333","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-09-27DOI: 10.1109/AGEC.2004.1290891
H. Griese, L. Stobbe, A. Middendorf, H. Reichl
At first a short outline is given on how certain technology and product developments in the electronics industry are influencing social life, markets and the environment simultaneously in a positive and negative way, depending on the perspective we take. It will be shown for instance that an increase in efficiency (energy or resources) of a single product is misleading and that efficiency has to be evaluated by the overall production, distribution and anticipated use of that product in order to focus on sustainability. A life cycle perspective and active measures for ecodesign are the foremost important and politically required tasks in the coming years. The motivation and measures taken in that respect are varying in different regions of the world. New requirements for product integrated ecodesign will by set by the EuP directive currently under development in the European Union. Finally an integrated approach to a fast environmental assessment of an electronic product by the IZM/EE-Toolbox and the usage of such an evaluation for further product optimization is presented Becoming aware of the environmental impact of a product over the whole product life cycle - production, distribution, use as well as take back and recycling - is the first step to sustainable development. This is especially important due to the fact that an electronic product is designed and used equally all over the world.
{"title":"Environmental compatibility of electronics - a key towards local and global sustainable development","authors":"H. Griese, L. Stobbe, A. Middendorf, H. Reichl","doi":"10.1109/AGEC.2004.1290891","DOIUrl":"https://doi.org/10.1109/AGEC.2004.1290891","url":null,"abstract":"At first a short outline is given on how certain technology and product developments in the electronics industry are influencing social life, markets and the environment simultaneously in a positive and negative way, depending on the perspective we take. It will be shown for instance that an increase in efficiency (energy or resources) of a single product is misleading and that efficiency has to be evaluated by the overall production, distribution and anticipated use of that product in order to focus on sustainability. A life cycle perspective and active measures for ecodesign are the foremost important and politically required tasks in the coming years. The motivation and measures taken in that respect are varying in different regions of the world. New requirements for product integrated ecodesign will by set by the EuP directive currently under development in the European Union. Finally an integrated approach to a fast environmental assessment of an electronic product by the IZM/EE-Toolbox and the usage of such an evaluation for further product optimization is presented Becoming aware of the environmental impact of a product over the whole product life cycle - production, distribution, use as well as take back and recycling - is the first step to sustainable development. This is especially important due to the fact that an electronic product is designed and used equally all over the world.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"225 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124487589","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-09-27DOI: 10.1109/AGEC.2004.1290876
Liu Jian, Huang Rongxu, Jiang Juxiao, Zheng Guoxiang
IC industries are now under heavy pressure to develop electronics that lessen the environmental pressure. Green electronics calls for more environment-friendly manufacturing processes. An aluminum reflow process for metallization simply employing a PVD cluster tool, instead of CVD-tungsten fixtures, was successfully applied to fabricate IC wafers of narrow line width. Compared with tungsten, aluminum plugs can be formed in vias and contacts by PVD method which contributes to no precursor and little by-products. It also benefits the environment by saving process steps and equipment. Moreover, unlike refractory metals, aluminum is among the selected materials for electronic products for its recyclability after disposal. This paper will show how this green process can realize multilayer interconnection in submicron scope that used to be achieved only by tungsten. Voids in contacts and vias are eliminated by the thermal diffusion of aluminum atoms. Different conditions including two-step process are used to treat device wafers. The step coverages of contacts are tested to investigate both temperature and power dependence of the ability of aluminum to diffuse into the void during reflow steps. The mechanism of reflow is demonstrated theoretically and experimentally. The optimal processing condition is. also obtained through the experiments.
{"title":"Environment-friendly PVD Al-plug process for submicron multilayer interconnection","authors":"Liu Jian, Huang Rongxu, Jiang Juxiao, Zheng Guoxiang","doi":"10.1109/AGEC.2004.1290876","DOIUrl":"https://doi.org/10.1109/AGEC.2004.1290876","url":null,"abstract":"IC industries are now under heavy pressure to develop electronics that lessen the environmental pressure. Green electronics calls for more environment-friendly manufacturing processes. An aluminum reflow process for metallization simply employing a PVD cluster tool, instead of CVD-tungsten fixtures, was successfully applied to fabricate IC wafers of narrow line width. Compared with tungsten, aluminum plugs can be formed in vias and contacts by PVD method which contributes to no precursor and little by-products. It also benefits the environment by saving process steps and equipment. Moreover, unlike refractory metals, aluminum is among the selected materials for electronic products for its recyclability after disposal. This paper will show how this green process can realize multilayer interconnection in submicron scope that used to be achieved only by tungsten. Voids in contacts and vias are eliminated by the thermal diffusion of aluminum atoms. Different conditions including two-step process are used to treat device wafers. The step coverages of contacts are tested to investigate both temperature and power dependence of the ability of aluminum to diffuse into the void during reflow steps. The mechanism of reflow is demonstrated theoretically and experimentally. The optimal processing condition is. also obtained through the experiments.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115172641","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/agec.2004.1290857
povmr managementenables
{"title":"Worldwide trends impacting green electronic products","authors":"povmr managementenables","doi":"10.1109/agec.2004.1290857","DOIUrl":"https://doi.org/10.1109/agec.2004.1290857","url":null,"abstract":"","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116726194","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/agec.2004.1290905
A. Andrae, P. Moller, J. Liu
This paper addressed the question whether there is an environmental advantage of using DECT phones instead of GSM phones in offices. The paper also addresses the environmental compatibility of Electrochemical Pattern Replication (ECPR) compared to classical photolithography based microscale metallization (CL) for pattern transfer. Both environmental assessments consider electricity consumption and CO/sub 2/ emissions. The projects undertaken were two comparative studies of DECT phone/GSM phone and ECPR/CL respectively. The research method used was probabilistic uncertainty modelling with a limited number of inventory parameters used in the MATLAB tool. Within the chosen system boundaries and with the uncertainties added to input data, the ECPR is to 100% probability better than CL and the DECT phone is to 90% better than the GSM phone.
{"title":"Uncertainty estimation by Monte Carlo simulation applied to life cycle inventory of cordless phones and microscale metallization processes","authors":"A. Andrae, P. Moller, J. Liu","doi":"10.1109/agec.2004.1290905","DOIUrl":"https://doi.org/10.1109/agec.2004.1290905","url":null,"abstract":"This paper addressed the question whether there is an environmental advantage of using DECT phones instead of GSM phones in offices. The paper also addresses the environmental compatibility of Electrochemical Pattern Replication (ECPR) compared to classical photolithography based microscale metallization (CL) for pattern transfer. Both environmental assessments consider electricity consumption and CO/sub 2/ emissions. The projects undertaken were two comparative studies of DECT phone/GSM phone and ECPR/CL respectively. The research method used was probabilistic uncertainty modelling with a limited number of inventory parameters used in the MATLAB tool. Within the chosen system boundaries and with the uncertainties added to input data, the ECPR is to 100% probability better than CL and the DECT phone is to 90% better than the GSM phone.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"237 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132398968","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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