Pub Date : 2023-05-10DOI: 10.1109/ISSE57496.2023.10168325
S. Lotfi, M. Janda, T. Blecha
In this paper, a new method with possible challenges for the development of microstrip resonators using Printed Electronics (PE) methods as an alternative technology to fabricate Radio Frequency (RF) circuits is presented. To validate the utilization of PE technology, two microstrip resonators were designed and simulated. Designed resonators are then realized with a dispensing (or so-called direct-write) printing system on a DuPont Teijin flexible polyethylene terephthalate (PET) foil with a thickness of 175 $mu$m and a dielectric constatnt of 3. Simulated and measured frequency responses are compared, the process of printing microstrip structures is examined and results are discussed.
{"title":"Utilization of Direct-Write for the Realization of a Microstrip Resonator on a Flexible Substrate","authors":"S. Lotfi, M. Janda, T. Blecha","doi":"10.1109/ISSE57496.2023.10168325","DOIUrl":"https://doi.org/10.1109/ISSE57496.2023.10168325","url":null,"abstract":"In this paper, a new method with possible challenges for the development of microstrip resonators using Printed Electronics (PE) methods as an alternative technology to fabricate Radio Frequency (RF) circuits is presented. To validate the utilization of PE technology, two microstrip resonators were designed and simulated. Designed resonators are then realized with a dispensing (or so-called direct-write) printing system on a DuPont Teijin flexible polyethylene terephthalate (PET) foil with a thickness of 175 $mu$m and a dielectric constatnt of 3. Simulated and measured frequency responses are compared, the process of printing microstrip structures is examined and results are discussed.","PeriodicalId":373085,"journal":{"name":"2023 46th International Spring Seminar on Electronics Technology (ISSE)","volume":"592 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123188205","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-10DOI: 10.1109/ISSE57496.2023.10168424
Mariya Aleksandrova
Carbyne is an allotrope of carbon with linear molecules and its application is still under investigation. As a carbon-based nanomaterial, it is applicable for sensing applications, as it has physical and electronic properties that facilitate the detection of substances in gaseous compounds. The technology for the deposition of electrodes is important for the sensor performance. The replacement of the conventional vacuum-deposited metal electrodes with a conductive material grown at lower temperatures would be the preferable approach to avoid defects on the carbyne surface. In this study, a conductive ink from conjugated polymer poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) mixed with graphene was spray deposited on carbyne coating. The possibility for patterning of the organic film as comb electrodes were investigated, aiming for future fabrication of surface acoustic wave gas sensors with organic contacts. It was found that the sheet resistance is stable at different temperatures and decreased only with ~ 1.1 Ω/sq at annealing up to 200 °C. The patterning procedure resulted in a minimal size of ~5 μm for the comb pitch, without significant change in the contact parameters of the system like interface capacitance, impedance and surface roughness. To the author’s knowledge, this is the first study of organic/organic interface, involving carbyne nanomaterial for future sensing platforms.
{"title":"Investigation of Conductive Organic Films Grown on Carbyne Gas Sensing Nanomaterial","authors":"Mariya Aleksandrova","doi":"10.1109/ISSE57496.2023.10168424","DOIUrl":"https://doi.org/10.1109/ISSE57496.2023.10168424","url":null,"abstract":"Carbyne is an allotrope of carbon with linear molecules and its application is still under investigation. As a carbon-based nanomaterial, it is applicable for sensing applications, as it has physical and electronic properties that facilitate the detection of substances in gaseous compounds. The technology for the deposition of electrodes is important for the sensor performance. The replacement of the conventional vacuum-deposited metal electrodes with a conductive material grown at lower temperatures would be the preferable approach to avoid defects on the carbyne surface. In this study, a conductive ink from conjugated polymer poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) mixed with graphene was spray deposited on carbyne coating. The possibility for patterning of the organic film as comb electrodes were investigated, aiming for future fabrication of surface acoustic wave gas sensors with organic contacts. It was found that the sheet resistance is stable at different temperatures and decreased only with ~ 1.1 Ω/sq at annealing up to 200 °C. The patterning procedure resulted in a minimal size of ~5 μm for the comb pitch, without significant change in the contact parameters of the system like interface capacitance, impedance and surface roughness. To the author’s knowledge, this is the first study of organic/organic interface, involving carbyne nanomaterial for future sensing platforms.","PeriodicalId":373085,"journal":{"name":"2023 46th International Spring Seminar on Electronics Technology (ISSE)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114166974","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-10DOI: 10.1109/ISSE57496.2023.10168365
I. Wodak, A. Yakymovych, G. Khatibi
In this research, the impact of Fe nanoparticles (NPs) addition on the microstructure and mechanical properties of Sn-3.5Ag solder joints was investigated. As opposed to the more pronounced approach of adding NPs directly to the solder paste, varying concentrations of nanoparticles (0.0 – 2.0 wt.%) were mixed with the flux to increase their concentration at the interface and to control the formation and growth of intermetallic compound layers (IMCs) in more effective way. The solder joints were subjected to thermal treatment at different temperatures and durations, and the growth rate of the IMCs in the as-reflowed and aged samples was examined. It was found that the application of Fe-NPs doped flux led to an increase in the shear strength of the solder joints. This improvement could be attributed to the reduction in the growth rate of brittle intermetallic phases as well as refinement of the microstructure.
{"title":"Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-based Solders with nano-sized Fe doped Flux","authors":"I. Wodak, A. Yakymovych, G. Khatibi","doi":"10.1109/ISSE57496.2023.10168365","DOIUrl":"https://doi.org/10.1109/ISSE57496.2023.10168365","url":null,"abstract":"In this research, the impact of Fe nanoparticles (NPs) addition on the microstructure and mechanical properties of Sn-3.5Ag solder joints was investigated. As opposed to the more pronounced approach of adding NPs directly to the solder paste, varying concentrations of nanoparticles (0.0 – 2.0 wt.%) were mixed with the flux to increase their concentration at the interface and to control the formation and growth of intermetallic compound layers (IMCs) in more effective way. The solder joints were subjected to thermal treatment at different temperatures and durations, and the growth rate of the IMCs in the as-reflowed and aged samples was examined. It was found that the application of Fe-NPs doped flux led to an increase in the shear strength of the solder joints. This improvement could be attributed to the reduction in the growth rate of brittle intermetallic phases as well as refinement of the microstructure.","PeriodicalId":373085,"journal":{"name":"2023 46th International Spring Seminar on Electronics Technology (ISSE)","volume":"97 11","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132478271","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-10DOI: 10.1109/ISSE57496.2023.10168461
A. Pietrikova, Daniel Dzivý, L. Livovsky, J. Saliga, P. Horňak
We present the results of an experimental study comparing the effect of PCB surface finishes on the mechanical properties of soldered joints: maximum strength, strain hardening area, necking area (tendency to brittle failure), and energy consumed to break the joint. For the study, 4 types of standard PCB surface finishes were used, which we compare with various non-standard SnAg-based surface finishes. The measurements were carried out through shear tests. Failure mode, strength and fracture energy data, and analysis of the strain hardening area of brittle failure or necking were supplemented by microscopic SEM analyses of surfaces after failure. Our results show the influence of the surface finish type on the joints’ quality and reliability when applying SAC 305 solder after one and 5 reflows. Our previous analyzes showed that the SnAg5 surface finish had demonstrably better wettability. Still, a comparative study of the surface finish’s effect on the joints’ mechanical properties showed that the SnAg7 surface finish shows better properties even after repeated reflow processes. In both cases, the SnAg surface finish group has comparable properties to the ENIG finish.
{"title":"Comparative Study on the Effect of Surface Finish on Mechanical Properties of Solder Joints","authors":"A. Pietrikova, Daniel Dzivý, L. Livovsky, J. Saliga, P. Horňak","doi":"10.1109/ISSE57496.2023.10168461","DOIUrl":"https://doi.org/10.1109/ISSE57496.2023.10168461","url":null,"abstract":"We present the results of an experimental study comparing the effect of PCB surface finishes on the mechanical properties of soldered joints: maximum strength, strain hardening area, necking area (tendency to brittle failure), and energy consumed to break the joint. For the study, 4 types of standard PCB surface finishes were used, which we compare with various non-standard SnAg-based surface finishes. The measurements were carried out through shear tests. Failure mode, strength and fracture energy data, and analysis of the strain hardening area of brittle failure or necking were supplemented by microscopic SEM analyses of surfaces after failure. Our results show the influence of the surface finish type on the joints’ quality and reliability when applying SAC 305 solder after one and 5 reflows. Our previous analyzes showed that the SnAg5 surface finish had demonstrably better wettability. Still, a comparative study of the surface finish’s effect on the joints’ mechanical properties showed that the SnAg7 surface finish shows better properties even after repeated reflow processes. In both cases, the SnAg surface finish group has comparable properties to the ENIG finish.","PeriodicalId":373085,"journal":{"name":"2023 46th International Spring Seminar on Electronics Technology (ISSE)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129585932","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-10DOI: 10.1109/ISSE57496.2023.10168481
T. Lenger, A. Pietrikova, Peter Lukacs, L. Livovsky
This paper is focused on the possibilities of embedded vias’ creating based on different solder alloys. Tested samples consist of two double-sided printed circuit boards and the laminate’s core without copper laminated between them. The purpose of this research was to establish the cost-effective, less technologically demanding, and embedded components’ technologies compatible via connections, which could remove chemically based technological steps. Realized embedded vias have a diameter of 700 μm. Embedded vias were analyzed based on electrical properties as well as cross section method. There were three solder pastes with a different melting point used for this experiment. Solder pastes are an inseparable part of the multilayer PCBs but embedding the solder pastes into the substrate brings other technological challenges. This research shows that solder balls represent the more effective and stable possibility for the realization of the embedded vias. Embedded vias based on Sn96.5Ag3Cu0.5 solder balls have shown stable properties after multiple reflow processes.
{"title":"Analysis of the Possibilities of Creating Embedded Vias’ Based on Different Solder Alloys","authors":"T. Lenger, A. Pietrikova, Peter Lukacs, L. Livovsky","doi":"10.1109/ISSE57496.2023.10168481","DOIUrl":"https://doi.org/10.1109/ISSE57496.2023.10168481","url":null,"abstract":"This paper is focused on the possibilities of embedded vias’ creating based on different solder alloys. Tested samples consist of two double-sided printed circuit boards and the laminate’s core without copper laminated between them. The purpose of this research was to establish the cost-effective, less technologically demanding, and embedded components’ technologies compatible via connections, which could remove chemically based technological steps. Realized embedded vias have a diameter of 700 μm. Embedded vias were analyzed based on electrical properties as well as cross section method. There were three solder pastes with a different melting point used for this experiment. Solder pastes are an inseparable part of the multilayer PCBs but embedding the solder pastes into the substrate brings other technological challenges. This research shows that solder balls represent the more effective and stable possibility for the realization of the embedded vias. Embedded vias based on Sn96.5Ag3Cu0.5 solder balls have shown stable properties after multiple reflow processes.","PeriodicalId":373085,"journal":{"name":"2023 46th International Spring Seminar on Electronics Technology (ISSE)","volume":"202 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122819422","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-10DOI: 10.1109/ISSE57496.2023.10168479
Adrian Pietruszka, P. Górecki, A. Skwarek
The effect of composite solder joint fabrication on the thermal properties of MOSFETs was investigated. On the basis of the reference alloy (SAC0307), reinforced composite solder joints with the addition of titanium oxide nanopowder (TiO2 nanoparticles) were prepared. Reinforced joints differed in the weight percentage of TiO2, ranging from 0.125 to 1.0 wt%. MOSFET transistors in the TO-263 package were soldered to metal core substrates (MCPCB). The transient thermal impedance Zthj-a(t) was measured using an indirect electrical method. Based on the measured values, thermal resistances Rthj-a were determined. It was proven that the thermal resistance Rthj-a depends on TiO2 concentration in the composite solder joint, having a minimum at the level of 0.25 wt%. The research highlights the importance of the soldering technology used in the case of the assembly of MOSFETs devices.
{"title":"Influence of SAC0307-TiO2 Composite Solder Joint on Thermal Parameters of MOSFETs","authors":"Adrian Pietruszka, P. Górecki, A. Skwarek","doi":"10.1109/ISSE57496.2023.10168479","DOIUrl":"https://doi.org/10.1109/ISSE57496.2023.10168479","url":null,"abstract":"The effect of composite solder joint fabrication on the thermal properties of MOSFETs was investigated. On the basis of the reference alloy (SAC0307), reinforced composite solder joints with the addition of titanium oxide nanopowder (TiO2 nanoparticles) were prepared. Reinforced joints differed in the weight percentage of TiO2, ranging from 0.125 to 1.0 wt%. MOSFET transistors in the TO-263 package were soldered to metal core substrates (MCPCB). The transient thermal impedance Zthj-a(t) was measured using an indirect electrical method. Based on the measured values, thermal resistances Rthj-a were determined. It was proven that the thermal resistance Rthj-a depends on TiO2 concentration in the composite solder joint, having a minimum at the level of 0.25 wt%. The research highlights the importance of the soldering technology used in the case of the assembly of MOSFETs devices.","PeriodicalId":373085,"journal":{"name":"2023 46th International Spring Seminar on Electronics Technology (ISSE)","volume":"278 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123464835","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-10DOI: 10.1109/ISSE57496.2023.10168526
Daniel Utsch, Felix Häußler, C. Voigt, Marcel Sippel, J. Franke
Optimizing electronic assemblies for more powerful systems includes the usage of temperature-stable substrates with appropriate functionalization by e.g. printing technologies. Ceramic materials like alumina show very good thermal properties and can be printed using Fused Filament Fabrication. Thus, they can be utilized for 2D and 3D substrates in electronic assemblies. In printed electronics, adhesion of inks to substrates is a crucial issue and especially challenging on ceramic substrates. This work achieved a significant increase in adhesion, using a specifically modified silver-based ink with piezojet-printing, while maintaining good electrical resistance after furnace sintering. Adhesion is measured by pull-off testing, based on ISO 4624. By application of the methods described in this paper, ceramics could become a more viable option for use in functional electronic assemblies.
{"title":"Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics","authors":"Daniel Utsch, Felix Häußler, C. Voigt, Marcel Sippel, J. Franke","doi":"10.1109/ISSE57496.2023.10168526","DOIUrl":"https://doi.org/10.1109/ISSE57496.2023.10168526","url":null,"abstract":"Optimizing electronic assemblies for more powerful systems includes the usage of temperature-stable substrates with appropriate functionalization by e.g. printing technologies. Ceramic materials like alumina show very good thermal properties and can be printed using Fused Filament Fabrication. Thus, they can be utilized for 2D and 3D substrates in electronic assemblies. In printed electronics, adhesion of inks to substrates is a crucial issue and especially challenging on ceramic substrates. This work achieved a significant increase in adhesion, using a specifically modified silver-based ink with piezojet-printing, while maintaining good electrical resistance after furnace sintering. Adhesion is measured by pull-off testing, based on ISO 4624. By application of the methods described in this paper, ceramics could become a more viable option for use in functional electronic assemblies.","PeriodicalId":373085,"journal":{"name":"2023 46th International Spring Seminar on Electronics Technology (ISSE)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128278695","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-10DOI: 10.1109/ISSE57496.2023.10168330
M. Hnatiuc, M. Paun, Domnica Alpetri
In recent years, the concept of the Internet of Things (IoT) has spread in most fields due to the multiple benefits it offers, so it recently started to be used in viticulture, together with artificial intelligence (AI). These two innovative technologies combined with classical methods can lead to a much more efficient and rapid prediction of diseases that may occur in grapevine culture. The present study aims to detect diseases in the period when evolution can still be prevented, by minimizing the favorable environment in which the pathogen can develop. This prevention can be achieved using algorithms for predicting and comparing the data from IoT sensors with the data classically gathered by farmers. The IoT sensors system developed to acquire information about environmental parameters is tested in the Murfatlar vineyard, Romania. Two types of untreated Cabernet and Sauvignon Blanc varieties are used in the experimental study with the aim of reducing the chemical treatment concentration. All the sensors’ data are stored in a cloud. This paper presents an analysis of sensor data consisting of soil parameters such as temperature, humidity, conductivity, nitrogen (N), phosphorus (P), and potassium (K). Big data algorithms using machine learning (ML) for clustering and prediction are tested to identify the vine diseases. The results are detailed at the end of the paper.
{"title":"Acquisition and Analysis of Soil Parameters for Vine Monitoring using the IoT Sensor Network","authors":"M. Hnatiuc, M. Paun, Domnica Alpetri","doi":"10.1109/ISSE57496.2023.10168330","DOIUrl":"https://doi.org/10.1109/ISSE57496.2023.10168330","url":null,"abstract":"In recent years, the concept of the Internet of Things (IoT) has spread in most fields due to the multiple benefits it offers, so it recently started to be used in viticulture, together with artificial intelligence (AI). These two innovative technologies combined with classical methods can lead to a much more efficient and rapid prediction of diseases that may occur in grapevine culture. The present study aims to detect diseases in the period when evolution can still be prevented, by minimizing the favorable environment in which the pathogen can develop. This prevention can be achieved using algorithms for predicting and comparing the data from IoT sensors with the data classically gathered by farmers. The IoT sensors system developed to acquire information about environmental parameters is tested in the Murfatlar vineyard, Romania. Two types of untreated Cabernet and Sauvignon Blanc varieties are used in the experimental study with the aim of reducing the chemical treatment concentration. All the sensors’ data are stored in a cloud. This paper presents an analysis of sensor data consisting of soil parameters such as temperature, humidity, conductivity, nitrogen (N), phosphorus (P), and potassium (K). Big data algorithms using machine learning (ML) for clustering and prediction are tested to identify the vine diseases. The results are detailed at the end of the paper.","PeriodicalId":373085,"journal":{"name":"2023 46th International Spring Seminar on Electronics Technology (ISSE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128839444","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-10DOI: 10.1109/ISSE57496.2023.10168319
I. Bozsóki, A. Géczy, B. Illés
This paper presents a brief overview of numerical modelling approaches from recent years to current soldering applications. Reflow soldering is the primary interconnecting method for surface mount technology (SMT) applications. The solder paste is deposited onto the pads of the printed circuit board (PCB) and the surface mounted components (SMC) are placed onto them. During the reflow process the assembly is heated to melt the solder paste to form solder joints. Successful implementation requires low defect rate, rooting in proper material properties, process parameters and PCB design. Identification and elimination of these causes can be greatly hastened by the aid of simulation based on numerical modelling that grants in depth understanding of many phenomena that are not even measurable directly by conventional methods. The main focus was on the following topics: description of reflow types; summarisation of related partial differential equations (PDE) and their numerical solution methods; heat transfer aspects, temperature distribution characteristics, and thermomechanical stresses during reflow from modelling point of view.
{"title":"Numerical modelling approaches to current reflow soldering applications: a brief overview","authors":"I. Bozsóki, A. Géczy, B. Illés","doi":"10.1109/ISSE57496.2023.10168319","DOIUrl":"https://doi.org/10.1109/ISSE57496.2023.10168319","url":null,"abstract":"This paper presents a brief overview of numerical modelling approaches from recent years to current soldering applications. Reflow soldering is the primary interconnecting method for surface mount technology (SMT) applications. The solder paste is deposited onto the pads of the printed circuit board (PCB) and the surface mounted components (SMC) are placed onto them. During the reflow process the assembly is heated to melt the solder paste to form solder joints. Successful implementation requires low defect rate, rooting in proper material properties, process parameters and PCB design. Identification and elimination of these causes can be greatly hastened by the aid of simulation based on numerical modelling that grants in depth understanding of many phenomena that are not even measurable directly by conventional methods. The main focus was on the following topics: description of reflow types; summarisation of related partial differential equations (PDE) and their numerical solution methods; heat transfer aspects, temperature distribution characteristics, and thermomechanical stresses during reflow from modelling point of view.","PeriodicalId":373085,"journal":{"name":"2023 46th International Spring Seminar on Electronics Technology (ISSE)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115473600","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-10DOI: 10.1109/ISSE57496.2023.10168492
M. Bellaredj, J. Streque, G. Miskovic
The increasing requirements of bandwidth and inputs/outputs (IOs) density for high performance computing (HPC) and artificial intelligence (AI) applications are driving the need for the development of finer copper redistribution layers (RDLs). In this paper, a novel lift-off-based microfabrication process of 2.3 μm thick copper films on organic substrate for below 10 μm ultra-fine pitch interconnects (Line (L)/Space (S) < 10 μm) is presented as a simple and cost-effective alternative to standard semi-additive and modified semi-additive processes (SAPs and mSAPs) widely used in the printed wiring boards (PWB) technology. No seed layer flash etch step is required as for the SAP process and the copper lines surface finish is ultraflat which avoids any extra copper polishing as for overburden copper in the organic damascene process (ODP). As such, the developed process is suitable for both high density RDLs on package for advanced packaging as for integrated RF/mm-wave packages.
{"title":"Ultra-Fine Pitch Interconnects using a Novel Lift-off based Process of Thick Copper Films on Organic Substrate for Advanced Packaging","authors":"M. Bellaredj, J. Streque, G. Miskovic","doi":"10.1109/ISSE57496.2023.10168492","DOIUrl":"https://doi.org/10.1109/ISSE57496.2023.10168492","url":null,"abstract":"The increasing requirements of bandwidth and inputs/outputs (IOs) density for high performance computing (HPC) and artificial intelligence (AI) applications are driving the need for the development of finer copper redistribution layers (RDLs). In this paper, a novel lift-off-based microfabrication process of 2.3 μm thick copper films on organic substrate for below 10 μm ultra-fine pitch interconnects (Line (L)/Space (S) < 10 μm) is presented as a simple and cost-effective alternative to standard semi-additive and modified semi-additive processes (SAPs and mSAPs) widely used in the printed wiring boards (PWB) technology. No seed layer flash etch step is required as for the SAP process and the copper lines surface finish is ultraflat which avoids any extra copper polishing as for overburden copper in the organic damascene process (ODP). As such, the developed process is suitable for both high density RDLs on package for advanced packaging as for integrated RF/mm-wave packages.","PeriodicalId":373085,"journal":{"name":"2023 46th International Spring Seminar on Electronics Technology (ISSE)","volume":"29 13","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131805038","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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