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Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits最新文献

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A macromodeling Approach To Process Simulator Tuning 过程模拟器调优的宏建模方法
Pub Date : 1990-06-03 DOI: 10.1109/NUPAD.1990.748255
J. Brockman, S. W. Director
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引用次数: 4
Numerical Integral Method For 2d Diffusion Simulation 二维扩散模拟的数值积分法
Pub Date : 1990-06-03 DOI: 10.1109/NUPAD.1990.748279
Xiao‐Bo Tian, A. Strojwas
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引用次数: 0
Hydrodynamic Simulation Of P-n Junctions In The Breakdown Regime 击穿区P-n结的流体力学模拟
Pub Date : 1990-06-03 DOI: 10.1109/NUPAD.1990.748269
W. Quade, M. Rudan
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引用次数: 0
A Generalized Formulation of Augmented Drift-Diffusion Transport Suitable for Use in General Purpose Device Simulators 适用于通用设备模拟器的增广漂移扩散输运的广义公式
Pub Date : 1990-06-03 DOI: 10.1109/NUPAD.1990.748265
P. Blakey, X. Wang, C. Maziar
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引用次数: 5
An Adaptive Grid Refinement Strategy for the Drift-Diffusion 漂移扩散的自适应网格细化策略
Pub Date : 1990-06-03 DOI: 10.1109/NUPAD.1990.748288
J.F. Bilrgler, W. M. Coughran, W. Fichtner
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引用次数: 0
Numerical Solution Of Diffusion Equations On Time-variant Domains 时变域上扩散方程的数值解
Pub Date : 1990-06-03 DOI: 10.1109/NUPAD.1990.748252
M. Paffrath, K. Steger
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引用次数: 2
A Concurrent Conjugate-gradient-based 3-d Device Equation Solver Including Latency 一种基于并发共轭梯度的含延迟三维器件方程求解器
Pub Date : 1990-06-03 DOI: 10.1109/NUPAD.1990.748262
J. Chern, K. Mayaram, L. Arledge, P. Yang
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引用次数: 3
/spl Omega/ - An Octree-based Mixed Element Grid Allocator For Adaptive 3d Device Simulation /spl Omega/ -一种基于八叉树的混合元素网格分配器,用于自适应3d设备仿真
Pub Date : 1990-06-03 DOI: 10.1109/NUPAD.1990.748259
P. Conti, N. Hitschfeld, W. Fichtner
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引用次数: 10
Mosfet Submicron Model For Temperature Effect Characterization 温度效应表征的Mosfet亚微米模型
Pub Date : 1990-06-03 DOI: 10.1109/NUPAD.1990.748282
H. Masuda, R. Ikematsu, J. Mano, H. Sugihara
This paper presents a new circuit model for sub-um NMOSFETs and describes experiments on them. The model is focused on the temperature effect on I-V and CV characteristics. The resulting I-V modeling error (RMS: Root Mean Square) is verified to be less than 1.5% for Vd=O-SV and Vg=O-SV operating conditions, and 300-450K temperature range. The CV model error also examined, showing 6.0% at 400K. Drain current characteristics were measured with a 0.8um NMOS under various temperature conditions. Through experiments and parameter extraction (for MOSTSM model[ 1][2]) on the measured I-V data, the following results are noted (see Fig. 1). (1) Channel conductance of a unit area (Po) exhibits a significant decrease (one half) for the temperature rise from 300K to 450K. However, the corresponding drain current reduction is only 20% at Vds=Vgs=SV. (2) The above effect is caused by a change in the gate-field effect factor of channelconductance (eel ), which shows a monotonic decrease for rising temperature [4]. MOST temperature model
本文提出了一种新的亚微米nmosfet电路模型,并对其进行了实验。该模型的重点是温度对I-V和CV特性的影响。在Vd=O-SV和Vg=O-SV工况下,以及300-450K温度范围内,由此产生的I-V建模误差(RMS:均方根)小于1.5%。还检查了CV模型误差,在400K时显示6.0%。用0.8um NMOS测量了不同温度条件下的漏极电流特性。通过对实测I-V数据进行实验和参数提取(对于MOSTSM模型[1][2]),得到如下结果(见图1):(1)从300K到450K温度升高,单位面积沟道电导(Po)显著减小(一半)。然而,在Vds=Vgs=SV时,相应的漏极电流减少仅为20%。(2)上述效应是由通道电导门场效应因子(eel)的变化引起的,随着温度的升高,通道电导门场效应因子呈单调下降趋势。MOST温度模型
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引用次数: 0
Comparison Between Drift-diffusion Model And Hydrodynamic Model For Sub-micron Mosfets 亚微米mosfet漂移扩散模型与流体动力学模型的比较
Pub Date : 1990-06-03 DOI: 10.1109/NUPAD.1990.748292
H. Oda, N. Kotani, M. Shirahata, M. Fujinaga, Y. Akasaka
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引用次数: 0
期刊
Workshop on Numerical Modeling of Processes and Devices for Integrated Circuits
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