Pub Date : 2004-09-27DOI: 10.1109/AGEC.2004.1290865
C. Q. Cui, K. Pun
Green material requirement, i.e., lead-free and halogen-free, recently became a hot topic in IC packaging due to the environmental issues in increasing lead contamination and ozone concern in landfill and decomposition. The critical component on tape ball grid array (TBGA) reliability is heatsink adhesive which will be evaluated for the green material requirements to meet JEDEC moisture sensitivity level 3 (MSL 3) test at lead-free solder reflow condition. Therefore, TBGA package substrate is explored in this paper for lead-free and halogen-free requirements, by evaluating five types of heatsink adhesives. The five types of heatsink adhesives were qualified for eutectic solder applications. In the evaluation, all of the materials besides heatsink adhesives for the TBGA substrate with halogen content less than 900ppm are chosen to meet the halogen-free requirement. Any voids in the packages will be propagated and led to the delamination in the MSL-3 lead-free reliability test, since the package is subjected to high peak solder reflow temperature of 260/spl deg/C. It is found that the high resin flow or good flowability of heatsink adhesive is crucial for 2-ML TBGA in the lead-free application, where heatsink adhesive is required to laminate onto the ground solder mask without any void. Heatsink adhesive is also observed to be void-free, since any voids in the adhesive will result in the cohesive failure in the reliability test. In addition, moisture absorption of adhesive should be low enough to reduce the hygroscopic stress and then to improve its performance in the lead-free reliability test. In conclusions, adhesives A and B are qualified to be applicable in the lead-free and halogen-free applications for both 1-ML and 2-ML TBGA packages with their higher resin flow and low moisture absorption. With the same chemical structure and properties as adhesive B except lower resin flow, adhesive C is only recommended for I-ML TBGA in the lead-free and halogen-free applications.
{"title":"TBGA substrate for lead-free and halogen-free applications","authors":"C. Q. Cui, K. Pun","doi":"10.1109/AGEC.2004.1290865","DOIUrl":"https://doi.org/10.1109/AGEC.2004.1290865","url":null,"abstract":"Green material requirement, i.e., lead-free and halogen-free, recently became a hot topic in IC packaging due to the environmental issues in increasing lead contamination and ozone concern in landfill and decomposition. The critical component on tape ball grid array (TBGA) reliability is heatsink adhesive which will be evaluated for the green material requirements to meet JEDEC moisture sensitivity level 3 (MSL 3) test at lead-free solder reflow condition. Therefore, TBGA package substrate is explored in this paper for lead-free and halogen-free requirements, by evaluating five types of heatsink adhesives. The five types of heatsink adhesives were qualified for eutectic solder applications. In the evaluation, all of the materials besides heatsink adhesives for the TBGA substrate with halogen content less than 900ppm are chosen to meet the halogen-free requirement. Any voids in the packages will be propagated and led to the delamination in the MSL-3 lead-free reliability test, since the package is subjected to high peak solder reflow temperature of 260/spl deg/C. It is found that the high resin flow or good flowability of heatsink adhesive is crucial for 2-ML TBGA in the lead-free application, where heatsink adhesive is required to laminate onto the ground solder mask without any void. Heatsink adhesive is also observed to be void-free, since any voids in the adhesive will result in the cohesive failure in the reliability test. In addition, moisture absorption of adhesive should be low enough to reduce the hygroscopic stress and then to improve its performance in the lead-free reliability test. In conclusions, adhesives A and B are qualified to be applicable in the lead-free and halogen-free applications for both 1-ML and 2-ML TBGA packages with their higher resin flow and low moisture absorption. With the same chemical structure and properties as adhesive B except lower resin flow, adhesive C is only recommended for I-ML TBGA in the lead-free and halogen-free applications.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128332670","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-09-27DOI: 10.1109/AGEC.2004.1290898
M. Brandstotter, R. Knoth, B. Kopacek, P. Kopacek
Due to the fast pace of technological innovation, and the consequent shortening lifetimes of electronic products, particularly ICT equipment, a,flexible semi-automatic disassembling cell "/spl Sigma/! 1592 - Disassembly Factory" for extracting components from printed wire boards (PWB) has been developed. Based on these disassembling experiences design criteria for a re-use optimized structure of PWBs and electronic components have been defined in order to maximize the benefit for economy and environment. If industry becomes aware of the elaborated design criteria and uses these investigations, number of reusable components can be achieved and enhanced significantly hand in hand with the improved quality and positive feedback regarding landfill volume and depletion of primary materials.
{"title":"Closing the loop of printed-wire-boards and electronic devices: experiences from automatic disassembling as an input for manufacturers","authors":"M. Brandstotter, R. Knoth, B. Kopacek, P. Kopacek","doi":"10.1109/AGEC.2004.1290898","DOIUrl":"https://doi.org/10.1109/AGEC.2004.1290898","url":null,"abstract":"Due to the fast pace of technological innovation, and the consequent shortening lifetimes of electronic products, particularly ICT equipment, a,flexible semi-automatic disassembling cell \"/spl Sigma/! 1592 - Disassembly Factory\" for extracting components from printed wire boards (PWB) has been developed. Based on these disassembling experiences design criteria for a re-use optimized structure of PWBs and electronic components have been defined in order to maximize the benefit for economy and environment. If industry becomes aware of the elaborated design criteria and uses these investigations, number of reusable components can be achieved and enhanced significantly hand in hand with the improved quality and positive feedback regarding landfill volume and depletion of primary materials.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130569627","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-09-27DOI: 10.1109/AGEC.2004.1290911
W.K. Chiang, Y.C. Chan
The influence of the reflow process on the reliability of anisotropic conductive film (ACF) joints using bumpless chips was investigated. The contact resistance of the ACF joint was found to increase as the peak reflow temperature increased. The results also indicated bump height was not the controlling factor for the ACF joint reliability. During reliability test, bumpless chips proved to be unreliable owing to the inherent behavior of aluminum under a wet environment (corrosion-degradation). The moisture ingression into the ACF can lead to unstable reliability of the joint. Moreover, the ACF showed degradation in both chemical and physical properties, including modulus reduction, polymer hydrolysis, and surface swelling. In reflow soldering after temperature/humidity test, the ACF joint reliability was further deteriorated due to thermal-induced stress of different component CTE and hydroscopic swelling-induced stress of the epoxy.
{"title":"Reliability of ACF joint using bumpless chip after reflow process","authors":"W.K. Chiang, Y.C. Chan","doi":"10.1109/AGEC.2004.1290911","DOIUrl":"https://doi.org/10.1109/AGEC.2004.1290911","url":null,"abstract":"The influence of the reflow process on the reliability of anisotropic conductive film (ACF) joints using bumpless chips was investigated. The contact resistance of the ACF joint was found to increase as the peak reflow temperature increased. The results also indicated bump height was not the controlling factor for the ACF joint reliability. During reliability test, bumpless chips proved to be unreliable owing to the inherent behavior of aluminum under a wet environment (corrosion-degradation). The moisture ingression into the ACF can lead to unstable reliability of the joint. Moreover, the ACF showed degradation in both chemical and physical properties, including modulus reduction, polymer hydrolysis, and surface swelling. In reflow soldering after temperature/humidity test, the ACF joint reliability was further deteriorated due to thermal-induced stress of different component CTE and hydroscopic swelling-induced stress of the epoxy.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"430 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114953093","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-09-27DOI: 10.1109/AGEC.2004.1290912
C. Yin, H. Lu, C. Bailey, Y. Chan
In this paper, the effects of the solder reflow process on the reliability of anisotropic conductive film (ACF) interconnections for flip chip on flex (FCOF) applications are investigated. Experiments as well as computer modeling methods have been used. In the experiments, it was found that the contact resistance of ACF joints increased after the subsequent reflow process, and the magnitude of this increase was strongly correlated to the peak temperature of the reflow profile. Nearly 40% of the joints were opened (i.e. lifted away from the pad) after the reflow process with 260 /spl deg/C peak temperature while no opening was observed when the peak temperature was 210 /spl deg/C. It is believed that the CTE mismatch between the polymer particle and the adhesive matrix is the main cause of this contact degradation. It was also found that the ACF joints after the reflow process with 210 /spl deg/C peak temperature showed a high ability to resist water absorption under steady state 85 /spl deg/C/85%RH conditions, probably because the curing degree of the ACF was improved during the reflow process. To give a good understanding, a 3D model of an ACF joint structure was built and finite element analysis was used to predict the stress distribution in the conductive particles, adhesive matrix and metal pads during the reflow process.
{"title":"Effects of reflow process on the reliability of flip chip on flex interconnections using anisotropic conductive adhesives","authors":"C. Yin, H. Lu, C. Bailey, Y. Chan","doi":"10.1109/AGEC.2004.1290912","DOIUrl":"https://doi.org/10.1109/AGEC.2004.1290912","url":null,"abstract":"In this paper, the effects of the solder reflow process on the reliability of anisotropic conductive film (ACF) interconnections for flip chip on flex (FCOF) applications are investigated. Experiments as well as computer modeling methods have been used. In the experiments, it was found that the contact resistance of ACF joints increased after the subsequent reflow process, and the magnitude of this increase was strongly correlated to the peak temperature of the reflow profile. Nearly 40% of the joints were opened (i.e. lifted away from the pad) after the reflow process with 260 /spl deg/C peak temperature while no opening was observed when the peak temperature was 210 /spl deg/C. It is believed that the CTE mismatch between the polymer particle and the adhesive matrix is the main cause of this contact degradation. It was also found that the ACF joints after the reflow process with 210 /spl deg/C peak temperature showed a high ability to resist water absorption under steady state 85 /spl deg/C/85%RH conditions, probably because the curing degree of the ACF was improved during the reflow process. To give a good understanding, a 3D model of an ACF joint structure was built and finite element analysis was used to predict the stress distribution in the conductive particles, adhesive matrix and metal pads during the reflow process.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"249 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116067527","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-09-27DOI: 10.1109/AGEC.2004.1290895
P. Udomleartprasert
The green environment or environmental friendly has high important in today electronics business. The intense forces of customer, competitors as well as the government induced the electronics manufacturing rapidly implement the green process in their organization. In green manufacturing implementation, various factors must be prepared and well controlled in order to ensure the effectiveness. In this paper, we proposed the 6 basic requirements of preparation that can be grouped into product factors and environment factor. The result of research shows that the 5 factors of material, process, packaging, working environment and waste system are directly impact to the green management implementation. We also propose the green supply chain if the manufacturing promotes the same "Green Manufacturing System (GMS) to the lower tier supplier.
{"title":"Roadmap to green supply chain electronics: design for manufacturing implementation and management","authors":"P. Udomleartprasert","doi":"10.1109/AGEC.2004.1290895","DOIUrl":"https://doi.org/10.1109/AGEC.2004.1290895","url":null,"abstract":"The green environment or environmental friendly has high important in today electronics business. The intense forces of customer, competitors as well as the government induced the electronics manufacturing rapidly implement the green process in their organization. In green manufacturing implementation, various factors must be prepared and well controlled in order to ensure the effectiveness. In this paper, we proposed the 6 basic requirements of preparation that can be grouped into product factors and environment factor. The result of research shows that the 5 factors of material, process, packaging, working environment and waste system are directly impact to the green management implementation. We also propose the green supply chain if the manufacturing promotes the same \"Green Manufacturing System (GMS) to the lower tier supplier.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121952884","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-09-27DOI: 10.1109/AGEC.2004.1290862
B. Ong
Summary form only given. Silicon integrated circuits (ICs) are wonderful for numerous microelectronic applications. But for large-area devices and low-cost microelectronic applications where high computer powers or switching speeds are not needed, they become unjustifiably and prohibitively expensive. Plastic ICs composed of organic transistors and components are attractive alternatives for these applications as they can potentially be manufactured at low cost by solution processes such as coating, stamping, printing, etc. No capital-intensive photolithographic clean-room setups are required. Fabricating ICs via jet printing is particularly efficient and environmentally friendly as it is a direct-write process, and is amenable to the productive reel-to-reel manufacturing protocols. Organic transistors are also compatible with flexible substrates, thus enabling fabrication of compact, lightweight, flexible, and structurally inspiring microelectronic products. The ability to directly integrate ICs with other electronic components via printing may also contribute to lowered manufacturing cost as some of the costly packaging processes can be eliminated. Organic semiconductor polymers are appealing active materials for low-cost thin film transistor designs. For low-cost manufacturing, both the solution processability of materials and their ability to be processed at ambient without detrimental effects are of paramount importance. However, most of the current semiconductor polymers are not stable enough to permit processing and device fabrication in ambient conditions to achieve the required functionalities. We describe here our work on the semiconductor polymer design, their synthesis and processing that have led to the fabrication of polymer thin film transistors in ambient conditions with excellent field-effect transistor properties.
{"title":"Towards printed organic electronics","authors":"B. Ong","doi":"10.1109/AGEC.2004.1290862","DOIUrl":"https://doi.org/10.1109/AGEC.2004.1290862","url":null,"abstract":"Summary form only given. Silicon integrated circuits (ICs) are wonderful for numerous microelectronic applications. But for large-area devices and low-cost microelectronic applications where high computer powers or switching speeds are not needed, they become unjustifiably and prohibitively expensive. Plastic ICs composed of organic transistors and components are attractive alternatives for these applications as they can potentially be manufactured at low cost by solution processes such as coating, stamping, printing, etc. No capital-intensive photolithographic clean-room setups are required. Fabricating ICs via jet printing is particularly efficient and environmentally friendly as it is a direct-write process, and is amenable to the productive reel-to-reel manufacturing protocols. Organic transistors are also compatible with flexible substrates, thus enabling fabrication of compact, lightweight, flexible, and structurally inspiring microelectronic products. The ability to directly integrate ICs with other electronic components via printing may also contribute to lowered manufacturing cost as some of the costly packaging processes can be eliminated. Organic semiconductor polymers are appealing active materials for low-cost thin film transistor designs. For low-cost manufacturing, both the solution processability of materials and their ability to be processed at ambient without detrimental effects are of paramount importance. However, most of the current semiconductor polymers are not stable enough to permit processing and device fabrication in ambient conditions to achieve the required functionalities. We describe here our work on the semiconductor polymer design, their synthesis and processing that have led to the fabrication of polymer thin film transistors in ambient conditions with excellent field-effect transistor properties.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"421 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122122095","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-09-27DOI: 10.1109/AGEC.2004.1290884
Y. Liu, X.B. Wang
In this report, a preliminary investigation has been conducted on some lead free solder pastes containing Sn88Ag3.5Bi0.5In8 alloy. The wetting performances of these solder pastes on different substrates were studied under various reflow profiles. The test results of solder ball, slump and printing properties indicate that with a proper paste flux vehicle, lead free solder paste using Sn88Ag3.5Bi0.5In8 alloy may achieve a good performance.
{"title":"Lead free solder paste containing SnAgBiIn alloy: a preliminary study","authors":"Y. Liu, X.B. Wang","doi":"10.1109/AGEC.2004.1290884","DOIUrl":"https://doi.org/10.1109/AGEC.2004.1290884","url":null,"abstract":"In this report, a preliminary investigation has been conducted on some lead free solder pastes containing Sn88Ag3.5Bi0.5In8 alloy. The wetting performances of these solder pastes on different substrates were studied under various reflow profiles. The test results of solder ball, slump and printing properties indicate that with a proper paste flux vehicle, lead free solder paste using Sn88Ag3.5Bi0.5In8 alloy may achieve a good performance.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121470179","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-09-27DOI: 10.1109/AGEC.2004.1290858
H. Hesselbom, G. Norberg, S. Dejanovic, D. Haglund
Flip Chip connections enormously reduces the amount of solder as compared to mounting packaged devices, apart from also offering superior high frequency properties and placement density. However, when assembling chips to substrates having different thermal expansion coefficient, the solder balls are exposed to strain, the more so the denser the connections (and consequently smaller balls), and the higher the power densities, resulting in wider temperature cycles. This will usually result in loss of contact reliability. Using other materials than solder or using underfills may partially improve the situation, but causes other problems. In order to test another concept maintaining or exceeding the excellent HF and density properties of conventional Flip Chip, while practically eliminating the thermal mismatch problems and providing effortless chip replacement, the Elastic Chip Socket was developed. Silicone elastomer was molded in a precision mold made using anisotropic etching of Si. These structures were subsequently metallized and the metal patterned using electro plated resist. So far functional chip sockets with pin densities of 45 000 pins per cm/sup 2/ (22 500 simultaneously functional connections to a 7 x 7 mm die) and more have been achieved which endure multiple repeated matings and quick temperature cycling between -40 /spl deg/C and +90 /spl deg/C. The following is a summary of the group's achievement this far, Oct. 2003.
与安装封装器件相比，倒装芯片连接大大减少了焊料的数量，此外还提供了卓越的高频特性和放置密度。然而，当将芯片组装到具有不同热膨胀系数的基板上时，焊料球暴露于应变，连接越密(因此球越小)，功率密度越高，导致更宽的温度循环。这通常会导致触点可靠性的丧失。使用除焊料以外的其他材料或使用下填料可能会部分改善这种情况，但会引起其他问题。为了测试另一种概念，保持或超过传统倒装芯片的优异高频和密度特性，同时实际上消除了热失配问题，并提供轻松的芯片更换，开发了弹性芯片插座。利用硅的各向异性蚀刻技术在精密模具上对硅弹性体进行了成型。这些结构随后被金属化，金属图案使用电镀抗蚀剂。到目前为止，功能芯片插座的引脚密度为每厘米45 000个引脚/sup 2/(22 500个同时功能连接到7 x 7 mm芯片)，并且已经实现了更多的功能，可以承受多次重复配合和在-40 /spl°C和+90 /spl°C之间的快速温度循环。以下是该小组2003年10月至今所取得成就的总结。
{"title":"Solder and adhesive free chip assembly using elastic chip sockets: concept, manufacture and preliminary investigations","authors":"H. Hesselbom, G. Norberg, S. Dejanovic, D. Haglund","doi":"10.1109/AGEC.2004.1290858","DOIUrl":"https://doi.org/10.1109/AGEC.2004.1290858","url":null,"abstract":"Flip Chip connections enormously reduces the amount of solder as compared to mounting packaged devices, apart from also offering superior high frequency properties and placement density. However, when assembling chips to substrates having different thermal expansion coefficient, the solder balls are exposed to strain, the more so the denser the connections (and consequently smaller balls), and the higher the power densities, resulting in wider temperature cycles. This will usually result in loss of contact reliability. Using other materials than solder or using underfills may partially improve the situation, but causes other problems. In order to test another concept maintaining or exceeding the excellent HF and density properties of conventional Flip Chip, while practically eliminating the thermal mismatch problems and providing effortless chip replacement, the Elastic Chip Socket was developed. Silicone elastomer was molded in a precision mold made using anisotropic etching of Si. These structures were subsequently metallized and the metal patterned using electro plated resist. So far functional chip sockets with pin densities of 45 000 pins per cm/sup 2/ (22 500 simultaneously functional connections to a 7 x 7 mm die) and more have been achieved which endure multiple repeated matings and quick temperature cycling between -40 /spl deg/C and +90 /spl deg/C. The following is a summary of the group's achievement this far, Oct. 2003.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117124699","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-09-27DOI: 10.1109/AGEC.2004.1290875
L. Loh, S. Canonico, A. Degher, R. Moore
At HP, we believe that environmentally sustainable development is not an option, but an imperative. HP works toward a sustainable future by developing programs that reduce our environmental footprint, as well as those of our customers and partners. Our vision is to develop products and solutions, and operate our company in such a way, that we are able to lead global businesses toward a sustainable future.
{"title":"Integrating environmental product design into HP inkjet printing supplies","authors":"L. Loh, S. Canonico, A. Degher, R. Moore","doi":"10.1109/AGEC.2004.1290875","DOIUrl":"https://doi.org/10.1109/AGEC.2004.1290875","url":null,"abstract":"At HP, we believe that environmentally sustainable development is not an option, but an imperative. HP works toward a sustainable future by developing programs that reduce our environmental footprint, as well as those of our customers and partners. Our vision is to develop products and solutions, and operate our company in such a way, that we are able to lead global businesses toward a sustainable future.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115477558","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-09-27DOI: 10.1109/AGEC.2004.1290913
Y.S. Chen, C.S. Wang, A.C. Shiah
For the most recent developed BGA components, such as flip chip BGAs and wafer level CSPs (WLCSP), all are required to have reliability tests conducted before being launched into mass production. Among the mechanical stress tests for electronic components, the most commonly seen are vibration tests, bend tests and shock tests. Rarely seen is the shear test for an electronic component with solder balls mounted on the printed circuit boards. This paper discusses the effects of various under-fills on a WLCSP through a series of shear tests and bend tests. The technique is applicable to new package designs, even for those with environmentally compatible materials.
{"title":"An experimental study of the under-fill effects for WLCSP components","authors":"Y.S. Chen, C.S. Wang, A.C. Shiah","doi":"10.1109/AGEC.2004.1290913","DOIUrl":"https://doi.org/10.1109/AGEC.2004.1290913","url":null,"abstract":"For the most recent developed BGA components, such as flip chip BGAs and wafer level CSPs (WLCSP), all are required to have reliability tests conducted before being launched into mass production. Among the mechanical stress tests for electronic components, the most commonly seen are vibration tests, bend tests and shock tests. Rarely seen is the shear test for an electronic component with solder balls mounted on the printed circuit boards. This paper discusses the effects of various under-fills on a WLCSP through a series of shear tests and bend tests. The technique is applicable to new package designs, even for those with environmentally compatible materials.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"323 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115843802","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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