Pub Date : 2005-07-07DOI: 10.1109/STYSW.2005.1617798
P. Matkowski, Qi Haiyu
Reliability of electronic devices is a crucial scope of interest of the electronic manufacturing industry. The reliability is connected with electrical, thermal and mechanical properties of investigated products. Electrical and thermal properties are investigated during the specified tests such as thermal shocks, temperature, and humidity cycles, dry oven storage. Mechanical properties are concerned of mounted components are mainly problem of the assembly industry. At the present electronic components are mounted to the PCB mostly by surface mount technology (SMT) or flip chip processes. The lead-solders are being presently replaced with lead-free solders or electrically conductive adhesives. It is caused by the European and Japanese restrictions. The restrictions forbid using lead in consumer electronic products because of its harmful influence on beings. The new solders and assembly technology force to the following investigations of reliability of joints. This paper contains information about information tests as accelerated tests commonly used to evaluate fatigue life of interconnections in electronic assembly. In the first part of the paper short review of accelerated tests is presented. Anand's model of the solder joint used in finite elements analysis (FEA) and Darveaux's crack initiation and growth model are also mentioned, The bases of FEA and DOE are beyond the scope of this paper. In the second part of the paper harmonic as well as random variation and two different constructions of shakers, their advantages, limitations and requirements are presented. Characterization of specimen and vibration setup is considered. At the end of the paper vibration test is proposed
{"title":"Vibration tests utilization in the study of reliability of connections in microelectronics","authors":"P. Matkowski, Qi Haiyu","doi":"10.1109/STYSW.2005.1617798","DOIUrl":"https://doi.org/10.1109/STYSW.2005.1617798","url":null,"abstract":"Reliability of electronic devices is a crucial scope of interest of the electronic manufacturing industry. The reliability is connected with electrical, thermal and mechanical properties of investigated products. Electrical and thermal properties are investigated during the specified tests such as thermal shocks, temperature, and humidity cycles, dry oven storage. Mechanical properties are concerned of mounted components are mainly problem of the assembly industry. At the present electronic components are mounted to the PCB mostly by surface mount technology (SMT) or flip chip processes. The lead-solders are being presently replaced with lead-free solders or electrically conductive adhesives. It is caused by the European and Japanese restrictions. The restrictions forbid using lead in consumer electronic products because of its harmful influence on beings. The new solders and assembly technology force to the following investigations of reliability of joints. This paper contains information about information tests as accelerated tests commonly used to evaluate fatigue life of interconnections in electronic assembly. In the first part of the paper short review of accelerated tests is presented. Anand's model of the solder joint used in finite elements analysis (FEA) and Darveaux's crack initiation and growth model are also mentioned, The bases of FEA and DOE are beyond the scope of this paper. In the second part of the paper harmonic as well as random variation and two different constructions of shakers, their advantages, limitations and requirements are presented. Characterization of specimen and vibration setup is considered. At the end of the paper vibration test is proposed","PeriodicalId":351138,"journal":{"name":"Proceedings of 2005 International Students and Young Scientists Workshop Photonics and Microsystems, 2005.","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-07-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127772384","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-07-07DOI: 10.1109/STYSW.2005.1617794
E. Griese
The paper presents the basic fundamentals of optical interconnection technology on the printed circuit board level. Different technology approaches for realizing board-integrated waveguides are presented and discussed. Moreover, the simulation and design of optical multimode interconnects within an electrical environment is addressed
{"title":"Optical interconnection technology on the printed circuit board level: fundamentals, technology, design","authors":"E. Griese","doi":"10.1109/STYSW.2005.1617794","DOIUrl":"https://doi.org/10.1109/STYSW.2005.1617794","url":null,"abstract":"The paper presents the basic fundamentals of optical interconnection technology on the printed circuit board level. Different technology approaches for realizing board-integrated waveguides are presented and discussed. Moreover, the simulation and design of optical multimode interconnects within an electrical environment is addressed","PeriodicalId":351138,"journal":{"name":"Proceedings of 2005 International Students and Young Scientists Workshop Photonics and Microsystems, 2005.","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-07-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116488018","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-07-07DOI: 10.1109/STYSW.2005.1617799
P. Psuja, W. Stręk, D. Hreniak
Field emission displays using carbon nanotubes (CNT-FEDs) are ones of the most promising devices which can compete with other technologies such as liquid crystal displays (LCDs). Good picture quality, a low power consumption, a wide work temperature range and a high efficiency of luminescence are the great advantages of that technology. In this work, new and a low-cost method of electrophoretic deposition of CNTs on the ITO-glass slide is presented. Deposition of the light emitting layer was also done by the same method. The Eu3+:Y2O3 nanocrystalline phosphor prepared by modified Pechini method was used as emitting layer in tested the FED construction. The satisfied light intensity was observed under the vacuum level of about 1 times 10-5 Tr, and accelerating voltage of 500 V. Application of other rare-earth ions doped nanocrystalline phosphors in CNT-FED is discussed
{"title":"Fabrication of a low-voltage light emitting device based on carbon nanotubes and rare-earth doped nanocrystals","authors":"P. Psuja, W. Stręk, D. Hreniak","doi":"10.1109/STYSW.2005.1617799","DOIUrl":"https://doi.org/10.1109/STYSW.2005.1617799","url":null,"abstract":"Field emission displays using carbon nanotubes (CNT-FEDs) are ones of the most promising devices which can compete with other technologies such as liquid crystal displays (LCDs). Good picture quality, a low power consumption, a wide work temperature range and a high efficiency of luminescence are the great advantages of that technology. In this work, new and a low-cost method of electrophoretic deposition of CNTs on the ITO-glass slide is presented. Deposition of the light emitting layer was also done by the same method. The Eu3+:Y2O3 nanocrystalline phosphor prepared by modified Pechini method was used as emitting layer in tested the FED construction. The satisfied light intensity was observed under the vacuum level of about 1 times 10-5 Tr, and accelerating voltage of 500 V. Application of other rare-earth ions doped nanocrystalline phosphors in CNT-FED is discussed","PeriodicalId":351138,"journal":{"name":"Proceedings of 2005 International Students and Young Scientists Workshop Photonics and Microsystems, 2005.","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-07-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133632863","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-07-07DOI: 10.1109/STYSW.2005.1617789
J. Domaradzki, A. Borkowska, D. Kaczmarek
The presentation reports on transparent titanium oxide thin film and its photonic applications. Optical transmission and optical beam induced current (OBIC) measurements are presented
本文报道了透明氧化钛薄膜及其在光子领域的应用。介绍了光传输和光束感应电流(OBIC)的测量
{"title":"Transparent thin films based on titanium oxides for photonic applications","authors":"J. Domaradzki, A. Borkowska, D. Kaczmarek","doi":"10.1109/STYSW.2005.1617789","DOIUrl":"https://doi.org/10.1109/STYSW.2005.1617789","url":null,"abstract":"The presentation reports on transparent titanium oxide thin film and its photonic applications. Optical transmission and optical beam induced current (OBIC) measurements are presented","PeriodicalId":351138,"journal":{"name":"Proceedings of 2005 International Students and Young Scientists Workshop Photonics and Microsystems, 2005.","volume":"89 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-07-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122094119","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-07-07DOI: 10.1109/STYSW.2005.1617793
M. Salhi, K. Ezdi
In this paper we show semi-confocal far-infrared laser (FIRL)- imaging system and some images taken with this system
本文介绍了半共聚焦远红外激光(FIRL)成像系统以及用该系统拍摄的一些图像
{"title":"Semi-confocal imaging with optically pumped FIR-laser","authors":"M. Salhi, K. Ezdi","doi":"10.1109/STYSW.2005.1617793","DOIUrl":"https://doi.org/10.1109/STYSW.2005.1617793","url":null,"abstract":"In this paper we show semi-confocal far-infrared laser (FIRL)- imaging system and some images taken with this system","PeriodicalId":351138,"journal":{"name":"Proceedings of 2005 International Students and Young Scientists Workshop Photonics and Microsystems, 2005.","volume":"76 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-07-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128393829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-07-07DOI: 10.1109/STYSW.2005.1617792
L. Gelczuk, G. Józwiak, M. Dąbrowska-szata, D. Radziewicz
In this paper, two deep electron traps (E1 or the extended defect and E2 or the point defect) have been detected in partially relaxed InGaAs/GaAs heterostructure by means of deep level transient spectroscopy (DLTS) technique
{"title":"Dislocation in lattice-mismatched InGaAs/GaAs heterostructures as a factor of optoelectronic device degradation","authors":"L. Gelczuk, G. Józwiak, M. Dąbrowska-szata, D. Radziewicz","doi":"10.1109/STYSW.2005.1617792","DOIUrl":"https://doi.org/10.1109/STYSW.2005.1617792","url":null,"abstract":"In this paper, two deep electron traps (E1 or the extended defect and E2 or the point defect) have been detected in partially relaxed InGaAs/GaAs heterostructure by means of deep level transient spectroscopy (DLTS) technique","PeriodicalId":351138,"journal":{"name":"Proceedings of 2005 International Students and Young Scientists Workshop Photonics and Microsystems, 2005.","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-07-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132027328","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-07-07DOI: 10.1109/STYSW.2005.1617791
Ulrich Fischer-Hirchert
In this report, different fiber-chip coupling concepts are presented. Automated coupling process, as well as different modules for laser welding, gluing and mechanical fixation are also discussed. Thermal stress tests are reported
{"title":"Photonic packaging for optical communications systems-basics and applications","authors":"Ulrich Fischer-Hirchert","doi":"10.1109/STYSW.2005.1617791","DOIUrl":"https://doi.org/10.1109/STYSW.2005.1617791","url":null,"abstract":"In this report, different fiber-chip coupling concepts are presented. Automated coupling process, as well as different modules for laser welding, gluing and mechanical fixation are also discussed. Thermal stress tests are reported","PeriodicalId":351138,"journal":{"name":"Proceedings of 2005 International Students and Young Scientists Workshop Photonics and Microsystems, 2005.","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-07-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130273103","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2005-07-07DOI: 10.1109/STYSW.2005.1617788
G. Clarici, E. Griese
The design of optical interconnects within an electrical environment requires a close coupling of the respective modeling and simulation tools. For the lasers in optical interconnects exist a number of different models, which usually require detailed and, for the manufacturer, sensitive information concerning the laser structure and therefore the manufacturing process. Similar problems were an issue in electronic system design, but have been solved by employing generic high-level simulation models. Taking the same approach for optical interconnects an analytical approximate solution of the laser rate equations is presented as a first step. Due to its analytical nature, the model can either use parameters derived from the laser structural data or parameters gained from measurement. This is an advantage when dealing with devices with unknown structure
{"title":"Analytical laser model for optical signal integrity analysis","authors":"G. Clarici, E. Griese","doi":"10.1109/STYSW.2005.1617788","DOIUrl":"https://doi.org/10.1109/STYSW.2005.1617788","url":null,"abstract":"The design of optical interconnects within an electrical environment requires a close coupling of the respective modeling and simulation tools. For the lasers in optical interconnects exist a number of different models, which usually require detailed and, for the manufacturer, sensitive information concerning the laser structure and therefore the manufacturing process. Similar problems were an issue in electronic system design, but have been solved by employing generic high-level simulation models. Taking the same approach for optical interconnects an analytical approximate solution of the laser rate equations is presented as a first step. Due to its analytical nature, the model can either use parameters derived from the laser structural data or parameters gained from measurement. This is an advantage when dealing with devices with unknown structure","PeriodicalId":351138,"journal":{"name":"Proceedings of 2005 International Students and Young Scientists Workshop Photonics and Microsystems, 2005.","volume":"72 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-07-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132105307","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/stysw.2005.1617810
M. Wośko, B. Paszkiewicz, T. Piasecki, A. Szyszka, R. Paszkiewicz, M. Tlaczala
The paper reports on functionally graded materials (FGM), their classification and properties, the application of FGM for optoelectronic devices (epitaxially buffer layers, waveguides, photodetectors, solar cells) and modelling of FGM (generation function and band-gap structure)
{"title":"Application and modeling of functionally graded materials for optoelectronic devices","authors":"M. Wośko, B. Paszkiewicz, T. Piasecki, A. Szyszka, R. Paszkiewicz, M. Tlaczala","doi":"10.1109/stysw.2005.1617810","DOIUrl":"https://doi.org/10.1109/stysw.2005.1617810","url":null,"abstract":"The paper reports on functionally graded materials (FGM), their classification and properties, the application of FGM for optoelectronic devices (epitaxially buffer layers, waveguides, photodetectors, solar cells) and modelling of FGM (generation function and band-gap structure)","PeriodicalId":351138,"journal":{"name":"Proceedings of 2005 International Students and Young Scientists Workshop Photonics and Microsystems, 2005.","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115764612","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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